LCMXO2280C-3TN144C

IC FPGA 113 I/O 144TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 113 28262 2280 144-LQFP

Quantity 1,467 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O113Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-3TN144C – MachXO Field Programmable Gate Array (FPGA) IC 113 28262 2280 144-LQFP

The LCMXO2280C-3TN144C is a MachXO family non‑volatile FPGA optimized for glue logic, bus bridging, power‑up control and general control logic. It combines a dense logic fabric with embedded and distributed memory to deliver reconfigurable logic and system interfacing in a single, surface‑mount package.

Key architecture highlights include 2,280 logic elements, approximately 27.6 Kbits of embedded memory, and 113 I/Os—making this device suitable for compact system control, interface bridging, and I/O‑rich designs where instant‑on, single‑chip reconfigurability and compact packaging matter.

Key Features

  • Core Logic  2,280 logic elements (LUT4s) for implementing glue logic, state machines and control functions.
  • Memory  Approximately 27.6 Kbits of embedded block RAM plus distributed RAM resources for FIFOs, buffers and small data storage.
  • I/O and Interfaces  113 user I/O pins in the 144‑pin LQFP package, providing abundant connectivity for interface bridging and peripheral control.
  • Non‑volatile, Instant‑On  Single‑chip non‑volatile architecture enabling microsecond power‑up and on‑chip configuration without external memory.
  • Reconfiguration and Programming  In‑field reconfiguration support and background programming of non‑volatile memory; SRAM‑based logic can be reconfigured in milliseconds via supported programming interfaces.
  • Power and Voltage Support  Operates across a broad supply range from 1.71 V to 3.465 V, enabling use with multiple supply domains.
  • Low‑Power Modes  Sleep mode capability for significant static current reduction during low‑activity periods.
  • Package & Mounting  Commercial‑grade 144‑LQFP surface‑mount package for compact board layouts; specified for 0 °C to 85 °C operation.
  • Standards & Tools  Designed for use with the MachXO family toolchain; supports IEEE 1149.1 boundary scan and in‑system programming standards referenced in the family datasheet.

Typical Applications

  • Glue Logic and System Control  Replace discrete logic and state machines with compact, reconfigurable logic for board‑level control and sequencing.
  • Bus Bridging and Protocol Interfacing  Implement protocol translators and bus interface logic using the device's plentiful I/O and on‑chip memory for buffering.
  • Power‑Up and Reset Management  Centralize power sequencing, reset distribution and supervisory control with instant‑on non‑volatile configuration.
  • Peripheral and Sensor Aggregation  Aggregate signals from multiple peripherals or sensors and perform preprocessing or handshaking before passing data to a host.

Unique Advantages

  • Single‑Chip, Non‑Volatile Configuration: Reduces BOM by eliminating external configuration memory while providing instant‑on behavior.
  • Balanced Logic and Memory Resources: 2,280 logic elements paired with approximately 27.6 Kbits of embedded RAM allow combined control logic and local buffering in one device.
  • High I/O Count in Compact Package: 113 I/Os in a 144‑LQFP package simplifies board routing for I/O‑heavy designs without forcing larger packages.
  • Flexible Voltage Support: Wide supply voltage range (1.71 V to 3.465 V) supports multiple system domains and simplifies power rail integration.
  • In‑Field Reconfiguration: Background programming and rapid reconfiguration enable iterative updates and feature evolution without full system downtime.
  • Commercial Temperature Rating: Specified for 0 °C to 85 °C for mainstream commercial applications.

Why Choose LCMXO2280C-3TN144C?

The LCMXO2280C-3TN144C positions itself as a compact, reconfigurable solution for designers needing a single‑chip approach to glue logic, interface bridging, and system control. Its combination of 2,280 logic elements, substantial on‑chip memory, and 113 I/Os in a 144‑LQFP package delivers a practical balance of integration, connectivity and board‑level simplicity for commercial applications.

Supported by the MachXO family design flow referenced in the family datasheet, this device is suited to engineering teams looking for rapid configuration, in‑field update capability and a smaller BOM while maintaining the flexibility to migrate or iterate designs over time.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the LCMXO2280C-3TN144C. Provide your required quantities and delivery timeframe for fastest response.

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