LCMXO2280C-4FTN324C

IC FPGA 271 I/O 324FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA

Quantity 668 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package324-FTBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LBGANumber of I/O271Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-4FTN324C – MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA

The LCMXO2280C-4FTN324C is a MachXO family FPGA optimized for applications that require non-volatile, instant-on programmable logic with flexible I/O. This device delivers 2,280 logic elements, 28,262 bits of on-chip RAM and up to 271 I/Os in a 324-ball LBGA surface-mount package.

Built for glue logic, bus bridging, power-up control and control-logic tasks, the device combines single-chip non-volatile configuration and LUT-based logic to simplify system design and enable in-field reconfiguration and low-power operation.

Key Features

  • Logic Capacity  2,280 logic elements (LUT4s) for implementing combinational and sequential logic functions.
  • Embedded Memory  Total on-chip RAM of 28,262 bits for distributed and block memory needs within the device.
  • I/O Density & Flexibility  Up to 271 I/Os in the 324-LBGA package, with programmable sysIO buffer support for multiple interface standards.
  • Non-volatile, Instant-On  MachXO family architecture provides single-chip non-volatile configuration with instant-on startup and no external configuration memory required.
  • In-field Reconfiguration  Supports background programming and TransFR™ reconfiguration for updating logic while the system operates; JTAG programmability for SRAM and non-volatile memory.
  • Clocking  Up to two analog PLLs for clock multiply/divide and phase shifting (family characteristic).
  • Power & Voltage  Operates over a wide supply range from 1.71 V to 3.465 V to support multiple I/O and core voltage domains.
  • Package & Mounting  324-LBGA (supplier: 324-FTBGA, 19×19 mm) surface-mount package for high pin-count board designs.
  • Commercial Grade & Temperature  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
  • RoHS Compliant  Lead-free, RoHS-compliant packaging.

Typical Applications

  • Glue Logic and System Control  Implement power sequencing, reset control and board-level glue logic using the device’s non-volatile instant-on capability.
  • Bus Bridging and Interfacing  Use the high I/O count and programmable sysIO buffers to bridge buses and interface between different logic families and voltage domains.
  • Power-Up and Safety Control  Leverage single-chip non-volatile configuration and sleep-mode features for reliable power-up sequencing and low static current states.
  • In-Field Upgrades  Apply TransFR™ reconfiguration and background programming to update logic in deployed systems without extended downtime.

Unique Advantages

  • Single-Chip Non-Volatile Configuration:  Eliminates the need for external configuration memory, simplifying BOM and board layout.
  • Instant-On Behavior:  Powers up in microseconds for fast system availability, useful in control and sequencing applications.
  • High I/O-to-Logic Density:  271 I/Os paired with 2,280 logic elements allow complex interfacing and logic consolidation in one device.
  • In-Field Reconfiguration:  Background programming and TransFR™ enable safe firmware and logic updates while systems remain online.
  • Flexible Voltage Support:  Wide supply range (1.71 V–3.465 V) accommodates different I/O standards and board power architectures.
  • Design Tool Support:  MachXO family devices are supported by the ispLEVER design tools for synthesis, place-and-route, and timing verification (family-level support).

Why Choose LCMXO2280C-4FTN324C?

The LCMXO2280C-4FTN324C positions itself as a compact, single-chip solution for designers needing non-volatile instant-on logic with substantial I/O capability. Its combination of 2,280 logic elements, 28,262 bits of embedded RAM and 271 I/Os in a 324-LBGA package makes it suitable for board-level control, bus interfacing and in-field reconfigurable designs in commercial-temperature systems.

Choosing this MachXO device provides a balance of integration and flexibility—reducing external components while enabling in-system updates and a broad voltage operating range that supports varied I/O standards. The device is well suited for engineers seeking to streamline BOM and simplify system configuration without external configuration memory.

If you need pricing, availability or a formal quote for the LCMXO2280C-4FTN324C, submit a request or inquiry and our team will respond with details and purchasing options.

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