LCMXO2280C-3MN132I

The LCMXO2280C-3MN132I is a MachXO family non-volatile FPGA optimized for glue logic, bus bridging, power-up control and general control logic. This industrial-grade, surface-mount device combines instant-on non-volatile configuration with a compact 132-ball CSPBGA package and 101 user I/Os for space- and power-constrained embedded systems.

Built on the MachXO architecture, the device delivers 2,280 LUT4 logic elements and 28,262 bits of on-chip RAM (embedded and distributed), with features geared for secure, instant-on system control and in-field reconfiguration.

Key Features

• Core Logic  2,280 LUT4 logic elements provide programmable combinational and sequential resources for glue logic, state machines and control functions.
• Non-Volatile Instant-On  Single-chip non-volatile configuration enables immediate power-up operation without external configuration memory.
• On-Chip Memory  28,262 bits total of on-chip RAM, including embedded block RAM and distributed RAM for FIFOs, buffers and small data storage.
• Reconfiguration & Programming  Supports in-system programming and background/non-disruptive programming workflows; TransFR™ Reconfiguration capability allows in-field logic updates while the system operates.
• Clock Management  Up to two analog PLLs per device for clock multiplication, division and phase shifting.
• Flexible I/O  101 user I/Os in the 132-ball CSPBGA package; sysIO™ buffer options support multiple nominal I/O standards (per family datasheet).
• Power & Sleep  Operates across a wide supply range and includes a sleep mode for significant static current reduction.
• Package & Mounting  132-LFBGA (132-CSPBGA, 8×8 mm) surface-mount package suitable for compact board layouts.
• Industrial Temperature Range  Rated for −40°C to 100°C operation to meet industrial environment requirements.
• Regulatory  RoHS compliant packaging.

Typical Applications

• Glue Logic and System Control  Implement bus glue, address decoding, reset sequencing and power-up control with instant-on, single-chip configuration.
• Bus Bridging and Interface Adaptation  Bridge or translate between legacy and modern interfaces using the device’s flexible I/O and reconfigurable logic.
• Embedded Control  Use for user interface control, state machines and supervisory logic where non-volatile instant-on behavior is required.
• Field Upgradeable Systems  Leverage in-field reconfiguration to update logic while the system remains in operation, reducing downtime during maintenance.

Unique Advantages

• Instant-On Non-Volatile Configuration: Eliminates the need for external configuration memory and enables immediate operation after power-up.
• Compact, High I/O Density Package: 101 I/Os in a 132-ball CSPBGA (8×8 mm) provide a small footprint without sacrificing connectivity.
• On-Chip Memory Resources: 28,262 bits of embedded and distributed RAM support buffering, FIFOs and small data storage without external RAM.
• Field Reconfiguration: TransFR™ capability and in-system programming allow updates and background programming for long-lived products.
• Industrial Operating Range: Rated −40°C to 100°C to support a wide range of industrial environments and deployments.
• Flexible Clocking: Up to two analog PLLs for clock conditioning and timing control within embedded systems.

Why Choose LCMXO2280C-3MN132I?

The LCMXO2280C-3MN132I positions itself as a compact, industrial-grade, non-volatile FPGA for embedded control, interface bridging and glue logic applications. With 2,280 LUT4 logic elements, on-chip RAM, flexible I/O in a 132-CSPBGA package and instant-on configuration, it simplifies BOM and shortens system boot time while enabling in-field updates.

Engineers requiring reliable, reconfigurable logic with a small footprint and broad supply-voltage support can leverage this device to reduce external components, streamline power-up behavior and maintain long-term flexibility through background and in-system programming.

Request a quote or submit a quote to get pricing and availability for the LCMXO2280C-3MN132I and evaluate how it fits your next embedded control or interface design.