LCMXO2280C-5B256C

IC FPGA 211 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA

Quantity 413 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGA, CSPBGANumber of I/O211Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-5B256C – MachXO Field Programmable Gate Array (FPGA), 2280 logic elements, 211 I/Os, 256-LFBGA

The LCMXO2280C-5B256C is a MachXO family FPGA offering non-volatile, instant-on programmable logic for glue logic, bus bridging, control logic and power-up sequencing. Built around an array of logic blocks with dedicated embedded memory and flexible I/O, this device targets low- to mid-density control and interface tasks where fast startup, reconfigurability and high I/O-to-logic density are important.

This surface-mount, commercial-grade device is available in a 256-ball LFBGA/CSPBGA package and provides a balance of logic capacity, on-chip memory and I/O resources for compact system designs.

Key Features

  • Non-volatile, instant-on architecture  Single-chip non-volatile configuration enables instant-on operation and eliminates the need for external configuration memory.
  • Reconfiguration and in-field updates  Supports rapid reconfiguration of SRAM-based logic; TransFR™ reconfiguration allows logic updates while the system is operating.
  • Logic capacity  2280 logic elements (LUT4) arranged across logic blocks; device documentation lists 285 logic blocks for scalable implementation of control and glue logic.
  • Embedded and distributed memory  On-chip memory totaling approximately 28.3 Kbits (including embedded block RAM and distributed RAM) for FIFOs, registers and small buffers.
  • High I/O count and flexible I/O standards  211 I/Os with programmable sysIO™ buffer support for common interfaces and levels listed in the product family documentation (LVCMOS, LVTTL, PCI, LVDS and related standards).
  • Clocking  Up to two analog PLLs for clock multiply/divide and phase control are available in the MachXO family devices.
  • Power and low-power modes  Supports sleep mode to substantially reduce static current (documentation cites up to 100× reduction in sleep mode).
  • Supply and operating range  Operates over a supply range of 1.71 V to 3.465 V and supports common I/O rails documented for the family (3.3 V, 2.5 V, 1.8 V and 1.2 V). Operating temperature is 0 °C to 85 °C.
  • Package and mounting  Surface-mount device offered in a 256-ball caBGA (14 × 14 mm) / 256-LFBGA CSPBGA package for compact board-level integration.
  • Standards and environmental  RoHS-compliant packaging; family documentation includes IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support.

Typical Applications

  • Glue Logic and System Control  Implement address decoding, reset sequencing and power-up control with instant-on capability to simplify system startup.
  • Bus Bridging and Interface Conversion  Use the device’s high I/O count and flexible I/O buffer support to bridge or adapt between different bus standards and voltage domains.
  • User Interface and Peripheral Control  Control LED/key matrices, simple HMIs, and peripheral timing while taking advantage of embedded memory for buffering.
  • Embedded Logic and State Machines  Implement moderate-complexity state machines and control logic with on-chip RAM for FIFO and temporary storage.

Unique Advantages

  • Instant-on, single-chip configuration: Eliminates external configuration memories and provides fast power-up behavior for quicker system readiness.
  • Field reconfigurability: TransFR™ capability and reconfigurable SRAM logic enable in-field updates without removing the device from the system.
  • High I/O-to-logic density: 211 I/Os paired with 2280 logic elements support designs that require many external signals with moderate logic resources.
  • On-chip memory resources: Approximately 28.3 Kbits of combined embedded and distributed RAM for data buffering and small on-chip storage needs.
  • Flexible supply and I/O levels: Wide supply range and support for common I/O voltages simplify multi-rail board designs.
  • Compact package options: 256-ball caBGA/CSPBGA package enables high pin-count integration in space-constrained layouts.

Why Choose LCMXO2280C-5B256C?

The LCMXO2280C-5B256C delivers a practical balance of non-volatile instant-on operation, reconfigurability and high I/O capacity for glue logic, interface bridging and control applications. Its mix of 2280 logic elements, embedded memory and two PLLs (family capability) make it suitable for designs that need moderate logic density combined with flexible clocking and extensive I/O.

Backed by the MachXO family design tools and documented support for standard synthesis flows, this device is a strong option for engineers seeking a compact, reprogrammable single-chip solution that reduces BOM and simplifies system startup and updates.

Request a quote or submit a parts inquiry to get pricing and availability for the LCMXO2280C-5B256C. Provide your quantity and configuration needs to receive a prompt response.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up