LCMXO2280C-4TN100C

IC FPGA 73 I/O 100TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 73 28262 2280 100-LQFP

Quantity 653 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O73Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-4TN100C – MachXO Field Programmable Gate Array (FPGA) IC 73 28262 2280 100-LQFP

The LCMXO2280C-4TN100C is a MachXO family FPGA from Lattice Semiconductor, offering non-volatile, instant-on programmable logic in a single-chip surface-mount package. Architected around an array of logic elements with programmable I/O and embedded memory, it targets glue logic, bus bridging/interfacing, power-up control and general control-logic applications.

This device combines instant-on non-volatile configuration, in-field reconfiguration capability and flexible I/O support to simplify system design and reduce external components for commercial-grade applications operating from 0 °C to 85 °C.

Key Features

  • Logic Capacity — 2280 logic elements for implementing glue logic, control paths and bus interfacing functions.
  • On-chip Memory — 28,262 total RAM bits of on-chip memory. The MachXO family datasheet describes embedded block RAM and distributed RAM resources for state storage and FIFOs.
  • I/O and Package — 73 user I/Os in a 100-pin LQFP/TQFP (14 × 14 mm) surface-mount package; suitable for compact board designs.
  • Flexible Voltage Operation — Supports supply voltages from 1.71 V to 3.465 V to accommodate a range of system signaling domains.
  • Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial applications.
  • Non-volatile, Instant-on Configuration — Single-chip non-volatile architecture powers up in microseconds with no external configuration memory required; supports JTAG programming and background programming of non-volatile memory.
  • In-field Reconfiguration (TransFR) — Supports in-system reprogramming of SRAM-based logic while the system operates for fast updates and feature changes.
  • Low-Power Modes — Sleep mode available to reduce static current by up to 100× for power-sensitive designs.
  • Clocking — Up to two analog PLLs per device for clock multiplication, division and phase shifting.
  • Programmable I/O Buffer — sysIO buffer supports multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL and high-speed differential interfaces such as LVDS, Bus-LVDS, LVPECL and RSDS.
  • System-level Support — IEEE 1149.1 boundary scan, onboard oscillator and IEEE 1532 compliant in-system programming capabilities for board-level test and programming.
  • RoHS Compliant — Lead free / RoHS packaging.

Typical Applications

  • Glue Logic — Replace discrete glue components with compact, reconfigurable logic to consolidate control functions and simplify BOM.
  • Bus Bridging and Interfacing — Implement protocol adaptation and bus interfacing between different voltage domains and I/O standards using flexible sysIO buffers and ample I/O count.
  • Power-up and System Control — Manage power sequencing, reset control and supervisory logic with instant-on configuration and non-volatile retention.
  • Control Logic — Implement state machines, timing control and custom control paths leveraging on-chip RAM and PLL-driven clocks.

Unique Advantages

  • Single-chip, Instant-on Operation: Eliminates the need for external configuration memory and enables systems to power up in microseconds.
  • Field Reconfigurability: TransFR and JTAG-programmable memory allow in-field updates and background programming without removing the device from the system.
  • High I/O-to-Logic Density: 73 I/Os paired with 2280 logic elements supports complex interfacing and control in a small 100-pin package.
  • Flexible Signaling: Programmable I/O buffers support multiple single-ended and differential standards to simplify heterogeneous system integration.
  • Low-power Options: Sleep mode provides a practical method to significantly reduce static current for power-sensitive designs.
  • Design Tool Support: Family datasheet references ispLEVER tool support and synthesis libraries to streamline implementation, timing closure and verification.

Why Choose LCMXO2280C-4TN100C?

The LCMXO2280C-4TN100C positions itself as a compact, non-volatile FPGA option for commercial designs that require instant-on behavior, in-field reconfigurability and flexible I/O support within a 100-pin surface-mount package. Its combination of 2280 logic elements, on-chip RAM and up to two PLLs enables designers to consolidate control logic, interface bridging and timing management into a single device.

This MachXO device is well suited for engineers seeking to reduce board-level complexity and BOM while retaining the ability to update logic in the field. With commercial temperature operation and RoHS-compliant packaging, it provides a practical, supported building block for a wide range of embedded control and interfacing applications.

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