LCMXO2280C-5M132C

IC FPGA 101 I/O 132CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 101 28262 2280 132-LFBGA, CSPBGA

Quantity 1,634 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O101Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-5M132C – MachXO FPGA, 2,280 logic elements, 101 I/Os, 132-CSPBGA

The LCMXO2280C-5M132C is a MachXO family FPGA from Lattice Semiconductor, offering non‑volatile, instant‑on configuration and a balance of logic density, on‑chip memory, and flexible I/O in a compact 132‑ball CSPBGA package. It is optimized for glue logic, bus bridging/interfacing, power‑up control and general control logic in commercial applications.

Built around an array of logic blocks with dedicated embedded memory and programmable I/O, this device provides single‑chip configuration (no external configuration memory required), background reprogramming, and support for a wide range of supply voltages and I/O standards to simplify system integration.

Key Features

  • Logic Capacity — 2,280 logic elements and 285 logic blocks for implementing glue logic, control paths and moderate FPGA functions.
  • On‑chip Memory — 28,262 total RAM bits of on‑chip RAM (approximately 27.6 Kbits of embedded block RAM as indicated for the MachXO2280 family) with additional distributed RAM resources.
  • I/O Count and Flexibility — 101 I/Os in the 132‑ball CSPBGA package with programmable sysIO buffer support for multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS.
  • Programmable Clocking — Up to two analog PLLs per device for clock multiply, divide and phase shifting (MachXO family capability).
  • Non‑volatile, Instant‑On Configuration — Single‑chip non‑volatile configuration enables power‑up in microseconds and eliminates external configuration memory and bitstream interception risk.
  • In‑Field Reconfiguration — Support for background programming and TransFR™ reconfiguration enables in‑field logic updates while the system operates; JTAG programmable.
  • Power and Temperature — Operates from 1.71 V to 3.465 V and rated for commercial temperature operation from 0 °C to 85 °C; includes a sleep mode for significant static current reduction.
  • Package and Compliance — 132‑LFBGA (CSPBGA, 8×8 mm) package; lead free/RoHS compliant.

Typical Applications

  • Glue Logic and System Control — Implement board‑level glue logic, reset sequencing and power‑up control with on‑chip non‑volatile configuration for reliable startup.
  • Bus Bridging and Interfacing — Use the programmable I/O and multiple interface standards to bridge buses and adapt signal levels between system domains.
  • User Interface and Peripheral Control — Manage buttons, indicators, sensor interfaces and peripheral control paths with compact logic and embedded RAM for small to medium control tasks.
  • Field‑Upgradable Logic — Enable in‑field feature updates and bug fixes using background programming and TransFR reconfiguration while system operation continues.

Unique Advantages

  • Single‑Chip, Secure Configuration: Non‑volatile on‑chip configuration removes the need for external configuration memory and reduces security exposure to bitstream interception.
  • Instant‑On System Behavior: Power‑up in microseconds supports fast startup sequences and simplifies system initialization.
  • Flexible I/O and Multi‑Voltage Support: Programmable sysIO and support across a wide supply range (1.71 V–3.465 V) reduce level‑shifting complexity and BOM count.
  • Field Reprogrammability: Background programming and TransFR™ enable updates and fixes without taking the system offline, improving maintainability.
  • Compact Package with Substantial Resources: 132‑ball CSPBGA (8×8 mm) combines a small footprint with 2,280 logic elements, ~28.3 Kbits of on‑chip RAM and 101 I/Os for space‑constrained designs.
  • Low Power Modes: Sleep mode provides significant static current reduction for power‑sensitive commercial applications.

Why Choose LCMXO2280C-5M132C?

The LCMXO2280C-5M132C positions itself as a compact, non‑volatile FPGA solution for commercial designs that require instant‑on behavior, flexible I/O and the ability to update logic in the field. With 2,280 logic elements, substantial embedded RAM, up to two PLLs and 101 I/Os in a 132‑ball CSPBGA, it balances integration and board‑space efficiency for glue logic, bus interfacing and control‑oriented functions.

Designed for commercial temperature operation and RoHS compliance, the device is a practical choice for product lines that need secure configuration, reduced BOM complexity and the ability to deploy updates without full system downtime. It is well suited for designers and procurement teams seeking a single‑chip programmable logic solution with on‑chip non‑volatile memory and flexible I/O support.

Request a quote or submit an RFQ today to receive pricing and availability information for the LCMXO2280C-5M132C.

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