LCMXO2280C-4FT324I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA |
|---|---|
| Quantity | 1,057 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FTBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LBGA | Number of I/O | 271 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-4FT324I – MachXO Field Programmable Gate Array (FPGA) IC 271 I/Os, 28,262 bits RAM, 2280 logic elements, 324-LBGA
The LCMXO2280C-4FT324I is a MachXO family FPGA optimized for glue logic, bus bridging, system control, and board-level interfacing. This non-volatile, instant-on device combines LUT-based logic with embedded block RAM and flexible I/O to address control and interface applications that require high I/O density and reconfigurable logic.
Designed for industrial-grade operation, the device offers 2280 logic elements, approximately 27.6 Kbits of embedded memory, and up to 271 I/Os in a 324-ball FTBGA package. It supports in-field reconfiguration and multiple I/O standards to simplify system-level integration.
Key Features
- Core Logic — 2280 logic elements (LUT-based architecture) suitable for glue logic, control paths, and small- to mid-scale programmable functions.
- Embedded and Distributed Memory — Approximately 27.6 Kbits of embedded block RAM and additional distributed RAM for FIFOs and state storage.
- I/O Density & Flexibility — Up to 271 I/Os with programmable sysIO buffer supporting LVCMOS (3.3/2.5/1.8/1.5/1.2V), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, and RSDS signaling.
- Power and Voltage — Wide supply range from 1.71 V to 3.465 V to accommodate multiple system rails and I/O standards.
- Non-volatile, Instant-on — Single-chip non-volatile architecture that powers up in microseconds and does not require external configuration memory.
- Reconfiguration and Programming — TransFR™ in-field reconfiguration for updating logic while a system is operational; supports JTAG programming and background programming of non-volatile memory.
- Clocking — Up to two analog PLLs for clock multiply, divide, and phase shifting (sysCLOCK™ PLLs).
- System Support & Test — IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support; onboard oscillator available.
- Package & Mounting — 324-ball FTBGA package (19×19 mm), surface-mount; supplier device package listed as 324-FTBGA.
- Operating Range & Compliance — Industrial-grade operating temperature from -40 °C to 100 °C and RoHS-compliant packaging.
Typical Applications
- Glue Logic and Board Control — Implement startup sequencing, reset logic, and board-level control functions with instant-on non-volatile configuration.
- Bus Bridging and Interfacing — Use the flexible I/O buffers and high I/O count to bridge between disparate bus standards and manage protocol translation.
- Power-Up and System Management — Manage power sequencing, supervisory functions, and system-level resets using embedded logic and reconfigurable behavior.
- Peripheral and Sensor Aggregation — Aggregate and condition signals from multiple peripherals or sensors with distributed RAM and dedicated FIFO control logic.
Unique Advantages
- Single-Chip, Instant-On Configuration: Eliminates the need for external configuration memory and enables microsecond power-up for faster system readiness.
- High I/O Count in a Compact Package: 271 I/Os in a 324-ball FTBGA provide board-level routing flexibility without increasing device count.
- Flexible I/O Standards: Broad protocol and voltage support reduces the need for external level shifters and simplifies multi-rail designs.
- In-Field Reconfiguration (TransFR™): Update logic in-place while the system remains operational to enable field upgrades and feature changes.
- Industrial Temperature and RoHS Compliance: Rated from -40 °C to 100 °C with lead-free packaging for industrial deployments.
- Integrated Clocking and Memory: Up to two PLLs and embedded block RAM allow local clock management and buffer/FIFO implementations without external components.
Why Choose LCMXO2280C-4FT324I?
The LCMXO2280C-4FT324I positions itself as a compact, non-volatile FPGA well suited to board-level control, interface bridging, and system management tasks. With 2280 logic elements, ample on-chip RAM, and a high count of flexible I/Os in a 324-ball FTBGA, it reduces bill-of-materials and streamlines designs that require instant-on behavior and in-field configurability.
Engineers targeting industrial applications benefit from the device’s wide voltage range, industrial operating temperature, and standards-based programming and test features. The MachXO family architecture supports reliable, reconfigurable implementations while keeping system integration straightforward.
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