LCMXO2280C-4B256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 266 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 211 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-4B256C – MachXO Field Programmable Gate Array (FPGA)
The LCMXO2280C-4B256C is a MachXO family FPGA from Lattice Semiconductor Corporation designed for single-chip, non-volatile logic integration. It combines a high I/O count with 2,280 logic elements to address glue logic, bus bridging, bus interfacing, power-up control and general control logic in commercial electronic systems.
As a MachXO device, it supports instant-on operation without external configuration memory, in-field reconfiguration, and flexible I/O standards—making it suitable for applications that require fast startup, secure configuration, and plenty of I/O connectivity in a compact surface-mount package.
Key Features
- Logic Capacity — 2,280 logic elements (LUT4s) to implement glue logic, state machines and control functions.
- On-chip Memory — Total on-chip RAM of 28,262 bits for small data buffers and state storage; consult the MachXO family datasheet for embedded/distributed RAM details.
- I/O Density — 211 I/Os to support wide external connectivity and complex board-level interfaces.
- Non-volatile, Instant-on — Single-chip non-volatile architecture that powers up in microseconds without the need for external configuration memory.
- Reconfiguration & Programming — In-field reconfiguration capability and support for background programming; JTAG programmable and IEEE 1532 compliant for in-system programming.
- Low-Power Modes — Sleep mode provides significant static current reduction to lower standby power consumption.
- Flexible I/O Standards — Programmable I/O supporting LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS for broad interface compatibility.
- Clocking — Up to two analog PLLs for clock multiplication, division and phase adjustment.
- Package & Mounting — Surface-mount 256-ball LFBGA / CSPBGA package; supplier package listed as 256-CABGA (14×14 mm).
- Operating Conditions — Commercial grade operation from 0 °C to 85 °C with a specified supply range of 1.71 V to 3.465 V.
- Standards & Testability — IEEE 1149.1 boundary scan support for board-level testability.
- RoHS Compliant — Device meets RoHS requirements.
Typical Applications
- Glue Logic and Board Control — Implement power-up sequencing, reset management and system glue logic with instant-on, single-chip non-volatile configuration.
- Bus Bridging and Interfacing — High I/O count and flexible I/O standards make this device suitable for translating and bridging between different bus technologies.
- Peripheral and Interface Control — Use for LCD, sensor, or peripheral control where multiple I/Os and configurable I/O standards are required.
- System Control and State Machines — Implement control logic, finite state machines and control-plane functions that benefit from reconfiguration and onboard memory.
- In-field Updates — Take advantage of TransFR reconfiguration to update SRAM-based logic in the field while the system remains operational.
Unique Advantages
- Single-chip Non-volatile Solution: Eliminates the need for external configuration memory and enables microsecond-scale power-up.
- High I/O-to-Logic Ratio: 211 I/Os paired with 2,280 logic elements deliver practical connectivity for dense interface and control tasks.
- Flexible, Industry-standard I/Os: Programmable I/O supports a wide range of voltage levels and differential interfaces for board-level flexibility.
- Field Reconfiguration: Background programming and TransFR capabilities enable updates and feature changes without full system downtime.
- Low-power Standby: Sleep mode offers substantial static current reduction to help meet standby power targets.
- Surface-mount, Compact Package: 256-ball BGA packaging provides a compact footprint for space-constrained designs while maintaining high pin count.
Why Choose LCMXO2280C-4B256C?
The LCMXO2280C-4B256C positions itself as a versatile MachXO family member for designs that require reliable, instant-on non-volatile logic with substantial I/O capability. With 2,280 logic elements, 211 I/Os, and on-chip RAM, it addresses board-level control, interface bridging and glue logic needs in commercial applications while supporting in-field updates and low-power standby.
Designed for engineers who need a compact, reconfigurable and testable solution, this MachXO device is supported by the MachXO family architecture and development tools to simplify implementation and migration within the family.
Request a quote or submit your requirements to start procurement for the LCMXO2280C-4B256C and evaluate how it fits your next control or interface design.

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