LCMXO2280C-3TN100C

IC FPGA 73 I/O 100TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 73 28262 2280 100-LQFP

Quantity 146 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O73Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-3TN100C – MachXO Field Programmable Gate Array (FPGA) IC, 73 I/Os, 2280 Logic Elements, 100‑LQFP

The LCMXO2280C-3TN100C is a MachXO family FPGA optimized for glue logic, bus interfacing, control functions and in-field reconfiguration. It combines non-volatile configuration with a LUT-based architecture providing 2,280 logic elements and embedded memory to address control and interfacing roles in commercial electronic designs.

This surface-mount device is offered in a 100‑pin LQFP/TQFP (14 × 14 mm) package with 73 I/O pins, a supply range that supports common core and I/O voltage points, and a commercial operating range of 0 °C to 85 °C—making it suitable for a wide range of non‑automotive, commercial applications.

Key Features

  • Logic Density 2,280 logic elements (LUT4s) and 285 logic blocks provide flexible logic implementation for glue logic and control tasks.
  • Embedded and Distributed Memory Approximately 28,262 bits of on-chip RAM (sysMEM and distributed RAM) for FIFOs, buffering and small data storage.
  • Instant‑On, Non‑Volatile Configuration Single-chip non‑volatile architecture enables instant-on operation and eliminates external configuration memory.
  • In‑Field Reconfiguration Supports reconfiguring SRAM-based logic in milliseconds and background programming of non‑volatile memory for field updates.
  • Flexible I/O 73 I/Os in the 100‑pin package with programmable I/O buffers supporting common interface standards (multiple VCC levels supported by the family).
  • Clocking Family devices support up to two analog PLLs for clock multiply/divide and phase shifting where applicable.
  • Power and Low‑Power Modes Sleep mode capability enables substantial static current reduction for power-sensitive designs.
  • Package and Mounting 100‑LQFP / 100‑TQFP (14 × 14 mm) surface-mount package; RoHS compliant.
  • Supply and Temperature Voltage supply range listed at 1.71 V to 3.465 V and operating temperature 0 °C to 85 °C (commercial grade).

Typical Applications

  • Glue Logic and Board Control Implement system control, power sequencing and supervisory glue logic using the device’s logic elements and instant‑on non‑volatile configuration.
  • Bus Bridging and Interface Adaptation Use the programmable I/O and available PLLs to bridge and adapt between different logic standards and clock domains.
  • Field Upgradeable Control In-field TransFR reconfiguration and background programming enable updates and fixes to control logic without removing the device.
  • Peripheral and Sensor Interfacing Low-pin-count, high‑flexibility I/O and on‑chip RAM make the device suitable for aggregating sensors, translating signals, and buffering data streams.

Unique Advantages

  • Non‑volatile, instant‑on operation: Eliminates external configuration memory and provides microsecond power‑up for faster system availability.
  • Field reconfiguration capability: Background programming and TransFR allow updates to logic while the system remains operational.
  • Balanced I/O-to-logic ratio: 73 I/Os paired with 2,280 logic elements supports common glue‑logic and interface consolidation tasks.
  • Integrated memory resources: Approximately 28,262 bits of on‑chip RAM for FIFOs and buffering reduces external memory needs.
  • Commercial temperature and RoHS compliance: Designed for commercial applications with 0 °C to 85 °C operating range and RoHS‑compliant packaging.
  • Compact, surface‑mount package: 100‑pin LQFP/TQFP (14 × 14 mm) offers a compact footprint for space‑constrained PCBs.

Why Choose LCMXO2280C-3TN100C?

The LCMXO2280C-3TN100C sits at the intersection of CPLD-style non‑volatile instant-on behavior and FPGA-style LUT-based logic flexibility. With 2,280 logic elements, embedded RAM, instant-on configuration and in-field reprogramming capabilities, it is well suited to designers who need reliable control, interface bridging and field-updateability in commercial products.

Choose this MachXO device when you need a compact, RoHS-compliant FPGA with a balanced mix of I/O, logic capacity and on‑chip memory, all in a 100‑pin surface‑mount package backed by the MachXO family architecture and tools.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the LCMXO2280C-3TN100C.

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