LCMXO2280C-4BN256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 265 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 211 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-4BN256C – MachXO FPGA, 2280 logic elements, 256-LFBGA
The LCMXO2280C-4BN256C is a MachXO family Field Programmable Gate Array (FPGA) in a 256-ball LFBGA (caBGA) package optimized for glue logic, bus bridging, power-up control and general system control functions. Built on a non-volatile MachXO architecture, this device combines instant-on single-chip configuration, flexible I/O and embedded memory to simplify board-level design for commercial applications.
Key Features
- Core Logic 2,280 logic elements (LUTs) for implementing glue logic and control functions with a high I/O-to-logic density.
- Embedded Memory Approximately 28 Kbits of on-chip RAM (Total Ram Bits: 28262) plus distributed RAM resources for FIFOs and buffering.
- Non-volatile, Instant‑on Configuration Single-chip non-volatile configuration provides instant-on behavior (powers up in microseconds) and eliminates the need for external configuration memory.
- In-system Reconfiguration Supports background programming and TransFR™ reconfiguration for in-field logic updates while the system operates.
- Flexible I/O 211 user I/Os with programmable buffer support for multiple interface standards and a wide operating voltage range (1.71 V to 3.465 V).
- Clocking Up to two analog PLLs per device for clock multiply/divide and phase shifting (family capability documented in datasheet).
- Low Power Modes Sleep mode is available to reduce static current consumption (up to 100× reduction described in family datasheet).
- Package and Mounting 256-ball LFBGA (caBGA) surface-mount package; supplier device package specified as 256-CABGA (14×14 mm).
- Commercial Grade Rated for commercial temperature range, 0 °C to 85 °C, and RoHS compliant.
Typical Applications
- Glue Logic and System Control Replace discrete glue logic with a compact FPGA implementation to consolidate control paths and reduce PCB complexity.
- Bus Bridging and Interfacing Implement protocol bridging and bus interfacing using the device’s flexible I/O standards and ample I/O count.
- Power-up and Reset Sequencing Use non-volatile instant-on configuration for reliable power-up control and deterministic system initialization.
- In-field Logic Updates Enable field upgrades and incremental feature deployment using background programming and TransFR reconfiguration.
Unique Advantages
- Single-chip configuration: Eliminates external configuration memory, simplifying BOM and board layout.
- Instant-on capability: Powers up in microseconds for fast system initialization and predictable behavior at boot.
- High I/O-to-logic density: 211 I/Os paired with 2,280 logic elements enables complex interfacing without large FPGA footprints.
- In-field reconfigurability: Background programming and TransFR allow updates while systems remain operational, reducing downtime.
- Flexible voltage support: Operates across a wide supply range (1.71 V to 3.465 V), supporting multiple I/O standards and board-level power schemes.
- Commercial temperature and RoHS compliance: Designed for commercial applications with documented operating range and environmental compliance.
Why Choose LCMXO2280C-4BN256C?
The LCMXO2280C-4BN256C positions itself as a compact, non-volatile FPGA option for designers who need instant-on behavior, strong I/O capability and embedded memory without external configuration devices. Its combination of approximately 2,280 logic elements, ~28 Kbits of on-chip RAM, and 211 I/Os in a 256-ball LFBGA package makes it well suited to system control, bus interfacing and in-field upgradable designs.
Designed with system integration and lifecycle flexibility in mind, this MachXO device is supported by the MachXO family design resources for synthesis, place-and-route and in-system programming, helping accelerate time-to-market and simplify design migrations within the MachXO family.
Request a quote or submit an inquiry for pricing and availability to evaluate the LCMXO2280C-4BN256C for your next design.