LCMXO2280C-5BN256C

IC FPGA 211 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA

Quantity 740 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGA, CSPBGANumber of I/O211Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-5BN256C – MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA

The LCMXO2280C-5BN256C is a MachXO family FPGA offering single-chip, non-volatile logic with instant-on capability and flexible I/O. With 2,280 logic elements, approximately 28,262 bits of on‑chip RAM and 211 I/Os, it targets glue-logic, bus interfacing, power-up control and general control applications where fast start-up, design security and in-field reconfiguration are valuable.

Architected for high I/O-to-logic density and system-level flexibility, the device supports background and in-field reprogramming, low-power sleep modes and multiple I/O standards to simplify integration across a wide range of commercial electronic designs.

Key Features

  • Core Logic  2,280 logic elements provide the programmable fabric for glue logic, control and interface tasks.
  • On‑Chip Memory  Approximately 28,262 bits of embedded and distributed RAM support FIFOs and small data buffers for system logic.
  • I/O Density & Flexibility  211 I/Os with a programmable sysIO™ buffer that supports multiple signaling standards listed in the MachXO family datasheet, enabling versatile board-level interfacing.
  • Non‑volatile, Instant‑On  Single-chip non‑volatile architecture enables instant-on power-up and removes the need for external configuration memory.
  • In‑Field Reconfiguration  TransFR™ reconfiguration and JTAG-programmable non‑volatile/SRAM logic allow background and in‑field updates without external storage.
  • Power & Low Power Modes  Sleep mode supports significant static current reduction (up to 100× as described in the MachXO family documentation), and the device operates across the specified supply range of 1.71 V to 3.465 V.
  • Clocking  Up to two analog PLLs provide clock multiply/divide and phase-shifting functionality for timing flexibility.
  • Packaging & Temperature  Available in a 256-ball LFBGA / caBGA package (256-CABGA, 14×14 mm) and rated for commercial operation from 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant packaging.

Typical Applications

  • System Glue Logic  Replace discrete glue components by consolidating control and interface functions into a single programmable device with fast startup.
  • Bus Bridging & Interfacing  Use the high I/O count and flexible I/O standards to implement custom bus bridges and protocol adapters.
  • Power‑Up & Reset Control  Implement deterministic power sequencing and control logic that benefits from instant-on behavior and non‑volatile configuration.
  • Field‑Updatable Control Logic  Perform in-field updates to control algorithms or interfaces using background programming and TransFR™ reconfiguration.

Unique Advantages

  • Single‑Chip Non‑Volatile Design: Eliminates external configuration memory and enables microsecond-level instant-on for faster system startup.
  • In‑Field Reconfigurability: Background programming and TransFR™ allow logic updates while systems remain operational, reducing service downtime.
  • Low‑Power Sleep Mode: Significant reduction in static current for power-sensitive commercial applications.
  • High I/O-to-Logic Density: 211 I/Os paired with 2,280 logic elements simplifies board design where many signals must be managed with compact FPGA fabric.
  • Flexible Clocking and Memory: Up to two PLLs plus approximately 28.3 Kbits of on‑chip RAM support complex timing and buffering needs without external components.
  • Commercial Temperature & RoHS Compliance: Designed for commercial-grade environments (0 °C to 85 °C) with RoHS‑compliant packaging.

Why Choose LCMXO2280C-5BN256C?

The LCMXO2280C-5BN256C is positioned for engineers seeking a compact, non‑volatile FPGA that balances logic capacity, on‑chip memory and a high number of I/Os. Its instant-on behavior, in-field reconfiguration options and programmable I/O flexibility make it well suited for system glue logic, interface bridging and control tasks in commercial products.

Supported by the MachXO family architecture and development flow described in the MachXO datasheet and ispLEVER design tools, this device offers scalable design options and the ability to update designs in the field—helping reduce BOM complexity and accelerate system-level integration.

Request a quote or submit an inquiry for pricing and availability to evaluate the LCMXO2280C-5BN256C for your next design.

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