LCMXO2280C-5FTN256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA |
|---|---|
| Quantity | 103 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-5FTN256C – MachXO Field Programmable Gate Array (FPGA) IC
The LCMXO2280C-5FTN256C is a MachXO family FPGA offering a non-volatile, reconfigurable logic platform with instant-on capability and integrated I/O. It combines approximately 2,280 logic elements with on-chip RAM and high pin-count I/O to address glue logic, bus interfacing, power‑up control and similar control tasks in commercial applications.
Built as a single-chip solution with background and in-field reconfiguration options, this device targets designs that require fast startup, flexible I/O standards, and compact board-level integration in a 256-ball BGA package.
Key Features
- Non-volatile, Reconfigurable Core Instant-on operation with single-chip non-volatile configuration; SRAM-based logic can be reconfigured in milliseconds and non-volatile memory is programmable via JTAG.
- Logic Density Approximately 2,280 logic elements (LUT4s) suitable for glue logic, control logic and moderate-density implementation needs.
- Embedded Memory Total on-chip RAM of 28,262 bits for distributed and block memory requirements.
- I/O Flexibility 211 user I/Os with programmable sysIO buffer support for multiple interface standards including LVCMOS (1.2–3.3V), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
- Clocking Up to two analog PLLs for clock multiply/divide and phase shifting.
- Low-Power Modes Sleep mode available to reduce static current consumption (up to 100× reduction reported in datasheet).
- Reconfiguration and Security TransFR™ in-field reconfiguration supports logic updates while the system operates; no external configuration memory required enhances design security.
- Package and Operating Range Surface-mount 256-ball ftBGA (17×17 mm) / 256-LBGA packaging, commercial grade with operating temperature 0 °C to 85 °C and supply range 1.71 V to 3.465 V.
- System Support Onboard oscillator, boundary-scan (IEEE 1149.1) and IEEE 1532 in-system programming compatibility as documented in the MachXO family datasheet.
Typical Applications
- Glue Logic and Board-Level Control Implement address decoding, finite-state machines and peripheral control where a compact, non-volatile logic device is required.
- Bus Bridging and Interfacing Bridge or translate between different bus protocols and voltage domains using the device’s flexible I/O standards and high I/O count.
- Power-Up and Reset Control Manage power sequencing and reset logic with instant-on behavior and single-chip configuration for simplified BOM.
- In-Field Logic Updates Apply live logic updates and background reprogramming in systems that require maintenance or feature upgrades without full system downtime.
Unique Advantages
- Instant-on, Single-Chip Configuration: Non-volatile configuration eliminates the need for external configuration memory and enables microsecond power-up behavior.
- High I/O-to-Logic Ratio: 211 I/Os combined with ~2,280 logic elements allow complex interfacing without additional peripheral devices.
- Flexible Interface Support: Programmable I/O buffers support a wide range of signaling standards, easing integration with mixed-voltage systems.
- In-Field and Background Reprogramming: TransFR™ reconfiguration and JTAG-programmable non-volatile memory permit live updates and reduced field service complexity.
- On-Chip Memory and Clocking: Approximately 28,262 bits of on-chip RAM and up to two PLLs provide local storage and clock management within the device footprint.
- Low-Power Standby: Sleep mode offers substantial static current reduction for power-sensitive commercial applications.
Why Choose LCMXO2280C-5FTN256C?
The LCMXO2280C-5FTN256C positions itself as a versatile, non-volatile FPGA for commercial designs that need instant-on behavior, a mix of dense I/O and moderate logic capacity, and in-field reconfigurability. Its single-chip architecture and programmable I/O help reduce BOM and board complexity while supporting a broad set of interface standards.
This device is well suited to engineers developing board-level control, bus bridging, power sequencing and systems that require live firmware updates. Design integration is further supported by the MachXO family ecosystem and documented tool support referenced in the datasheet.
If you would like pricing information, availability or to request a quote for LCMXO2280C-5FTN256C, please submit a request or contact sales for a tailored quote.