LCMXO2280E-3BN256C

IC FPGA 211 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA

Quantity 1,167 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGA, CSPBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280E-3BN256C – MachXO Field Programmable Gate Array (FPGA), 2,280 Logic Elements, 211 I/O, 256-LFBGA

The LCMXO2280E-3BN256C is a MachXO family FPGA offering non-volatile, instant-on programmable logic in a single surface-mount package. It combines an array of logic blocks and on-chip memory with flexible I/O to address glue logic, bus bridging, power-up control and other system control applications in commercial designs.

This device delivers 2,280 logic elements, 28,262 bits of on-chip RAM and 211 general-purpose I/Os in a 256-ball LFBGA/CABGA package, making it suitable for compact boards that require reconfigurable, low-latency control and interfacing functions.

Key Features

  • Logic Capacity — 2,280 logic elements and 285 logic blocks (CLBs) for implementing glue logic, control state machines and moderate-density combinational/sequential logic.
  • On-Chip Memory — 28,262 bits of total embedded RAM for small buffers, FIFOs or state storage without external memory.
  • I/O Density and Flexibility — 211 I/Os to support broad system interfacing in a single device and simplify board-level routing.
  • Non‑volatile, Instant‑On Architecture — Single-chip non-volatile configuration with instant-on power-up in microseconds and no external configuration memory required.
  • In-System Reconfiguration — Supports reconfiguration of SRAM-based logic in milliseconds and background programming of non-volatile memory for field updates.
  • Low-Power Modes — Sleep mode provides significant static current reduction for power-sensitive designs.
  • Programmable I/O Standards — Flexible sysIO buffer architecture (family-level capability) for a range of interfaces and I/O standards.
  • Clocking — Family supports up to two analog PLLs for clock multiply/divide and phase shifting (family-level feature documented in MachXO datasheet).
  • Package & Mounting — 256‑ball LFBGA / caBGA (14×14 mm) surface-mount package for compact PCB integration; supplier device package listed as 256‑CABGA.
  • Power and Temperature — Voltage supply range 1.14 V to 1.26 V and commercial operating temperature 0 °C to 85 °C.
  • Compliance — RoHS‑compliant packaging.

Typical Applications

  • Board Glue Logic — Consolidate discrete glue logic and small PLD functions into a single reprogrammable device to reduce BOM and simplify routing.
  • Bus Bridging and Interfacing — Implement bus adapters, level translation and protocol bridging using the device’s high I/O count and flexible I/O buffers.
  • Power-Up and System Control — Use instant-on configuration and non-volatile storage for deterministic power-up sequences and supervisory control.
  • Control and Sequencing — Implement finite-state machines, control logic and small FIFOs using the embedded RAM and logic elements.

Unique Advantages

  • Single‑Chip Non‑Volatile Solution: Eliminates the need for external configuration memory while enabling instant-on system behavior.
  • High I/O-to-Logic Ratio: 211 I/Os with 2,280 logic elements supports dense interfacing without overprovisioning logic resources.
  • Field Reconfiguration: Background programming and fast SRAM reconfiguration enable in-field updates and iterative development.
  • Low Static Power Option: Sleep mode enables substantial static current reduction for energy-conscious applications.
  • Compact, Surface-Mount Packaging: 256-ball LFBGA/CABGA in a 14×14 mm footprint fits space-constrained PCBs while providing high I/O availability.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial deployments.

Why Choose LCMXO2280E-3BN256C?

The LCMXO2280E-3BN256C positions itself as a compact, non-volatile FPGA ideal for designers who need instant-on, reconfigurable logic and significant I/O in a single surface-mount package. Its combination of 2,280 logic elements, on-chip RAM and 211 I/Os makes it well suited for board-level interfacing, system control, and glue logic where reducing component count and enabling field updates are priorities.

Backed by documented MachXO family capabilities—such as in-system reconfiguration, sleep mode, and PLL-based clocking—this device offers a practical balance of integration, flexibility and predictable commercial-grade operation for a wide range of embedded designs.

Request a quote or submit an inquiry to evaluate the LCMXO2280E-3BN256C for your next design and obtain pricing and availability information.

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