LCMXO2280C-3T144C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 113 28262 2280 144-LQFP |
|---|---|
| Quantity | 1,109 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 113 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-3T144C – MachXO FPGA, 2,280 Logic Elements, 144‑LQFP
The LCMXO2280C-3T144C is a MachXO non-volatile Field Programmable Gate Array (FPGA) in a 144‑pin LQFP package. It combines FPGA-style look-up table logic with non-volatile configuration for instant-on operation, targeting glue logic, bus bridging, control and interfacing applications where integrated, reconfigurable logic and fast power-up behavior are important.
The device provides 2,280 logic elements, approximately 28,262 bits of on-chip RAM, flexible programmable I/O options and support for background reconfiguration and low-power sleep modes, all in a surface-mount 144‑LQFP package rated for commercial temperature operation.
Key Features
- Core Logic 2,280 logic elements for implementing glue logic, finite-state machines and small FPGA functions.
- On‑chip Memory Approximately 28,262 bits of embedded RAM for distributed and block memory needs.
- Non‑volatile, Instant‑On Single‑chip non‑volatile architecture enables rapid power-up without external configuration memory and supports in-field reconfiguration.
- Reconfiguration and Programming Supports background programming and in-system programming mechanisms for updating non‑volatile memory and SRAM-based logic.
- Flexible I/O Programmable I/O buffers support a wide range of interfaces including multiple LVCMOS voltages, LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS.
- Clocking Up to two integrated analog PLLs for clock multiply/divide and phase adjustment.
- Power and Low Power Modes Sleep mode enables significant static current reduction for low-power states.
- Package & Mounting 144‑LQFP package (supplier device package: 144‑TQFP, 20 × 20 mm), surface mount.
- Supply & Temperature Operates over a supply range of 1.71 V to 3.465 V and rated for commercial ambient temperatures from 0 °C to 85 °C.
- Standards & System Support JTAG-based programming and boundary-scan support; on-board oscillator and IEEE‑1532 compliant in-system programming.
- RoHS Compliance Device is RoHS compliant.
Typical Applications
- Glue Logic and System Control Replace discrete glue logic with reconfigurable logic for board-level control, power sequencing and state machines.
- Bus Bridging and Interfacing Implement bus translators and protocol adapters using the device's flexible I/O and programmable logic.
- User Interface and Peripheral Control Manage LEDs, buttons, sensors and peripheral interfaces with compact, non‑volatile logic that initializes instantly on power-up.
- In‑field Logic Updates Use background programming and TransFR reconfiguration to update logic while the system remains operational.
Unique Advantages
- Instant‑On Non‑Volatile Configuration: Eliminates need for external configuration memory and enables immediate operation at power-up.
- Integrated Memory Resources: On‑chip RAM (≈28,262 bits) supports embedded data buffering and small lookup tables without external RAM.
- Flexible I/O Standards: Programmable sysIO buffers support multiple voltage domains and signaling standards for interface versatility.
- Field Reconfiguration: Background programming and in-system reconfiguration allow in-field updates and iterative development.
- Compact, Surface‑Mount Package: 144‑LQFP (20 × 20 mm) provides a high pin count in a leaded surface‑mount footprint for easy board integration.
- Commercial Temperature Range: Rated for 0 °C to 85 °C for standard commercial applications and deployments.
Why Choose LCMXO2280C-3T144C?
The LCMXO2280C-3T144C positions itself as a compact, non‑volatile FPGA solution for designers needing instant-on reconfigurable logic with integrated memory and flexible I/O. Its 2,280 logic elements, on‑chip RAM and support for multiple interface standards make it suitable for replacing CPLDs or low-capacity FPGAs in glue-logic, interface bridging and control functions.
For teams focused on fast power-up, in-field updates and reducing BOM complexity, this MachXO device offers a single‑chip, RoHS‑compliant alternative that balances integration and reconfigurability while fitting into a 144‑pin surface‑mount package.
Request a quote or submit a purchasing inquiry today to evaluate the LCMXO2280C-3T144C for your next design.

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