LCMXO2280C-4T100C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 73 28262 2280 100-LQFP |
|---|---|
| Quantity | 186 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 73 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-4T100C – MachXO Field Programmable Gate Array (FPGA) IC, 2,280 logic elements, 100-LQFP
The LCMXO2280C-4T100C is a member of the MachXO family of non-volatile, instant-on FPGAs. It combines 2,280 logic elements with embedded and distributed memory, flexible I/O support and single-chip non-volatile configuration for applications that require fast startup and on‑board reconfigurability.
Designed for glue logic, bus bridging, power‑up control and general control logic, this surface-mount device is supplied in a 100-pin LQFP/TQFP (14×14 mm) package, operates from 1.71 V to 3.465 V, and is qualified to commercial temperature range (0 °C to 85 °C).
Key Features
- Core Logic 2,280 logic elements (LUT4-based) for implementing combinational and sequential logic.
- Embedded and Distributed Memory Approximately 28,262 bits of on‑chip RAM with family-level support for up to ~27.6 Kbits of embedded block RAM and up to 7.7 Kbits of distributed RAM.
- I/O Capacity & Flexibility 73 I/Os in the 100‑pin package with programmable sysIO buffer support for multiple I/O standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS.
- Configuration & Reconfiguration Non‑volatile single‑chip configuration with instant‑on behavior and support for in-field reconfiguration and background programming via JTAG.
- Clocking Family supports up to two analog PLLs (device-level implementation provides PLL support) for clock multiply, divide and phase shifting.
- Low‑Power Modes Sleep mode capability that can reduce static current by up to 100× for power-sensitive designs.
- Package & Mounting 100‑pin LQFP/TQFP (14×14 mm) surface-mount package; supplier device package listed as 100‑TQFP (14×14).
- Supply & Temperature Wide supply range from 1.71 V to 3.465 V and commercial operating range 0 °C to 85 °C.
- Standards & System Support IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support for board-level test and programming.
- RoHS Compliance RoHS‑compliant packaging.
Typical Applications
- Glue Logic and System Integration Replace discrete glue logic with a single programmable device to consolidate control and interface logic.
- Bus Bridging and Interfacing Implement bus translation, buffering and level‑shifting functions with flexible I/O standards and abundant I/O pins.
- Power-Up and Reset Control Use non‑volatile, instant‑on configuration to manage power sequencing and system initialization without external configuration memory.
- Control Logic Integrate state machines, timing control and peripheral glue in a reprogrammable solution that can be updated in-field.
Unique Advantages
- Instant‑on, Single‑Chip Configuration: Non‑volatile on‑chip configuration eliminates the need for external configuration memory and enables rapid power‑up.
- Balanced Logic and Memory: 2,280 logic elements combined with embedded and distributed RAM provide a compact platform for control and buffering tasks.
- Flexible I/O Standards: Programmable sysIO buffers support a wide range of signaling standards to simplify board design and interface multiple peripherals.
- Power Efficiency: Dedicated sleep mode delivers substantial static current reduction for designs with idle periods or energy constraints.
- Board‑Level Test and Reprogramming: IEEE 1149.1 boundary scan and IEEE 1532 in‑system programming facilitate manufacturing test and field updates.
- Commercial Temperature and Broad Supply Range: Operates across 1.71 V–3.465 V and 0 °C–85 °C, matching common commercial embedded system requirements.
Why Choose LCMXO2280C-4T100C?
The LCMXO2280C-4T100C is positioned for engineers who need a non‑volatile, instant‑on programmable device with a compact package and a balanced mix of logic, memory and I/O. Its single‑chip configuration model, programmable I/O flexibility and low‑power sleep mode make it well suited for system glue logic, bus interfacing and control tasks where rapid startup and in-field reconfiguration are important.
With RoHS‑compliant packaging, board‑level test and programming support, and a supply and temperature range tailored for commercial embedded designs, this MachXO device delivers a pragmatic platform for reducing BOM count, simplifying design and enabling updates without external configuration memory.
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