LCMXO2280E-3B256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,550 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280E-3B256C – MachXO FPGA, 2280 logic elements, 256-LFBGA
The LCMXO2280E-3B256C is a MachXO family Field Programmable Gate Array (FPGA) from Lattice Semiconductor designed for glue-logic, control and interface duties where non-volatile, instant-on operation and flexible I/O are valuable. This surface-mount device integrates 2,280 logic elements, on-chip RAM, and up to 211 I/Os in a 256-ball LFBGA/CSPBGA package for compact system designs.
Optimized for applications requiring rapid power-up and field reconfiguration, the device combines non-volatile configuration, flexible I/O buffering and embedded memory to simplify board-level design and reduce external components.
Key Features
- Core Logic — 2,280 logic elements and 285 logic blocks provide the programmable fabric for glue logic, control paths and protocol bridging.
- On-chip Memory — 28,262 bits of total on-chip RAM enable local data buffering and small embedded data structures.
- I/O Density — Up to 211 I/Os in the 256-ball package, supporting high pin-to-logic ratios for interface-rich designs.
- Non-volatile Instant-on — MachXO family features non-volatile configuration for fast, single-chip power-up without external configuration memory.
- Flexible I/O Buffering (family-level) — Family-level programmable sysIO buffers support a wide range of interfaces (including multiple LVCMOS levels, LVTTL, PCI, LVDS and other differential standards), enabling versatile connectivity options.
- In-field Reconfiguration (family-level) — Supports background programming and TransFR™ reconfiguration for in-field logic updates while the system operates.
- Power — Device core supply specified at 1.14 V to 1.26 V; includes family-level sleep mode capability to reduce static current significantly.
- Package & Mounting — 256-LFBGA (supplier package: 256-CABGA 14×14 mm) surface-mount package; lead free / RoHS compliant.
- Operating Conditions — Commercial grade: 0 °C to 85 °C operating temperature range.
- Standards & Tools (family-level) — Family supports IEEE 1149.1 boundary scan and in-system programming; MachXO devices are supported by the vendor’s ispLEVER design tools.
Typical Applications
- Glue Logic and Board-Level Control — Implement mission-critical control paths and power-up sequencing without external configuration memory thanks to non-volatile instant-on capability.
- Bus Bridging and Protocol Conversion — High I/O count and flexible sysIO buffering make the part suitable for bridging between different busses or signal standards.
- Interface Concentration — Use the on-chip RAM and dense I/O to aggregate and buffer signals from sensors, peripherals or front-end modules.
- Field-Updatable Logic — In-field reconfiguration enables updating glue logic and control functions in deployed systems without taking the entire system offline.
Unique Advantages
- Non-volatile, single-chip configuration: Eliminates the need for external configuration memory and enables rapid microsecond-scale power-up.
- High I/O-to-logic ratio: 211 I/Os paired with 2,280 logic elements support interface-dense designs without large, high-pin-count FPGAs.
- On-chip RAM for local buffering: 28,262 bits of embedded RAM reduce dependence on external memory for small buffering and FIFO needs.
- Field updates and background programming: Family-level TransFR and background programming support in-field logic changes while maintaining system operation.
- Compact, RoHS-compliant packaging: 256-ball LFBGA (256-CABGA 14×14 mm) surface-mount package simplifies PCB integration in space-constrained designs.
- Commercial temperature and supply support: Designed for 0 °C to 85 °C operation with a core supply range of 1.14 V to 1.26 V to match common platform power domains.
Why Choose LCMXO2280E-3B256C?
The LCMXO2280E-3B256C positions itself as a compact, non-volatile FPGA tailored for designers who need instant-on, field-updatable logic with strong I/O capability. Its combination of 2,280 logic elements, 211 I/Os and on-chip RAM delivers the necessary resources for glue logic, protocol adaptation and interface concentration while reducing BOM complexity by removing external configuration memory.
Backed by MachXO family-level features and vendor design tools, this part is suited to commercial applications requiring reliable power-up behavior, flexible I/O and in-field reprogrammability, providing a scalable platform for evolving system requirements.
Request a quote or submit an inquiry to obtain pricing and availability for the LCMXO2280E-3B256C and integrate this MachXO FPGA into your next design.
