LCMXO2280C-4T100C

IC FPGA 73 I/O 100TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 73 28262 2280 100-LQFP

Quantity 186 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O73Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-4T100C – MachXO Field Programmable Gate Array (FPGA) IC, 2,280 logic elements, 100-LQFP

The LCMXO2280C-4T100C is a member of the MachXO family of non-volatile, instant-on FPGAs. It combines 2,280 logic elements with embedded and distributed memory, flexible I/O support and single-chip non-volatile configuration for applications that require fast startup and on‑board reconfigurability.

Designed for glue logic, bus bridging, power‑up control and general control logic, this surface-mount device is supplied in a 100-pin LQFP/TQFP (14×14 mm) package, operates from 1.71 V to 3.465 V, and is qualified to commercial temperature range (0 °C to 85 °C).

Key Features

  • Core Logic  2,280 logic elements (LUT4-based) for implementing combinational and sequential logic.
  • Embedded and Distributed Memory  Approximately 28,262 bits of on‑chip RAM with family-level support for up to ~27.6 Kbits of embedded block RAM and up to 7.7 Kbits of distributed RAM.
  • I/O Capacity & Flexibility  73 I/Os in the 100‑pin package with programmable sysIO buffer support for multiple I/O standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS.
  • Configuration & Reconfiguration  Non‑volatile single‑chip configuration with instant‑on behavior and support for in-field reconfiguration and background programming via JTAG.
  • Clocking  Family supports up to two analog PLLs (device-level implementation provides PLL support) for clock multiply, divide and phase shifting.
  • Low‑Power Modes  Sleep mode capability that can reduce static current by up to 100× for power-sensitive designs.
  • Package & Mounting  100‑pin LQFP/TQFP (14×14 mm) surface-mount package; supplier device package listed as 100‑TQFP (14×14).
  • Supply & Temperature  Wide supply range from 1.71 V to 3.465 V and commercial operating range 0 °C to 85 °C.
  • Standards & System Support  IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support for board-level test and programming.
  • RoHS Compliance  RoHS‑compliant packaging.

Typical Applications

  • Glue Logic and System Integration  Replace discrete glue logic with a single programmable device to consolidate control and interface logic.
  • Bus Bridging and Interfacing  Implement bus translation, buffering and level‑shifting functions with flexible I/O standards and abundant I/O pins.
  • Power-Up and Reset Control  Use non‑volatile, instant‑on configuration to manage power sequencing and system initialization without external configuration memory.
  • Control Logic  Integrate state machines, timing control and peripheral glue in a reprogrammable solution that can be updated in-field.

Unique Advantages

  • Instant‑on, Single‑Chip Configuration: Non‑volatile on‑chip configuration eliminates the need for external configuration memory and enables rapid power‑up.
  • Balanced Logic and Memory: 2,280 logic elements combined with embedded and distributed RAM provide a compact platform for control and buffering tasks.
  • Flexible I/O Standards: Programmable sysIO buffers support a wide range of signaling standards to simplify board design and interface multiple peripherals.
  • Power Efficiency: Dedicated sleep mode delivers substantial static current reduction for designs with idle periods or energy constraints.
  • Board‑Level Test and Reprogramming: IEEE 1149.1 boundary scan and IEEE 1532 in‑system programming facilitate manufacturing test and field updates.
  • Commercial Temperature and Broad Supply Range: Operates across 1.71 V–3.465 V and 0 °C–85 °C, matching common commercial embedded system requirements.

Why Choose LCMXO2280C-4T100C?

The LCMXO2280C-4T100C is positioned for engineers who need a non‑volatile, instant‑on programmable device with a compact package and a balanced mix of logic, memory and I/O. Its single‑chip configuration model, programmable I/O flexibility and low‑power sleep mode make it well suited for system glue logic, bus interfacing and control tasks where rapid startup and in-field reconfiguration are important.

With RoHS‑compliant packaging, board‑level test and programming support, and a supply and temperature range tailored for commercial embedded designs, this MachXO device delivers a pragmatic platform for reducing BOM count, simplifying design and enabling updates without external configuration memory.

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