LCMXO2280E-3B256I

The LCMXO2280E-3B256I is a MachXO family FPGA from Lattice Semiconductor Corporation offering non-volatile, infinitely reconfigurable logic in a single surface-mount package. It combines instant-on single-chip configuration with a high I/O count and on-chip memory, making it suited for control, interfacing and glue-logic roles in industrial systems.

Built for industrial environments, the device provides 2280 logic elements, 211 I/Os, approximately 28.3 Kbits of on-chip RAM, and operates across a supply range of 1.14 V to 1.26 V and an ambient temperature range of -40 °C to 100 °C. The device is supplied in a 256-ball LFBGA / caBGA package (14×14 mm) and is RoHS compliant.

Key Features

• Core Logic — 2,280 logic elements and 285 logic blocks provide flexible, LUT-based programmable logic for glue logic, control and bridging functions.
• On‑Chip Memory — Approximately 28,262 bits (≈27.6 Kbits) of embedded RAM, including embedded block RAM resources, for buffering, state storage and small FIFOs.
• I/O and Interfaces — 211 general-purpose I/Os deliver high pin-to-logic density for bus interfacing and signal routing without external glue components.
• Non‑volatile Instant‑on — Single-chip, non-volatile configuration enables microsecond power-up and eliminates the need for external configuration memory.
• Reconfiguration and Sleep Modes — Supports in-field reconfiguration and background programming of non-volatile memory; includes sleep mode for significant static current reduction.
• Clocking — MachXO family devices provide up to two analog PLLs (family-level detail) for flexible clock multiply/divide and phase shifting.
• Package and Mounting — 256-ball caBGA / LFBGA (14×14 mm) surface-mount package for compact board integration; supplier device package listed as 256-CABGA (14×14).
• Industrial Operating Range — Specified operating temperature from -40 °C to 100 °C and RoHS-compliant packaging for deployment in industrial applications.

Typical Applications

• Glue Logic and System Control — Implement control paths, handshakes and small state machines to reduce discrete logic count and simplify board design.
• Bus Bridging and Interfacing — Bridge and translate between bus standards or custom interfaces using the device’s high I/O count and programmable logic.
• Power‑Up and Sequencing Control — Single-chip instant-on capability and non-volatile configuration make it suitable for power-up supervision and startup sequencing.
• In‑field Logic Updates — Support for reconfiguration and background programming enables firmware updates and feature changes without hardware swaps.

Unique Advantages

• Instant-on, Single-chip Configuration: Non-volatile architecture powers up in microseconds without external configuration memory, simplifying BOM and system design.
• High I/O-to-Logic Density: 211 I/Os combined with 2,280 logic elements enable compact implementations of complex interfacing and glue logic on a single device.
• On-chip Memory and Clocking: Approximately 28.3 Kbits of embedded RAM and family-level support for up to two PLLs provide local buffering and flexible clock management.
• Industrial Temperature Range: Rated for -40 °C to 100 °C, allowing deployment in demanding industrial environments.
• Reconfigurable and Secure: Background programming and non-volatile storage enable secure, in-field updates and design protection without external bitstreams.
• Compact, Surface‑Mount Package: 256-ball caBGA/LFBGA packaging delivers a small form factor for space-constrained PCBs while preserving high pin count.

Why Choose LCMXO2280E-3B256I?

The LCMXO2280E-3B256I positions itself as a highly integrated, industrial-grade MachXO FPGA offering instant-on, non-volatile configuration combined with abundant I/O and on-chip memory. Its combination of 2,280 logic elements, ~28.3 Kbits of RAM and 211 I/Os in a 256-ball BGA package makes it a practical choice for engineers consolidating discrete logic, implementing bus interfaces, or adding in-field reconfigurable control without external configuration devices.

Designed for applications that require reliable operation across extended temperature ranges and a compact board footprint, this device benefits designs that need scalable logic density, reconfigurable features, and simplified supply-chain integration backed by the MachXO family architecture.

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