LCMXO2280E-3FTN256I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA |
|---|---|
| Quantity | 926 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-3FTN256I – MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA
The LCMXO2280E-3FTN256I is a MachXO family FPGA optimized for glue logic, bus bridging, bus interfacing, power-up control and general control logic. It combines non-volatile configuration with a LUT-based logic fabric and on-chip memory to deliver an instant-on, reconfigurable single-chip solution.
Designed for industrial applications, this device provides 2,280 logic elements, 28,262 bits of on-chip RAM, up to 211 I/Os, and a 256-ball LBGA package. It supports in-field reconfiguration, low-power sleep modes, and a broad operating temperature range for robust system-level integration.
Key Features
- Logic Fabric — 2,280 logic elements (LUT-based) for implementing glue logic, state machines and control functions.
- On-chip Memory — Total RAM bits: 28,262, with family-level embedded block RAM and distributed RAM to support FIFOs and small buffering tasks.
- I/O Density — 211 available I/Os for wide peripheral and bus connectivity in a single device.
- Non-Volatile, Instant-On Configuration — Single-chip, non-volatile configuration delivers microsecond power-up and eliminates the need for external configuration memory.
- In-Field Reconfiguration (TransFR™) — Supports reconfiguration of SRAM-based logic while the system operates for in-field updates.
- Flexible sysIO™ Buffer — Programmable I/O buffer supports multiple interface standards listed at the family level, enabling versatile board-level signaling.
- Clocking — Up to two analog PLLs per device for clock multiply/divide and phase shifting (family-level capability).
- Low-Power Modes — Sleep mode offering significant static current reduction for power-sensitive applications.
- Package & Mounting — 256-LBGA package (supplier package: 256-FTBGA, 17×17); surface-mount mounting for compact PCB integration.
- Supply & Temperature — Voltage supply range 1.14 V to 1.26 V and operating temperature range −40 °C to 100 °C; industrial grade.
- System-Level Support — Onboard oscillator, JTAG programming and IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support (family-level capabilities).
- RoHS Compliant — Device meets RoHS requirements.
Typical Applications
- Glue Logic and Control — Implement board-level glue logic, interrupts, and state machines where compact, reconfigurable logic is required.
- Bus Bridging and Interfacing — Bridge between buses and handle protocol translation using the device’s high I/O count and flexible I/O buffers.
- Power-Up and System Control — Manage power sequencing, reset control and supervisory tasks with instant-on, non-volatile configuration.
- In-Field Functional Updates — Apply incremental logic updates while the system remains operational using TransFR reconfiguration.
Unique Advantages
- Highly integrated single-chip solution: Non-volatile configuration plus logic and memory removes the need for external configuration devices and simplifies BOM.
- Fast system availability: Instant-on capability enables systems to power up and become functional in microseconds.
- Field update flexibility: TransFR reconfiguration allows in-field logic changes without full system downtime.
- Strong I/O and packaging options: Up to 211 I/Os in a compact 256-ball LBGA (256-FTBGA 17×17 supplier package) supports dense connectivity in constrained board space.
- Industrial robustness: Industrial-grade temperature range (−40 °C to 100 °C) and RoHS compliance support deployment in demanding environments.
- Power and clock management: Sleep mode for reduced static current and up to two PLLs for flexible clocking at the family level.
Why Choose LCMXO2280E-3FTN256I?
The LCMXO2280E-3FTN256I positions itself as a compact, non-volatile FPGA well suited to replace discrete glue logic and small CPLD/FPGA combinations. With 2,280 logic elements, 28,262 bits of on-chip RAM, and 211 I/Os, it provides a balanced mix of logic density, memory and connectivity for industrial control, interfacing and power-management tasks.
Its instant-on behavior, in-field reconfiguration capabilities and industrial temperature rating make it a practical choice for designs that require secure, fast-booting logic with the ability to update functionality in the field while minimizing external components and system complexity.
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