LCMXO2280C-4FT324I

IC FPGA 271 I/O 324FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA

Quantity 1,057 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package324-FTBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LBGANumber of I/O271Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-4FT324I – MachXO Field Programmable Gate Array (FPGA) IC 271 I/Os, 28,262 bits RAM, 2280 logic elements, 324-LBGA

The LCMXO2280C-4FT324I is a MachXO family FPGA optimized for glue logic, bus bridging, system control, and board-level interfacing. This non-volatile, instant-on device combines LUT-based logic with embedded block RAM and flexible I/O to address control and interface applications that require high I/O density and reconfigurable logic.

Designed for industrial-grade operation, the device offers 2280 logic elements, approximately 27.6 Kbits of embedded memory, and up to 271 I/Os in a 324-ball FTBGA package. It supports in-field reconfiguration and multiple I/O standards to simplify system-level integration.

Key Features

  • Core Logic — 2280 logic elements (LUT-based architecture) suitable for glue logic, control paths, and small- to mid-scale programmable functions.
  • Embedded and Distributed Memory — Approximately 27.6 Kbits of embedded block RAM and additional distributed RAM for FIFOs and state storage.
  • I/O Density & Flexibility — Up to 271 I/Os with programmable sysIO buffer supporting LVCMOS (3.3/2.5/1.8/1.5/1.2V), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, and RSDS signaling.
  • Power and Voltage — Wide supply range from 1.71 V to 3.465 V to accommodate multiple system rails and I/O standards.
  • Non-volatile, Instant-on — Single-chip non-volatile architecture that powers up in microseconds and does not require external configuration memory.
  • Reconfiguration and Programming — TransFR™ in-field reconfiguration for updating logic while a system is operational; supports JTAG programming and background programming of non-volatile memory.
  • Clocking — Up to two analog PLLs for clock multiply, divide, and phase shifting (sysCLOCK™ PLLs).
  • System Support & Test — IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support; onboard oscillator available.
  • Package & Mounting — 324-ball FTBGA package (19×19 mm), surface-mount; supplier device package listed as 324-FTBGA.
  • Operating Range & Compliance — Industrial-grade operating temperature from -40 °C to 100 °C and RoHS-compliant packaging.

Typical Applications

  • Glue Logic and Board Control — Implement startup sequencing, reset logic, and board-level control functions with instant-on non-volatile configuration.
  • Bus Bridging and Interfacing — Use the flexible I/O buffers and high I/O count to bridge between disparate bus standards and manage protocol translation.
  • Power-Up and System Management — Manage power sequencing, supervisory functions, and system-level resets using embedded logic and reconfigurable behavior.
  • Peripheral and Sensor Aggregation — Aggregate and condition signals from multiple peripherals or sensors with distributed RAM and dedicated FIFO control logic.

Unique Advantages

  • Single-Chip, Instant-On Configuration: Eliminates the need for external configuration memory and enables microsecond power-up for faster system readiness.
  • High I/O Count in a Compact Package: 271 I/Os in a 324-ball FTBGA provide board-level routing flexibility without increasing device count.
  • Flexible I/O Standards: Broad protocol and voltage support reduces the need for external level shifters and simplifies multi-rail designs.
  • In-Field Reconfiguration (TransFR™): Update logic in-place while the system remains operational to enable field upgrades and feature changes.
  • Industrial Temperature and RoHS Compliance: Rated from -40 °C to 100 °C with lead-free packaging for industrial deployments.
  • Integrated Clocking and Memory: Up to two PLLs and embedded block RAM allow local clock management and buffer/FIFO implementations without external components.

Why Choose LCMXO2280C-4FT324I?

The LCMXO2280C-4FT324I positions itself as a compact, non-volatile FPGA well suited to board-level control, interface bridging, and system management tasks. With 2280 logic elements, ample on-chip RAM, and a high count of flexible I/Os in a 324-ball FTBGA, it reduces bill-of-materials and streamlines designs that require instant-on behavior and in-field configurability.

Engineers targeting industrial applications benefit from the device’s wide voltage range, industrial operating temperature, and standards-based programming and test features. The MachXO family architecture supports reliable, reconfigurable implementations while keeping system integration straightforward.

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