LCMXO2280C-3T144I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 113 28262 2280 144-LQFP |
|---|---|
| Quantity | 513 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 113 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-3T144I – MachXO Field Programmable Gate Array (FPGA) IC 113 I/Os 28,262 bits 2,280 logic elements 144-LQFP
The LCMXO2280C-3T144I is a MachXO family FPGA providing non-volatile, instant-on programmable logic in a single-chip solution. It combines 2,280 logic elements with 28,262 bits of on-chip RAM and up to 113 I/Os in a 144-pin LQFP/TQFP (20×20 mm) package for industrial-grade embedded designs.
Designed for control, glue-logic and interface tasks, this device delivers single-chip configuration (no external configuration memory required), configurable I/O signaling, and in-field reconfiguration capabilities to streamline board-level integration and accelerate time to market.
Key Features
- Core & Logic — 2,280 logic elements for implementing glue logic, control state machines and bus interfacing functions.
- On-chip Memory — 28,262 bits of total on-chip RAM to support distributed and embedded memory requirements within the design.
- I/O Flexibility — 113 I/Os with a programmable sysIO™ buffer supporting LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS signaling options.
- Non-volatile, Instant-on — Single-chip, non-volatile architecture enables instant-on behavior and eliminates the need for external configuration memory.
- Reconfiguration & In-System Programming — Supports TransFR™ in-field reconfiguration and IEEE 1532-compliant in-system programming; SRAM and non-volatile memory are programmable through JTAG.
- Clocks & Timing — Up to two analog sysCLOCK™ PLLs per device for clock multiplication, division and phase shifting.
- Power & Low Power Modes — Operates across a wide supply range (1.71 V to 3.465 V) and includes a Sleep Mode for significant static current reduction.
- System Support — Features onboard oscillator and IEEE 1149.1 boundary-scan support for system-level test and integration.
- Package & Temperature — Industrial-grade device in a 144-LQFP / 144-TQFP (20×20 mm) package, rated for −40 °C to 100 °C operation; RoHS compliant.
Typical Applications
- Glue Logic & Board-Level Control — Implement control state machines, reset sequencing and power-up control without external configuration components.
- Bus Bridging & Interface Bridging — Use the flexible I/O buffer and 113 I/Os to bridge between different signaling standards and bus domains.
- Peripheral & Sensor Interfacing — Integrate multiple peripheral interfaces and sensor front-ends with on-chip memory and programmable I/O.
- Configuration & Security — Single-chip non-volatile configuration provides instant-on behavior and reduces system BOM while maintaining configuration security.
Unique Advantages
- Single-chip, non-volatile solution: Eliminates external configuration memory and enables instant-on power-up measured in microseconds.
- Flexible, multi-voltage I/O: Programmable sysIO™ buffer supports a wide range of signaling levels and standards, reducing the need for level translators.
- Field updatable logic: TransFR™ reconfiguration and JTAG-programmable non-volatile memory let you update logic in the field without system downtime.
- Compact package for industrial use: 144-LQFP/TQFP packaging combined with −40 °C to 100 °C rating supports space-constrained, industrial applications.
- Integrated clocking: Up to two PLLs provide on-chip clock management for synchronized, deterministic designs.
- Reduced BOM and simplified design: On-chip RAM, oscillator and system-level features minimize external components and simplify board design.
Why Choose LCMXO2280C-3T144I?
The LCMXO2280C-3T144I positions itself as a practical, industrial-grade FPGA for designs that require reliable, instant-on programmable logic, flexible I/O and in-field update capability. With 2,280 logic elements, 28,262 bits of on-chip RAM and up to 113 I/Os in a 144-pin package, it is well suited for control, interface bridging and board-level integration where single-chip configuration and configurable signaling are priorities.
Engineers benefit from built-in system features such as PLLs, onboard oscillator and boundary-scan, and from design-tool support for efficient implementation and timing verification. The combination of non-volatile configuration, Sleep Mode for reduced static current, and extended temperature rating makes this device a dependable choice for industrial embedded systems.
Request a quote or submit an inquiry to receive pricing, availability and technical support for LCMXO2280C-3T144I. Our team can provide configuration options and help integrate this MachXO FPGA into your design.