LCMXO2280C-5FTN324C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA |
|---|---|
| Quantity | 96 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FTBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LBGA | Number of I/O | 271 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-5FTN324C – MachXO FPGA, 2280 logic elements, 271 I/Os, 324‑LBGA
The LCMXO2280C-5FTN324C is a MachXO family Field Programmable Gate Array (FPGA) optimized for commercial embedded and system-control applications. It combines non-volatile, instantly available logic with a high I/O-to-logic density architecture to address glue logic, bus bridging, interface control and other system-level control functions.
With 2280 logic elements, approximately 28,262 bits of on‑chip RAM, flexible I/O options and support for in-field reconfiguration, this device delivers compact integration and system responsiveness for space-constrained, performance-sensitive designs.
Key Features
- Core Logic — 2280 logic elements for implementing glue logic, control functions and small-to-medium FPGA tasks.
- On‑Chip Memory — Total RAM: 28,262 bits (≈27.6 Kbits) of embedded memory to support FIFOs, small buffers and state storage.
- I/O Density — Up to 271 programmable I/Os in the 324‑ball LBGA package to support wide peripheral and bus interfacing needs.
- Flexible I/O Buffer Support — Programmable I/O buffers support a wide range of interface standards as described in the MachXO family documentation.
- Instant‑On & Non‑Volatile — Single-chip, non-volatile architecture delivers instant-on behavior with no external configuration memory required.
- Reconfiguration & Programming — In-field reconfiguration capability and JTAG-based programming, including background programming of non-volatile memory.
- Low‑Power Modes — Sleep mode enables significant static current reduction to support power-sensitive applications.
- Clocking — Supports up to two PLLs for clock multiply/divide and phase shifting (per MachXO family data).
- Package & Mounting — 324‑LBGA package (supplier package: 324‑FTBGA, 19×19 mm), surface mount.
- Electrical & Temperature — Voltage supply range 1.71 V to 3.465 V; commercial operating temperature 0 °C to 85 °C.
- Compliance — RoHS compliant.
Typical Applications
- Glue Logic and System Control — Implement control sequencing, address decoding and small-scale state machines directly on-chip.
- Bus Bridging and Interface Adaptation — Bridge or adapt between parallel and serial buses or between differing logic-voltage domains using abundant I/Os.
- Power-Up and Reset Management — Handle power sequencing, reset control and supervisory logic with instant-on responsiveness.
- Peripheral and Sensor Interfacing — Aggregate and condition signals from multiple peripherals or sensors for downstream processing.
Unique Advantages
- Instant availability at power-up: Non-volatile single-chip architecture eliminates external configuration memory and enables microsecond power-up behavior.
- High I/O-to-Logic ratio: 271 programmable I/Os paired with 2280 logic elements supports dense interface designs without large, power-hungry FPGAs.
- In-field reconfiguration: TransFR-style reconfiguration and JTAG programming allow updates and background programming while deployed.
- Power management flexibility: Dedicated sleep mode for substantial static current reduction, preserving system power budgets.
- Compact, manufacturable package: 324‑LBGA (324‑FTBGA, 19×19 mm) surface‑mount package offers high pin count in a compact footprint.
- Toolchain support: MachXO family devices are supported by the vendor’s design tools for synthesis, place-and-route and timing verification as described in the MachXO documentation.
Why Choose LCMXO2280C-5FTN324C?
The LCMXO2280C-5FTN324C positions itself as a compact, non-volatile FPGA solution for commercial embedded systems that require instant-on responsiveness, flexible I/O connectivity and in-field reconfigurability. Its combination of 2280 logic elements, substantial I/O count and on‑chip RAM makes it well suited for designers needing to consolidate glue logic, interface bridging and control functions into a single surface‑mount package.
Supported by MachXO family design flows and programming options, this device provides a practical balance of integration, configurability and power management for applications where board-area, startup time and reprogrammability matter.
Request a quote or submit an inquiry today to get pricing and availability for the LCMXO2280C-5FTN324C. Our team can provide lead-time information and support for your design evaluation and procurement needs.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016