LCMXO2280C-5T100C

IC FPGA 73 I/O 100TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 73 28262 2280 100-LQFP

Quantity 333 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O73Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-5T100C – MachXO FPGA, 2,280 LUTs, 73 I/Os, 100-pin (14×14 mm)

The LCMXO2280C-5T100C is a MachXO family field programmable gate array (FPGA) optimized for glue logic, bus interfacing and control applications. It delivers 2,280 LUT-based logic elements, approximately 28 Kbits of on‑chip RAM, and 73 user I/Os in a 100‑pin 14×14 mm package for compact, single‑chip integration.

Designed as a non‑volatile, instant‑on device with in-field reconfiguration capabilities and sleep‑mode power reduction, this commercial‑grade FPGA targets applications that require fast startup, flexible I/O support and on‑chip logic/memory for system control and signal interfacing.

Key Features

  • Core Logic – 2,280 LUTs (logic elements) for implementing glue logic, state machines and peripheral control functions.
  • On‑chip Memory – Approximately 28 Kbits of embedded RAM to support small FIFOs, buffering and temporary data storage directly on the device.
  • I/O Density & Flexibility – 73 I/Os with programmable sysIO buffer options to support common interface standards and flexible signaling.
  • Non‑volatile Instant‑On – Single‑chip, non‑volatile configuration that powers up in microseconds without external configuration memory.
  • In‑field Reconfiguration – Reconfigure SRAM-based logic in milliseconds and support background programming of non‑volatile memory for field updates.
  • Low‑Power Modes – Sleep mode support for substantial static current reduction when full operation is not required.
  • Clocking – Up to two analog PLLs per device for clock multiply/divide and phase adjustment.
  • System Support – Boundary scan (IEEE 1149.1), on‑board oscillator and IEEE 1532 in‑system programming support.
  • Package & Supply – 100‑pin LQFP/TQFP (14×14 mm) surface‑mount package; voltage supply range 1.71 V to 3.465 V; RoHS compliant.
  • Commercial Temperature Grade – Operating range 0 °C to 85 °C suitable for commercial applications.

Typical Applications

  • Glue Logic – Replace discrete logic and simplify PCB routing by consolidating interconnect and control functions into a single programmable device.
  • Bus Bridging and Interfacing – Implement custom bus conversions, level translation and protocol adapters using the device’s flexible I/O and internal logic.
  • Power‑Up and Reset Control – Manage system sequencing and deterministic startup behavior leveraging instant‑on configuration and integrated control logic.
  • Embedded Control Logic – Integrate state machines, peripheral controllers and small buffer/FIFO structures using on‑chip RAM and LUT resources.

Unique Advantages

  • Instant‑on Non‑volatile Configuration: Eliminates the need for external configuration memory and enables microsecond startup for faster system availability.
  • Single‑chip Integration: Combines programmable logic, embedded RAM and flexible I/O in a compact 100‑pin package to reduce BOM and board space.
  • Field Update Capability: Support for background programming and in‑field reconfiguration simplifies maintenance and feature upgrades without board swaps.
  • Flexible Clocking: Up to two PLLs allow local clock generation and conditioning for timing-critical logic and interface support.
  • Power Efficiency: Sleep mode enables significant static current reduction for power‑sensitive designs.
  • Ready for Commercial Designs: RoHS compliant and rated for 0 °C to 85 °C operation, matching many mainstream embedded and equipment use cases.

Why Choose LCMXO2280C-5T100C?

The LCMXO2280C-5T100C positions itself as a compact, non‑volatile FPGA choice for designers who need reliable glue logic, interface bridging and on‑board control without adding external configuration components. Its 2,280 LUTs, ~28 Kbits of on‑chip RAM and 73 I/Os in a 100‑pin package make it well suited for space‑constrained PCBs and systems requiring fast startup and field reprogrammability.

For teams focused on reducing BOM count, enabling quick system boot, and supporting in‑field updates, this MachXO device provides a balance of logic density, I/O flexibility and system features backed by the MachXO family architecture and toolflow support.

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