LCMXO2280E-3FTN256I

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA

Quantity 926 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-3FTN256I – MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA

The LCMXO2280E-3FTN256I is a MachXO family FPGA optimized for glue logic, bus bridging, bus interfacing, power-up control and general control logic. It combines non-volatile configuration with a LUT-based logic fabric and on-chip memory to deliver an instant-on, reconfigurable single-chip solution.

Designed for industrial applications, this device provides 2,280 logic elements, 28,262 bits of on-chip RAM, up to 211 I/Os, and a 256-ball LBGA package. It supports in-field reconfiguration, low-power sleep modes, and a broad operating temperature range for robust system-level integration.

Key Features

  • Logic Fabric — 2,280 logic elements (LUT-based) for implementing glue logic, state machines and control functions.
  • On-chip Memory — Total RAM bits: 28,262, with family-level embedded block RAM and distributed RAM to support FIFOs and small buffering tasks.
  • I/O Density — 211 available I/Os for wide peripheral and bus connectivity in a single device.
  • Non-Volatile, Instant-On Configuration — Single-chip, non-volatile configuration delivers microsecond power-up and eliminates the need for external configuration memory.
  • In-Field Reconfiguration (TransFR™) — Supports reconfiguration of SRAM-based logic while the system operates for in-field updates.
  • Flexible sysIO™ Buffer — Programmable I/O buffer supports multiple interface standards listed at the family level, enabling versatile board-level signaling.
  • Clocking — Up to two analog PLLs per device for clock multiply/divide and phase shifting (family-level capability).
  • Low-Power Modes — Sleep mode offering significant static current reduction for power-sensitive applications.
  • Package & Mounting — 256-LBGA package (supplier package: 256-FTBGA, 17×17); surface-mount mounting for compact PCB integration.
  • Supply & Temperature — Voltage supply range 1.14 V to 1.26 V and operating temperature range −40 °C to 100 °C; industrial grade.
  • System-Level Support — Onboard oscillator, JTAG programming and IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support (family-level capabilities).
  • RoHS Compliant — Device meets RoHS requirements.

Typical Applications

  • Glue Logic and Control — Implement board-level glue logic, interrupts, and state machines where compact, reconfigurable logic is required.
  • Bus Bridging and Interfacing — Bridge between buses and handle protocol translation using the device’s high I/O count and flexible I/O buffers.
  • Power-Up and System Control — Manage power sequencing, reset control and supervisory tasks with instant-on, non-volatile configuration.
  • In-Field Functional Updates — Apply incremental logic updates while the system remains operational using TransFR reconfiguration.

Unique Advantages

  • Highly integrated single-chip solution: Non-volatile configuration plus logic and memory removes the need for external configuration devices and simplifies BOM.
  • Fast system availability: Instant-on capability enables systems to power up and become functional in microseconds.
  • Field update flexibility: TransFR reconfiguration allows in-field logic changes without full system downtime.
  • Strong I/O and packaging options: Up to 211 I/Os in a compact 256-ball LBGA (256-FTBGA 17×17 supplier package) supports dense connectivity in constrained board space.
  • Industrial robustness: Industrial-grade temperature range (−40 °C to 100 °C) and RoHS compliance support deployment in demanding environments.
  • Power and clock management: Sleep mode for reduced static current and up to two PLLs for flexible clocking at the family level.

Why Choose LCMXO2280E-3FTN256I?

The LCMXO2280E-3FTN256I positions itself as a compact, non-volatile FPGA well suited to replace discrete glue logic and small CPLD/FPGA combinations. With 2,280 logic elements, 28,262 bits of on-chip RAM, and 211 I/Os, it provides a balanced mix of logic density, memory and connectivity for industrial control, interfacing and power-management tasks.

Its instant-on behavior, in-field reconfiguration capabilities and industrial temperature rating make it a practical choice for designs that require secure, fast-booting logic with the ability to update functionality in the field while minimizing external components and system complexity.

Request a quote or submit a product inquiry to receive pricing and availability information for the LCMXO2280E-3FTN256I.

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