LCMXO2280C-4FT256I

The LCMXO2280C-4FT256I is a MachXO family FPGA combining non-volatile, instantly available configuration with FPGA-style LUT-based logic. It delivers 2,280 logic elements and up to 211 I/Os in a 256-ball ftBGA (17×17) package, targeted for applications that require glue logic, bus bridging and interfacing, power-up control and general control logic in industrial environments.

As a single-chip, reconfigurable device with onboard memory and programmable I/O, it reduces board-level complexity while providing in-field reconfiguration and low-power modes for system-level flexibility and reliability.

Key Features

• Core Logic — 2,280 logic elements (LUT4-based architecture) providing ample resources for glue logic and control tasks.
• I/O Density — 211 I/Os available in the 256-ball ftBGA (17×17) package to support complex interfacing and bus implementations.
• On-chip Memory — Total on-chip RAM: 28,262 bits (≈27.6 Kbits) for embedded and distributed memory needs, with dedicated FIFO control logic.
• Non-volatile, Instant-on Configuration — Single-chip non-volatile design enables instant-on operation and eliminates the need for external configuration memory.
• Reconfiguration & Programming — Supports in-field reconfiguration (TransFR) and background programming of non-volatile memory; JTAG programmability and IEEE 1532 compliant in-system programming.
• Low Power Modes — Sleep mode available for significant static current reduction to support power-sensitive designs.
• Flexible sysIO™ Buffer — Programmable I/O supports a wide range of interfaces including multiple LVCMOS voltage levels, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS (as supported by the MachXO family).
• Clocking — Up to two analog PLLs for clock multiply/divide and phase shifting to support diverse timing schemes.
• System Features — Onboard oscillator and IEEE 1149.1 boundary-scan support for board-level testability.
• Package & Assembly — Surface-mount 256-LBGA / supplier package 256-FTBGA (17×17) suited for space-efficient, high-pin-count designs.
• Power & Temperature — Operates from 1.71 V to 3.465 V and qualified to industrial-grade operating temperatures from −40 °C to 100 °C.
• Environmental — RoHS compliant packaging.

Typical Applications

• Glue Logic — Implement control glue logic and signal conditioning between ASICs, MCUs and discrete peripherals with compact on-chip logic and I/O.
• Bus Bridging and Interfacing — Bridge and adapt between different bus standards and voltage domains using abundant I/Os and programmable sysIO buffers.
• Power-Up and System Control — Manage power sequencing, reset and initialization tasks with instant-on non-volatile configuration and low-power sleep modes.
• Control Logic — Replace multiple discrete logic devices with a single reconfigurable FPGA to simplify BOM and board routing in industrial control implementations.

Unique Advantages

• Instant-on, single-chip configuration: Eliminates external configuration memory and enables immediate startup behavior for faster system availability.
• High I/O-to-logic density: 211 I/Os paired with 2,280 logic elements allow complex interfacing and protocol handling without large external glue logic.
• In-field reconfiguration: TransFR reconfiguration and JTAG programmability enable updates and logic changes without removing the device from the system.
• Flexible I/O standards: Programmable sysIO buffers support multiple signaling standards and voltage levels to ease integration across mixed-voltage systems.
• Industrial readiness: Wide supply range (1.71–3.465 V) and an operating range of −40 °C to 100 °C support deployment in industrial temperature environments.
• Reduced system complexity: On-chip memory, PLLs and onboard oscillator reduce the need for external components, lowering BOM and simplifying layout.

Why Choose LCMXO2280C-4FT256I?

The LCMXO2280C-4FT256I positions itself as a versatile, industrial-grade MachXO FPGA for designs that require instant-on capability, extensive I/O, and field reconfigurability. Its combination of non-volatile configuration, on-chip memory, and flexible I/O makes it suitable for replacing discrete logic arrays and simplifying system architecture.

Engineers designing bus interfaces, power sequencing, or embedded control logic will find the device’s package, power range, and temperature rating align with industrial application requirements while providing upgrade paths via in-system programming and background memory updates.

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