LCMXO2280E-3FT324C

The LCMXO2280E-3FT324C is a MachXO family Field Programmable Gate Array (FPGA) optimized for glue logic, bus bridging, power-up control and general control logic. It combines non-volatile configuration with FPGA-style LUT-based logic to deliver instant-on behavior, flexible I/O and embedded memory in a single surface-mount package.

Built for professional commercial applications, this device integrates 2,280 logic elements, approximately 28,262 bits of on-chip RAM and up to 271 I/Os, providing a high I/O-to-logic density solution for system control, interface bridging and in-field reconfiguration use cases.

Key Features

• Core Logic — 2,280 logic elements for implementing glue logic, state machines and interface bridging within a compact FPGA fabric.
• Embedded Memory — Total on-chip RAM of 28,262 bits for distributed and block memory requirements.
• I/O Density — Up to 271 I/Os available in the 324-ball BGA package to support wide external connectivity and multi-bus designs.
• Non-Volatile, Instant-On — MachXO family non-volatile configuration enables single-chip operation without external configuration memory and instant-on behavior at power-up.
• In-Field Reconfiguration — Supports background programming and TransFR™ reconfiguration for updating logic while the system operates.
• Flexible I/O Standards — Programmable I/O buffers support a wide range of interfaces and voltage standards as defined by the MachXO family.
• Clocking — Up to two analog PLLs per device for clock multiply/divide and phase shifting (family capability).
• Power Supply — Specified operating supply range of 1.14 V to 1.26 V for core power.
• Package & Mounting — 324-ball LBGA surface-mount package (supplier package: 324-FTBGA, 19×19 mm) for high pin-count, compact board designs.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature.
• Standards & Support — Family-level support includes JTAG programming and IEEE boundary-scan; devices support non-volatile and SRAM reconfiguration methods.
• RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

• Interface Bridging — Use the high I/O count and flexible I/O standards to bridge between different buses and voltage domains on a single device.
• Glue Logic — Implement complex glue logic and board-level control functions with 2,280 logic elements and embedded memory.
• Power-Up & Reset Control — Non-volatile instant-on configuration and single-chip operation enable deterministic power-up sequencing and control tasks.
• In-Field Upgrades — Background programming and TransFR reconfiguration allow safe, in-system logic updates without taking the entire product offline.

Unique Advantages

• Single-Chip Non-Volatile Configuration: Eliminates the need for external configuration memory, simplifying bill-of-materials and board layout.
• Instant-On Operation: Powers up immediately to a known configuration, reducing system boot time and improving user experience.
• High I/O-to-Logic Ratio: Up to 271 I/Os matched with 2,280 logic elements supports dense interfacing and mixed-signal front-end designs.
• In-Field Reprogrammability: Background programming and TransFR enable updates and bug fixes while the system remains in operation.
• Flexible Integration: Programmable I/O and family-level PLL support simplify clocking and multi-standard interface implementation.
• Commercial Suitability: Designed for 0 °C to 85 °C environments and RoHS-compliant manufacturing processes.

Why Choose LCMXO2280E-3FT324C?

The LCMXO2280E-3FT324C positions itself as a compact, highly integrated MachXO FPGA option for designers who need non-volatile instant-on behavior, substantial I/O capability and in-field reconfiguration. Its combination of 2,280 logic elements, roughly 28 kb of on-chip RAM and up to 271 I/Os in a 324-ball BGA package makes it suitable for board-level control, protocol bridging and system management tasks in commercial applications.

Choose this device when you require simplified system architecture with single-chip configuration, strong interfacing capability, and the ability to update logic in the field while maintaining a small form factor and RoHS-compliant manufacturing footprint.

Request a quote or submit an inquiry for the LCMXO2280E-3FT324C to get pricing and availability for your next design.