LCMXO2280C-3TN100I

The LCMXO2280C-3TN100I is a MachXO family field programmable gate array (FPGA) device offering non-volatile, instant-on operation and flexible logic and I/O capabilities. Its architecture combines LUT-based logic with embedded and distributed memory to address glue logic, bus bridging/interfacing, power-up control and general control-logic functions in industrial applications.

Designed for single-chip implementations where in-system reconfiguration, low-latency I/O and compact package options matter, the device delivers a balance of logic density, on-chip memory and I/O count for space-constrained embedded systems.

Key Features

• Non-volatile, instant-on architecture – Single-chip non-volatile design enables power-up in microseconds without external configuration memory and supports in-field reconfiguration of SRAM-based logic.
• Logic density – 2,280 logic elements (LUT4s) suitable for glue logic, control paths and medium-complexity FPGA tasks.
• On-chip memory – Approximately 27.6 Kbits (28,262 bits) of embedded and distributed RAM for FIFOs, small buffers and local data storage.
• I/O and package – 73 I/Os in the 100-pin package; package information includes 100-LQFP with supplier device package listed as 100-TQFP (14×14 mm).
• Flexible I/O buffer support – Family-level programmable sysIO buffers support multiple interface standards (LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, RSDS) for broad interface compatibility.
• Reconfiguration and programming – Supports JTAG programming and background programming of non-volatile memory; TransFR™ in-field reconfiguration enables logic updates while the system operates.
• Clocking – Up to two analog PLLs per device for clock multiply/divide and phase shifting (family-level capability).
• Low-power modes – Sleep mode provides up to 100× static current reduction (family-level feature), aiding low-power designs.
• Supply and temperature range – Operates from 1.71 V to 3.465 V and rated for industrial temperatures from −40 °C to 100 °C.
• System-level support – IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support, plus device-level features such as an onboard oscillator (family-level features).

Typical Applications

• Glue logic and control paths – Implement glue logic between system blocks and small control-state machines without external configuration memory.
• Bus bridging and interfacing – Bridge and translate between bus standards or create interface logic leveraging flexible I/O buffer support.
• Power-up and system control – Power sequencing, reset control and supervisory logic that benefit from instant-on, non-volatile operation.
• Peripheral and I/O management – Consolidate peripheral interfaces, manage multiple I/Os and provide small on-chip buffering using embedded RAM resources.
• In-field reconfigurable logic – Update or extend device logic in the field using TransFR™ reconfiguration while the system remains operational.

Unique Advantages

• Instant-on, single-chip solution: Non-volatile configuration eliminates the need for external configuration memory and enables rapid power-up.
• Balanced logic and I/O: 2,280 logic elements and 73 I/Os in a 100-pin package provide a compact option for mid-density designs.
• Flexible power operation: Wide supply range (1.71 V–3.465 V) supports multiple system voltage domains without extra level-shifting components.
• Field update capability: TransFR™ reconfiguration and background non-volatile memory programming allow in-field logic changes with minimal downtime.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C for robust deployed systems.
• Toolchain and migration support: Family-level support for ispLEVER design tools and density migration simplifies development and scaling across MachXO devices.

Why Choose LCMXO2280C-3TN100I?

The LCMXO2280C-3TN100I offers a practical balance of medium FPGA logic density, on-chip RAM and a substantial I/O count in a compact 100‑pin package. Its non-volatile instant-on behavior, in-field reconfiguration capability and industrial temperature rating make it well suited for embedded control, interface consolidation and system supervision tasks where rapid startup and reliable operation matter.

Supported by MachXO family design flows (ispLEVER) and family-level features such as programmable I/O buffers, PLLs and standard in-system programming interfaces, this device provides a clear migration path and tooling support for developers targeting glue logic, bus interfacing and control applications.

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