LCMXO2280C-4FTN324C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA |
|---|---|
| Quantity | 668 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FTBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LBGA | Number of I/O | 271 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-4FTN324C – MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA
The LCMXO2280C-4FTN324C is a MachXO family FPGA optimized for applications that require non-volatile, instant-on programmable logic with flexible I/O. This device delivers 2,280 logic elements, 28,262 bits of on-chip RAM and up to 271 I/Os in a 324-ball LBGA surface-mount package.
Built for glue logic, bus bridging, power-up control and control-logic tasks, the device combines single-chip non-volatile configuration and LUT-based logic to simplify system design and enable in-field reconfiguration and low-power operation.
Key Features
- Logic Capacity 2,280 logic elements (LUT4s) for implementing combinational and sequential logic functions.
- Embedded Memory Total on-chip RAM of 28,262 bits for distributed and block memory needs within the device.
- I/O Density & Flexibility Up to 271 I/Os in the 324-LBGA package, with programmable sysIO buffer support for multiple interface standards.
- Non-volatile, Instant-On MachXO family architecture provides single-chip non-volatile configuration with instant-on startup and no external configuration memory required.
- In-field Reconfiguration Supports background programming and TransFR™ reconfiguration for updating logic while the system operates; JTAG programmability for SRAM and non-volatile memory.
- Clocking Up to two analog PLLs for clock multiply/divide and phase shifting (family characteristic).
- Power & Voltage Operates over a wide supply range from 1.71 V to 3.465 V to support multiple I/O and core voltage domains.
- Package & Mounting 324-LBGA (supplier: 324-FTBGA, 19×19 mm) surface-mount package for high pin-count board designs.
- Commercial Grade & Temperature Commercial-grade device rated for 0 °C to 85 °C operating temperature.
- RoHS Compliant Lead-free, RoHS-compliant packaging.
Typical Applications
- Glue Logic and System Control Implement power sequencing, reset control and board-level glue logic using the device’s non-volatile instant-on capability.
- Bus Bridging and Interfacing Use the high I/O count and programmable sysIO buffers to bridge buses and interface between different logic families and voltage domains.
- Power-Up and Safety Control Leverage single-chip non-volatile configuration and sleep-mode features for reliable power-up sequencing and low static current states.
- In-Field Upgrades Apply TransFR™ reconfiguration and background programming to update logic in deployed systems without extended downtime.
Unique Advantages
- Single-Chip Non-Volatile Configuration: Eliminates the need for external configuration memory, simplifying BOM and board layout.
- Instant-On Behavior: Powers up in microseconds for fast system availability, useful in control and sequencing applications.
- High I/O-to-Logic Density: 271 I/Os paired with 2,280 logic elements allow complex interfacing and logic consolidation in one device.
- In-Field Reconfiguration: Background programming and TransFR™ enable safe firmware and logic updates while systems remain online.
- Flexible Voltage Support: Wide supply range (1.71 V–3.465 V) accommodates different I/O standards and board power architectures.
- Design Tool Support: MachXO family devices are supported by the ispLEVER design tools for synthesis, place-and-route, and timing verification (family-level support).
Why Choose LCMXO2280C-4FTN324C?
The LCMXO2280C-4FTN324C positions itself as a compact, single-chip solution for designers needing non-volatile instant-on logic with substantial I/O capability. Its combination of 2,280 logic elements, 28,262 bits of embedded RAM and 271 I/Os in a 324-LBGA package makes it suitable for board-level control, bus interfacing and in-field reconfigurable designs in commercial-temperature systems.
Choosing this MachXO device provides a balance of integration and flexibility—reducing external components while enabling in-system updates and a broad voltage operating range that supports varied I/O standards. The device is well suited for engineers seeking to streamline BOM and simplify system configuration without external configuration memory.
If you need pricing, availability or a formal quote for the LCMXO2280C-4FTN324C, submit a request or inquiry and our team will respond with details and purchasing options.

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