LCMXO2280C-4B256C

IC FPGA 211 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA

Quantity 266 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGA, CSPBGANumber of I/O211Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-4B256C – MachXO Field Programmable Gate Array (FPGA)

The LCMXO2280C-4B256C is a MachXO family FPGA from Lattice Semiconductor Corporation designed for single-chip, non-volatile logic integration. It combines a high I/O count with 2,280 logic elements to address glue logic, bus bridging, bus interfacing, power-up control and general control logic in commercial electronic systems.

As a MachXO device, it supports instant-on operation without external configuration memory, in-field reconfiguration, and flexible I/O standards—making it suitable for applications that require fast startup, secure configuration, and plenty of I/O connectivity in a compact surface-mount package.

Key Features

  • Logic Capacity — 2,280 logic elements (LUT4s) to implement glue logic, state machines and control functions.
  • On-chip Memory — Total on-chip RAM of 28,262 bits for small data buffers and state storage; consult the MachXO family datasheet for embedded/distributed RAM details.
  • I/O Density — 211 I/Os to support wide external connectivity and complex board-level interfaces.
  • Non-volatile, Instant-on — Single-chip non-volatile architecture that powers up in microseconds without the need for external configuration memory.
  • Reconfiguration & Programming — In-field reconfiguration capability and support for background programming; JTAG programmable and IEEE 1532 compliant for in-system programming.
  • Low-Power Modes — Sleep mode provides significant static current reduction to lower standby power consumption.
  • Flexible I/O Standards — Programmable I/O supporting LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS for broad interface compatibility.
  • Clocking — Up to two analog PLLs for clock multiplication, division and phase adjustment.
  • Package & Mounting — Surface-mount 256-ball LFBGA / CSPBGA package; supplier package listed as 256-CABGA (14×14 mm).
  • Operating Conditions — Commercial grade operation from 0 °C to 85 °C with a specified supply range of 1.71 V to 3.465 V.
  • Standards & Testability — IEEE 1149.1 boundary scan support for board-level testability.
  • RoHS Compliant — Device meets RoHS requirements.

Typical Applications

  • Glue Logic and Board Control — Implement power-up sequencing, reset management and system glue logic with instant-on, single-chip non-volatile configuration.
  • Bus Bridging and Interfacing — High I/O count and flexible I/O standards make this device suitable for translating and bridging between different bus technologies.
  • Peripheral and Interface Control — Use for LCD, sensor, or peripheral control where multiple I/Os and configurable I/O standards are required.
  • System Control and State Machines — Implement control logic, finite state machines and control-plane functions that benefit from reconfiguration and onboard memory.
  • In-field Updates — Take advantage of TransFR reconfiguration to update SRAM-based logic in the field while the system remains operational.

Unique Advantages

  • Single-chip Non-volatile Solution: Eliminates the need for external configuration memory and enables microsecond-scale power-up.
  • High I/O-to-Logic Ratio: 211 I/Os paired with 2,280 logic elements deliver practical connectivity for dense interface and control tasks.
  • Flexible, Industry-standard I/Os: Programmable I/O supports a wide range of voltage levels and differential interfaces for board-level flexibility.
  • Field Reconfiguration: Background programming and TransFR capabilities enable updates and feature changes without full system downtime.
  • Low-power Standby: Sleep mode offers substantial static current reduction to help meet standby power targets.
  • Surface-mount, Compact Package: 256-ball BGA packaging provides a compact footprint for space-constrained designs while maintaining high pin count.

Why Choose LCMXO2280C-4B256C?

The LCMXO2280C-4B256C positions itself as a versatile MachXO family member for designs that require reliable, instant-on non-volatile logic with substantial I/O capability. With 2,280 logic elements, 211 I/Os, and on-chip RAM, it addresses board-level control, interface bridging and glue logic needs in commercial applications while supporting in-field updates and low-power standby.

Designed for engineers who need a compact, reconfigurable and testable solution, this MachXO device is supported by the MachXO family architecture and development tools to simplify implementation and migration within the family.

Request a quote or submit your requirements to start procurement for the LCMXO2280C-4B256C and evaluate how it fits your next control or interface design.

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