LCMXO2280C-4B256I

IC FPGA 211 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA

Quantity 226 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGA, CSPBGANumber of I/O211Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-4B256I – MachXO FPGA, 2280 logic elements, 211 I/Os, 256-ball LFBGA/caBGA

The LCMXO2280C-4B256I is a MachXO family field programmable gate array (FPGA) featuring 2280 logic elements and 211 user I/Os in a 256-ball surface-mount package. The device combines non-volatile, instant-on operation with FPGA-style LUT-based logic and embedded memory to address glue logic, bus bridging, bus interfacing, power-up control and general control logic.

Designed for industrial-grade applications, the device supports a wide supply voltage range and an extended operating temperature range, offering integration and configurability for systems that require on-chip memory, flexible I/O and in-field reconfiguration.

Key Features

  • Core Logic: 2280 logic elements (LUT4 architecture) suitable for glue logic and mid-density control implementations.
  • On-chip Memory: Approximately 27.6 Kbits of embedded block RAM (total RAM bits specified as 28,262) plus distributed RAM resources for buffering and small data storage.
  • I/O Density: 211 I/O pins, providing high pin-to-logic ratio for bus interfacing and signal routing in compact systems.
  • Non-volatile & Instant-on: Single-chip, non-volatile architecture enabling instant-on operation without external configuration memory and in-field reconfiguration capability.
  • Reconfiguration & Power Modes: TransFR™ reconfiguration for in-field logic updates while the system operates and a Sleep Mode that enables up to 100× static current reduction.
  • Programmable I/O Buffer: sysIO™ supports multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS for interface flexibility.
  • Clocking: Up to two analog sysCLOCK™ PLLs for clock multiply/divide and phase shifting.
  • Package & Mounting: Surface-mount 256-ball package (supplier device package: 256-caBGA 14×14 mm; package case listed as 256-LFBGA, CSPBGA) for compact board integration.
  • Voltage & Temperature: Supply voltage range 1.71 V to 3.465 V and operating temperature range of −40 °C to 100 °C for industrial deployment.
  • Standards & Compliance: RoHS compliant packaging and IEEE 1149.1 boundary-scan and IEEE 1532 in-system programming support (per MachXO family datasheet).

Typical Applications

  • Glue Logic and System Control: Implement low- to mid-density glue logic, power-up sequencing and control-state machines with instant-on non-volatile operation.
  • Bus Bridging and Interfacing: Use the high I/O count and programmable I/O standards to bridge buses and translate between interfaces in mixed-voltage systems.
  • Embedded Control and Peripheral Management: Manage peripherals, implement custom control functions and offload simple processing tasks using on-chip logic and embedded RAM.
  • In-field Updatable Systems: Leverage TransFR reconfiguration to update logic in deployed systems without taking the entire system offline.

Unique Advantages

  • Non-volatile instant-on: Eliminates the need for external configuration memory and enables immediate availability of logic at power-up.
  • High I/O-to-logic density: 211 I/Os paired with 2280 logic elements balance interface flexibility with compact logic capacity for board-level integration.
  • In-field reconfiguration capability: TransFR allows logic updates while the system operates, reducing downtime for field upgrades.
  • Low-power operation modes: Sleep Mode can reduce static current consumption significantly, aiding power-sensitive designs.
  • Flexible interface support: Programmable sysIO buffers support a broad set of I/O standards to simplify multi-voltage and differential interface designs.
  • Industrial temperature range: Rated for −40 °C to 100 °C operation to meet many industrial application requirements.

Why Choose LCMXO2280C-4B256I?

The LCMXO2280C-4B256I positions itself as a compact, industrial-grade MachXO FPGA offering non-volatile, instant-on capability combined with FPGA-style logic and on-chip memory. It is suited for designs that require flexible I/O, reliable power-up behavior and the ability to perform in-field updates without external configuration storage.

Supported by the MachXO family design environment and tools referenced in the product datasheet, this device is targeted at engineers needing a single-chip solution for control logic, bus interfacing and embedded buffer/storage in industrial systems.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO2280C-4B256I and discuss how it can fit your next design.

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