LCMXO2280C-5FT324C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA |
|---|---|
| Quantity | 1,121 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FTBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LBGA | Number of I/O | 271 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-5FT324C – MachXO Field Programmable Gate Array (FPGA) IC, 271 I/O · 2,280 logic elements · 28,262 bits RAM · 324-LBGA
The LCMXO2280C-5FT324C is a MachXO family FPGA optimized for glue logic, bus interfacing and control applications. It combines non-volatile configuration with an FPGA-style architecture to deliver instant-on capability, reconfigurable logic, and a high I/O-to-logic density for space-constrained system designs.
With 2,280 logic elements, 28,262 bits of on-chip RAM and up to 271 I/Os in a compact 324-ball LBGA package, this commercial-grade device addresses use cases that require flexible I/O, single-chip configuration and a broad supply voltage range.
Key Features
- Core Logic 2,280 logic elements provide configurable LUT-based logic suitable for glue logic, control paths and protocol bridging.
- On-chip Memory Approximately 28,262 bits of embedded RAM for distributed and block memory needs within the design.
- I/O Density Up to 271 I/Os in the 324-LBGA package, enabling dense connectivity to peripherals, buses and external devices.
- Non-volatile, Instant-on Architecture Single-chip non-volatile configuration enabling instant-on behavior and in-field reconfiguration without external configuration memory.
- Reconfiguration and Sleep Supports in-field reconfiguration and a sleep mode that can reduce static current by up to 100×.
- Programmable Clocks Support for up to two analog PLLs for clock multiply/divide and phase control.
- Power and Supply Range Operates across a supply voltage range of 1.71 V to 3.465 V to accommodate multiple I/O standards and system rails.
- Package and Thermal 324-ball ftBGA (19 × 19 mm) supplier package in a 324-LBGA case; commercial operating temperature range 0 °C to 85 °C.
- Standards and Support Designed for IEEE 1149.1 boundary-scan and supports in-system programming and background programming of non-volatile memory.
- RoHS Compliant Device and packaging meet RoHS requirements for lead-free assembly.
Typical Applications
- Glue Logic and System Control Implement board-level control, reset/power sequencing and small-scale state machines using the device’s LUT-based logic and embedded memory.
- Bus Bridging and Interfacing Bridge between buses and implement protocol adaptation by leveraging high I/O count and flexible I/O voltage support.
- Peripheral and Sensor Interfaces Concentrate multiple peripheral interfaces and signal conditioning logic into a single, non-volatile device to simplify BOM and board routing.
- In-field Logic Updates Apply TransFR-style reconfiguration to update control logic while the system is operating, minimizing downtime.
Unique Advantages
- Instant-on, single-chip configuration: Non-volatile configuration removes the need for external configuration memory and enables rapid power-up.
- High I/O-to-logic ratio: 271 I/Os paired with 2,280 logic elements enable dense connectivity without oversizing the logic fabric.
- Flexible power integration: Wide supply voltage support from 1.71 V to 3.465 V allows direct interfacing with common system rails.
- Compact BGA package: 324-ball ftBGA (19 × 19 mm) packaging reduces PCB footprint while providing extensive I/O.
- Low-power modes and field updates: Sleep mode for significant static current reduction and support for in-field reconfiguration improve energy efficiency and maintainability.
- Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS-compliant packaging for standard commercial deployments.
Why Choose LCMXO2280C-5FT324C?
The LCMXO2280C-5FT324C positions itself as a compact, non-volatile FPGA solution for designs that require immediate availability of logic at power-up, flexible I/O, and the ability to reconfigure in the field. Its combination of 2,280 logic elements, approximately 28,262 bits of embedded RAM and up to 271 I/Os in a 324-LBGA package makes it well suited for board-level control, bus interfacing and peripheral aggregation in commercial applications.
Choose this device when you need single-chip configuration, a small PCB footprint, and broad supply-voltage compatibility—backed by MachXO family capabilities such as sleep mode, PLL-based clocking and RoHS-compliant packaging.
Request a quote or submit a product inquiry to receive pricing and availability for the LCMXO2280C-5FT324C and to evaluate it for your next design.