LCMXO2280C-5FT256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA |
|---|---|
| Quantity | 1,792 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-5FT256C – MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA
The LCMXO2280C-5FT256C is a MachXO family FPGA optimized for control, glue logic and interface tasks. It combines non-volatile configuration with FPGA-style logic and embedded memory to deliver fast start-up and in-field reconfiguration for commercial applications.
This device provides 2,280 logic elements, 211 I/Os and approximately 28 Kbits of on-chip RAM in a 256-ball BGA package, with a supply range of 1.71 V to 3.465 V and a commercial operating range of 0 °C to 85 °C.
Key Features
- Core Logic 2,280 logic elements and an array of logic blocks support flexible implementation of glue logic and control functions.
- Embedded Memory Total on-chip RAM of 28,262 bits (approximately 27.6 Kbits) for distributed and block memory needs.
- I/O Capacity & Flexibility 211 I/O pins with programmable sysIO buffer options; family-level support includes LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS signaling modes.
- Non-volatile, Instant-on Configuration Single-chip, non-volatile configuration enables instant-on startup without external configuration memory and supports reconfiguration through JTAG.
- Reconfiguration & Sleep In-field reconfiguration capabilities (TransFR™) and a Sleep Mode that can reduce static current substantially for low-power standby.
- Analog PLLs and Clocking Family supports up to two analog PLLs for clock multiply/divide and phase shift functions.
- Package & Mounting 256-ball LBGA (supplier package: 256-FTBGA 17×17); surface-mount device suitable for compact PCB layouts.
- Commercial Grade & Compliance Commercial grade device with operating range 0 °C to 85 °C and RoHS-compliant packaging.
Typical Applications
- Glue Logic and System Control Implement board-level control, multiplexing and glue logic where fast start-up and reconfigurability reduce design complexity.
- Bus Bridging and Interfacing Handle bus translation, protocol bridging and I/O adaptation across mixed-voltage domains using the device’s programmable I/O.
- Power-up and Sequencing Control Use non-volatile instant-on behavior for deterministic power-up sequencing and supervisory control functions.
- Field Upgrades and In-System Reconfiguration Support in-field logic updates and background programming through JTAG and TransFR™ without requiring external configuration memory.
Unique Advantages
- Instant-on capability: Non-volatile single-chip configuration removes the need for external boot memory and delivers immediate availability after power-up.
- High I/O density: 211 I/Os in a 256-ball package enable complex interfacing while keeping PCB footprint compact.
- Flexible power support: Operates across a wide supply range (1.71 V to 3.465 V), accommodating mixed-voltage system designs.
- Reconfigurable in-field: TransFR™ reconfiguration and JTAG-programmable non-volatile memory simplify firmware updates and iterative design changes.
- Low-power standby: Sleep Mode provides a path to significantly reduce static current during idle periods.
- Commercial-grade reliability: Specified for 0 °C to 85 °C operation with RoHS-compliant packaging for standard commercial deployments.
Why Choose LCMXO2280C-5FT256C?
The LCMXO2280C-5FT256C positions itself as a practical, integrated solution for applications that require fast start-up, flexible I/O and on-chip memory in a compact BGA package. With 2,280 logic elements, approximately 28 Kbits of RAM and 211 I/Os, it is suited to system glue logic, bus interfacing and control tasks where reconfigurability and compact BOM are important.
Designers benefit from non-volatile, single-chip configuration, in-field update capabilities, programmable I/O signaling and up to two PLLs for clock management. The device’s commercial temperature rating and RoHS compliance make it appropriate for standard electronics products and embedded systems where those specifications meet project requirements.
Request a quote or submit an inquiry to purchase the LCMXO2280C-5FT256C and include your desired quantity and delivery timeline for a prompt response.

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