LCMXO2280C-3TN100C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 73 28262 2280 100-LQFP |
|---|---|
| Quantity | 146 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 73 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-3TN100C – MachXO Field Programmable Gate Array (FPGA) IC, 73 I/Os, 2280 Logic Elements, 100‑LQFP
The LCMXO2280C-3TN100C is a MachXO family FPGA optimized for glue logic, bus interfacing, control functions and in-field reconfiguration. It combines non-volatile configuration with a LUT-based architecture providing 2,280 logic elements and embedded memory to address control and interfacing roles in commercial electronic designs.
This surface-mount device is offered in a 100‑pin LQFP/TQFP (14 × 14 mm) package with 73 I/O pins, a supply range that supports common core and I/O voltage points, and a commercial operating range of 0 °C to 85 °C—making it suitable for a wide range of non‑automotive, commercial applications.
Key Features
- Logic Density 2,280 logic elements (LUT4s) and 285 logic blocks provide flexible logic implementation for glue logic and control tasks.
- Embedded and Distributed Memory Approximately 28,262 bits of on-chip RAM (sysMEM and distributed RAM) for FIFOs, buffering and small data storage.
- Instant‑On, Non‑Volatile Configuration Single-chip non‑volatile architecture enables instant-on operation and eliminates external configuration memory.
- In‑Field Reconfiguration Supports reconfiguring SRAM-based logic in milliseconds and background programming of non‑volatile memory for field updates.
- Flexible I/O 73 I/Os in the 100‑pin package with programmable I/O buffers supporting common interface standards (multiple VCC levels supported by the family).
- Clocking Family devices support up to two analog PLLs for clock multiply/divide and phase shifting where applicable.
- Power and Low‑Power Modes Sleep mode capability enables substantial static current reduction for power-sensitive designs.
- Package and Mounting 100‑LQFP / 100‑TQFP (14 × 14 mm) surface-mount package; RoHS compliant.
- Supply and Temperature Voltage supply range listed at 1.71 V to 3.465 V and operating temperature 0 °C to 85 °C (commercial grade).
Typical Applications
- Glue Logic and Board Control Implement system control, power sequencing and supervisory glue logic using the device’s logic elements and instant‑on non‑volatile configuration.
- Bus Bridging and Interface Adaptation Use the programmable I/O and available PLLs to bridge and adapt between different logic standards and clock domains.
- Field Upgradeable Control In-field TransFR reconfiguration and background programming enable updates and fixes to control logic without removing the device.
- Peripheral and Sensor Interfacing Low-pin-count, high‑flexibility I/O and on‑chip RAM make the device suitable for aggregating sensors, translating signals, and buffering data streams.
Unique Advantages
- Non‑volatile, instant‑on operation: Eliminates external configuration memory and provides microsecond power‑up for faster system availability.
- Field reconfiguration capability: Background programming and TransFR allow updates to logic while the system remains operational.
- Balanced I/O-to-logic ratio: 73 I/Os paired with 2,280 logic elements supports common glue‑logic and interface consolidation tasks.
- Integrated memory resources: Approximately 28,262 bits of on‑chip RAM for FIFOs and buffering reduces external memory needs.
- Commercial temperature and RoHS compliance: Designed for commercial applications with 0 °C to 85 °C operating range and RoHS‑compliant packaging.
- Compact, surface‑mount package: 100‑pin LQFP/TQFP (14 × 14 mm) offers a compact footprint for space‑constrained PCBs.
Why Choose LCMXO2280C-3TN100C?
The LCMXO2280C-3TN100C sits at the intersection of CPLD-style non‑volatile instant-on behavior and FPGA-style LUT-based logic flexibility. With 2,280 logic elements, embedded RAM, instant-on configuration and in-field reprogramming capabilities, it is well suited to designers who need reliable control, interface bridging and field-updateability in commercial products.
Choose this MachXO device when you need a compact, RoHS-compliant FPGA with a balanced mix of I/O, logic capacity and on‑chip memory, all in a 100‑pin surface‑mount package backed by the MachXO family architecture and tools.
Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the LCMXO2280C-3TN100C.

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