LCMXO2280C-4BN256I

IC FPGA 211 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA

Quantity 469 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGA, CSPBGANumber of I/O211Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-4BN256I – MachXO FPGA, 2,280 logic elements, 211 I/Os, 256-LFBGA

The LCMXO2280C-4BN256I is a MachXO family field programmable gate array (FPGA) offering non-volatile, instant-on operation in a single-chip solution. It combines a mid-density logic fabric with embedded memory and a high pin count to address glue logic, bus bridging/interfacing, power-up control and general control-logic tasks.

Designed for industrial use, this device provides flexible I/O, background reprogramming and features aimed at system-level integration, enabling fast power-up and in-field updates while minimizing external components.

Key Features

  • Core Logic 285 logic blocks supporting 2,280 logic elements for mid-density logic implementation.
  • On-chip Memory Approximately 28,262 bits of on-chip RAM for embedded and distributed memory requirements.
  • I/O and Package 211 I/Os in a 256-ball LFBGA (14×14 mm) package (supplier package: 256-CABGA), offering a high pin-to-logic ratio for interface-heavy designs.
  • Voltage Range Operates across a wide supply range from 1.71 V to 3.465 V to support multiple I/O standards and system rails.
  • Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for demanding environments.
  • Non-volatile, Instant-On Architecture Single-chip non-volatile configuration enables instant-on behavior and eliminates the need for external configuration memory.
  • In-field Reconfiguration & Power Savings Supports reconfiguration of SRAM-based logic, background programming of non-volatile memory and a Sleep Mode that can reduce static current by up to 100×.
  • Clocking and System Support Up to two analog PLLs for clock multiply/divide and phase shifts, plus IEEE 1149.1 boundary scan and onboard oscillator support.
  • Flexible I/O Buffering Programmable I/O buffers support a wide range of interfaces, including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
  • Development Ecosystem Supported by ispLEVER design tools for synthesis, place-and-route, and timing verification; supports IEEE 1532 in-system programming and JTAG access.

Typical Applications

  • Glue Logic & Board Management Implement glue logic, bus arbitration and board-level control functions where compact, single-chip non-volatile logic is required.
  • Bus Bridging and Interfacing Bridge differing bus standards and translate interfaces using the device's high I/O count and flexible buffer support.
  • Power-Up and Reset Control Manage power sequencing and reset logic with instant-on behavior and deterministic startup.
  • General Control Logic Replace multiple discrete parts with a single reconfigurable device for control-state machines, peripheral control and system glue.

Unique Advantages

  • Single-Chip Non-Volatile Solution: Eliminates external configuration memory and delivers instant-on system behavior.
  • High I/O-to-Logic Density: 211 I/Os paired with 2,280 logic elements reduce the need for external interface glue and simplify board routing.
  • Flexible Power and I/O Support: Wide supply voltage range and programmable I/O buffers enable multiple signaling standards from one device.
  • Field Upgrades and Background Programming: Supports in-field logic updates and non-volatile background programming for reduced downtime and simplified maintenance.
  • Industrial Temperature Range: Rated −40 °C to 100 °C to meet harsher environmental requirements.
  • Design Tool and System Integration: ispLEVER tool support plus standard system features (JTAG, IEEE 1149.1, IEEE 1532) streamline development and production workflows.

Why Choose LCMXO2280C-4BN256I?

The LCMXO2280C-4BN256I positions itself as a versatile, non-volatile FPGA for mid-density logic and high-interface-count applications. With instant-on capability, in-field reconfiguration, and a broad range of I/O standards, it simplifies board-level design by consolidating glue logic, interfacing and control functions into a single industrial-grade device.

This device is well suited to engineers seeking reliable, reconfigurable logic with strong system-level support and clear upgrade paths across the MachXO family. The combination of logic capacity, on-chip memory and design-tool integration helps accelerate development and reduce BOM complexity.

Request a quote or submit a pricing and availability inquiry to evaluate the LCMXO2280C-4BN256I for your next design.

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