LCMXO2280C-4B256I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 226 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 211 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-4B256I – MachXO FPGA, 2280 logic elements, 211 I/Os, 256-ball LFBGA/caBGA
The LCMXO2280C-4B256I is a MachXO family field programmable gate array (FPGA) featuring 2280 logic elements and 211 user I/Os in a 256-ball surface-mount package. The device combines non-volatile, instant-on operation with FPGA-style LUT-based logic and embedded memory to address glue logic, bus bridging, bus interfacing, power-up control and general control logic.
Designed for industrial-grade applications, the device supports a wide supply voltage range and an extended operating temperature range, offering integration and configurability for systems that require on-chip memory, flexible I/O and in-field reconfiguration.
Key Features
- Core Logic: 2280 logic elements (LUT4 architecture) suitable for glue logic and mid-density control implementations.
- On-chip Memory: Approximately 27.6 Kbits of embedded block RAM (total RAM bits specified as 28,262) plus distributed RAM resources for buffering and small data storage.
- I/O Density: 211 I/O pins, providing high pin-to-logic ratio for bus interfacing and signal routing in compact systems.
- Non-volatile & Instant-on: Single-chip, non-volatile architecture enabling instant-on operation without external configuration memory and in-field reconfiguration capability.
- Reconfiguration & Power Modes: TransFR™ reconfiguration for in-field logic updates while the system operates and a Sleep Mode that enables up to 100× static current reduction.
- Programmable I/O Buffer: sysIO™ supports multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS for interface flexibility.
- Clocking: Up to two analog sysCLOCK™ PLLs for clock multiply/divide and phase shifting.
- Package & Mounting: Surface-mount 256-ball package (supplier device package: 256-caBGA 14×14 mm; package case listed as 256-LFBGA, CSPBGA) for compact board integration.
- Voltage & Temperature: Supply voltage range 1.71 V to 3.465 V and operating temperature range of −40 °C to 100 °C for industrial deployment.
- Standards & Compliance: RoHS compliant packaging and IEEE 1149.1 boundary-scan and IEEE 1532 in-system programming support (per MachXO family datasheet).
Typical Applications
- Glue Logic and System Control: Implement low- to mid-density glue logic, power-up sequencing and control-state machines with instant-on non-volatile operation.
- Bus Bridging and Interfacing: Use the high I/O count and programmable I/O standards to bridge buses and translate between interfaces in mixed-voltage systems.
- Embedded Control and Peripheral Management: Manage peripherals, implement custom control functions and offload simple processing tasks using on-chip logic and embedded RAM.
- In-field Updatable Systems: Leverage TransFR reconfiguration to update logic in deployed systems without taking the entire system offline.
Unique Advantages
- Non-volatile instant-on: Eliminates the need for external configuration memory and enables immediate availability of logic at power-up.
- High I/O-to-logic density: 211 I/Os paired with 2280 logic elements balance interface flexibility with compact logic capacity for board-level integration.
- In-field reconfiguration capability: TransFR allows logic updates while the system operates, reducing downtime for field upgrades.
- Low-power operation modes: Sleep Mode can reduce static current consumption significantly, aiding power-sensitive designs.
- Flexible interface support: Programmable sysIO buffers support a broad set of I/O standards to simplify multi-voltage and differential interface designs.
- Industrial temperature range: Rated for −40 °C to 100 °C operation to meet many industrial application requirements.
Why Choose LCMXO2280C-4B256I?
The LCMXO2280C-4B256I positions itself as a compact, industrial-grade MachXO FPGA offering non-volatile, instant-on capability combined with FPGA-style logic and on-chip memory. It is suited for designs that require flexible I/O, reliable power-up behavior and the ability to perform in-field updates without external configuration storage.
Supported by the MachXO family design environment and tools referenced in the product datasheet, this device is targeted at engineers needing a single-chip solution for control logic, bus interfacing and embedded buffer/storage in industrial systems.
Request a quote or submit an inquiry to receive pricing and availability for the LCMXO2280C-4B256I and discuss how it can fit your next design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016