LCMXO2280C-4M132C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 101 28262 2280 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 987 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSPBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 101 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-4M132C – MachXO FPGA, 2,280 Logic Elements, 132-CSPBGA
The LCMXO2280C-4M132C is a MachXO family Field Programmable Gate Array (FPGA) provided in a 132-ball CSPBGA (8×8 mm) package. It combines non-volatile configuration, a high I/O-to-logic density architecture and embedded memory to address glue logic, bus bridging/interfacing, power-up control and general control-logic applications.
With 2,280 logic elements, approximately 28 Kbits of on-chip RAM, up to two PLLs and 101 I/Os, this device delivers single-chip instant-on reconfigurability and flexible I/O support for systems operating across a broad supply range.
Key Features
- Core Logic — 2,280 logic elements for implementing glue logic, control state machines and low-capacity FPGA functions.
- On‑chip Memory — Total on-chip RAM of 28,262 bits (approximately 28 Kbits) for embedded and distributed memory requirements.
- I/O Density & Flexibility — 101 programmable I/Os in the 132-CSPBGA package to support diverse interfacing needs.
- Configurable Clocking — Up to two analog PLLs for clock multiplication, division and phase shifting.
- Non‑volatile, Instant‑on Configuration — Single‑chip configuration with no external configuration memory required; reconfigurable SRAM logic and support for background programming via JTAG.
- In‑field Reconfiguration — TransFR™ reconfiguration enables in-field logic updates while the system operates.
- Low Power Modes — Sleep mode capability for significant static current reduction.
- Power Supply Range — Operates across a supply range from 1.71 V to 3.465 V, enabling compatibility with multiple system rail voltages.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature.
- Package — 132-LFBGA / 132-CSPBGA (8×8 mm) surface-mount package for compact board-level integration.
- RoHS Compliant — Device is RoHS compliant.
Typical Applications
- Glue Logic — Implement bus adapters, signal conditioning and protocol conversion using the device’s logic fabric and flexible I/Os.
- Bus Bridging & Interfacing — Bridge between differing bus standards and perform interface translation with plentiful I/O and programmable buffers.
- Power‑Up & System Control — Use non‑volatile instant-on behavior and reconfigurable logic for startup sequencing and system management tasks.
- Control Logic — Implement finite state machines, timing control and custom peripheral controllers leveraging on‑chip RAM and PLLs.
Unique Advantages
- Single‑chip, non‑volatile configuration: Instant-on operation without external configuration memory simplifies BOM and improves start-up behavior.
- High I/O-to-logic density: 101 I/Os paired with 2,280 logic elements allows compact, high-function solutions for interface-heavy designs.
- Flexible clocking: Two PLLs provide on-chip clock management for synchronized and phase-shifted domains.
- Field reconfiguration: TransFR™ enables in-field logic updates while the system remains operational, reducing downtime for updates.
- Low-power capability: Sleep mode reduces static current substantially, helping in power‑sensitive applications.
- Compact packaging: 132-CSPBGA (8×8 mm) provides a small footprint for space-constrained boards while maintaining robust I/O count.
Why Choose LCMXO2280C-4M132C?
The LCMXO2280C-4M132C is positioned for designers who need a compact, non‑volatile FPGA with a strong mix of I/O, logic and embedded memory for control, interfacing and system management tasks. Its instant-on capability, in-field reconfiguration and dual PLLs make it well suited to systems that require reliable start-up behavior, flexible timing and ongoing updateability.
With a commercial temperature rating, wide supply voltage window and RoHS compliance, this MachXO device offers a pragmatic balance of integration and configurability for a broad range of embedded applications and mid-volume production designs.
Request a quote or submit a purchasing inquiry to learn about availability and lead times for the LCMXO2280C-4M132C.

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