LCMXO2280E-3BN256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,167 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-3BN256C – MachXO Field Programmable Gate Array (FPGA), 2,280 Logic Elements, 211 I/O, 256-LFBGA
The LCMXO2280E-3BN256C is a MachXO family FPGA offering non-volatile, instant-on programmable logic in a single surface-mount package. It combines an array of logic blocks and on-chip memory with flexible I/O to address glue logic, bus bridging, power-up control and other system control applications in commercial designs.
This device delivers 2,280 logic elements, 28,262 bits of on-chip RAM and 211 general-purpose I/Os in a 256-ball LFBGA/CABGA package, making it suitable for compact boards that require reconfigurable, low-latency control and interfacing functions.
Key Features
- Logic Capacity — 2,280 logic elements and 285 logic blocks (CLBs) for implementing glue logic, control state machines and moderate-density combinational/sequential logic.
- On-Chip Memory — 28,262 bits of total embedded RAM for small buffers, FIFOs or state storage without external memory.
- I/O Density and Flexibility — 211 I/Os to support broad system interfacing in a single device and simplify board-level routing.
- Non‑volatile, Instant‑On Architecture — Single-chip non-volatile configuration with instant-on power-up in microseconds and no external configuration memory required.
- In-System Reconfiguration — Supports reconfiguration of SRAM-based logic in milliseconds and background programming of non-volatile memory for field updates.
- Low-Power Modes — Sleep mode provides significant static current reduction for power-sensitive designs.
- Programmable I/O Standards — Flexible sysIO buffer architecture (family-level capability) for a range of interfaces and I/O standards.
- Clocking — Family supports up to two analog PLLs for clock multiply/divide and phase shifting (family-level feature documented in MachXO datasheet).
- Package & Mounting — 256‑ball LFBGA / caBGA (14×14 mm) surface-mount package for compact PCB integration; supplier device package listed as 256‑CABGA.
- Power and Temperature — Voltage supply range 1.14 V to 1.26 V and commercial operating temperature 0 °C to 85 °C.
- Compliance — RoHS‑compliant packaging.
Typical Applications
- Board Glue Logic — Consolidate discrete glue logic and small PLD functions into a single reprogrammable device to reduce BOM and simplify routing.
- Bus Bridging and Interfacing — Implement bus adapters, level translation and protocol bridging using the device’s high I/O count and flexible I/O buffers.
- Power-Up and System Control — Use instant-on configuration and non-volatile storage for deterministic power-up sequences and supervisory control.
- Control and Sequencing — Implement finite-state machines, control logic and small FIFOs using the embedded RAM and logic elements.
Unique Advantages
- Single‑Chip Non‑Volatile Solution: Eliminates the need for external configuration memory while enabling instant-on system behavior.
- High I/O-to-Logic Ratio: 211 I/Os with 2,280 logic elements supports dense interfacing without overprovisioning logic resources.
- Field Reconfiguration: Background programming and fast SRAM reconfiguration enable in-field updates and iterative development.
- Low Static Power Option: Sleep mode enables substantial static current reduction for energy-conscious applications.
- Compact, Surface-Mount Packaging: 256-ball LFBGA/CABGA in a 14×14 mm footprint fits space-constrained PCBs while providing high I/O availability.
- Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial deployments.
Why Choose LCMXO2280E-3BN256C?
The LCMXO2280E-3BN256C positions itself as a compact, non-volatile FPGA ideal for designers who need instant-on, reconfigurable logic and significant I/O in a single surface-mount package. Its combination of 2,280 logic elements, on-chip RAM and 211 I/Os makes it well suited for board-level interfacing, system control, and glue logic where reducing component count and enabling field updates are priorities.
Backed by documented MachXO family capabilities—such as in-system reconfiguration, sleep mode, and PLL-based clocking—this device offers a practical balance of integration, flexibility and predictable commercial-grade operation for a wide range of embedded designs.
Request a quote or submit an inquiry to evaluate the LCMXO2280E-3BN256C for your next design and obtain pricing and availability information.

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