LCMXO2280C-3T144C

IC FPGA 113 I/O 144TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 113 28262 2280 144-LQFP

Quantity 1,109 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O113Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-3T144C – MachXO FPGA, 2,280 Logic Elements, 144‑LQFP

The LCMXO2280C-3T144C is a MachXO non-volatile Field Programmable Gate Array (FPGA) in a 144‑pin LQFP package. It combines FPGA-style look-up table logic with non-volatile configuration for instant-on operation, targeting glue logic, bus bridging, control and interfacing applications where integrated, reconfigurable logic and fast power-up behavior are important.

The device provides 2,280 logic elements, approximately 28,262 bits of on-chip RAM, flexible programmable I/O options and support for background reconfiguration and low-power sleep modes, all in a surface-mount 144‑LQFP package rated for commercial temperature operation.

Key Features

  • Core Logic  2,280 logic elements for implementing glue logic, finite-state machines and small FPGA functions.
  • On‑chip Memory  Approximately 28,262 bits of embedded RAM for distributed and block memory needs.
  • Non‑volatile, Instant‑On  Single‑chip non‑volatile architecture enables rapid power-up without external configuration memory and supports in-field reconfiguration.
  • Reconfiguration and Programming  Supports background programming and in-system programming mechanisms for updating non‑volatile memory and SRAM-based logic.
  • Flexible I/O  Programmable I/O buffers support a wide range of interfaces including multiple LVCMOS voltages, LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS.
  • Clocking  Up to two integrated analog PLLs for clock multiply/divide and phase adjustment.
  • Power and Low Power Modes  Sleep mode enables significant static current reduction for low-power states.
  • Package & Mounting  144‑LQFP package (supplier device package: 144‑TQFP, 20 × 20 mm), surface mount.
  • Supply & Temperature  Operates over a supply range of 1.71 V to 3.465 V and rated for commercial ambient temperatures from 0 °C to 85 °C.
  • Standards & System Support  JTAG-based programming and boundary-scan support; on-board oscillator and IEEE‑1532 compliant in-system programming.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Glue Logic and System Control  Replace discrete glue logic with reconfigurable logic for board-level control, power sequencing and state machines.
  • Bus Bridging and Interfacing  Implement bus translators and protocol adapters using the device's flexible I/O and programmable logic.
  • User Interface and Peripheral Control  Manage LEDs, buttons, sensors and peripheral interfaces with compact, non‑volatile logic that initializes instantly on power-up.
  • In‑field Logic Updates  Use background programming and TransFR reconfiguration to update logic while the system remains operational.

Unique Advantages

  • Instant‑On Non‑Volatile Configuration: Eliminates need for external configuration memory and enables immediate operation at power-up.
  • Integrated Memory Resources: On‑chip RAM (≈28,262 bits) supports embedded data buffering and small lookup tables without external RAM.
  • Flexible I/O Standards: Programmable sysIO buffers support multiple voltage domains and signaling standards for interface versatility.
  • Field Reconfiguration: Background programming and in-system reconfiguration allow in-field updates and iterative development.
  • Compact, Surface‑Mount Package: 144‑LQFP (20 × 20 mm) provides a high pin count in a leaded surface‑mount footprint for easy board integration.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C for standard commercial applications and deployments.

Why Choose LCMXO2280C-3T144C?

The LCMXO2280C-3T144C positions itself as a compact, non‑volatile FPGA solution for designers needing instant-on reconfigurable logic with integrated memory and flexible I/O. Its 2,280 logic elements, on‑chip RAM and support for multiple interface standards make it suitable for replacing CPLDs or low-capacity FPGAs in glue-logic, interface bridging and control functions.

For teams focused on fast power-up, in-field updates and reducing BOM complexity, this MachXO device offers a single‑chip, RoHS‑compliant alternative that balances integration and reconfigurability while fitting into a 144‑pin surface‑mount package.

Request a quote or submit a purchasing inquiry today to evaluate the LCMXO2280C-3T144C for your next design.

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