LCMXO2280C-3FTN324I

IC FPGA 271 I/O 324FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA

Quantity 1,080 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package324-FTBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LBGANumber of I/O271Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-3FTN324I – MachXO Field Programmable Gate Array (FPGA), 2280 logic elements, 271 I/O, 324-ball BGA

The LCMXO2280C-3FTN324I is a MachXO family FPGA IC from Lattice Semiconductor offering non‑volatile, instant‑on programmable logic in a single, surface‑mount package. It combines 2,280 logic elements and 285 configurable logic blocks with flexible I/O and on‑chip memory to address glue logic, bus interfacing, control and system supervisory functions in industrial applications.

With a wide supply voltage range (1.71 V to 3.465 V), industrial temperature rating (−40 °C to 100 °C), and a high‑pincount 324‑ball package, this device suits designs requiring compact, reconfigurable control and interface logic with robust environmental tolerance.

Key Features

  • Core Logic — 2,280 logic elements and 285 logic blocks (CLBs) for implementing control, glue logic, and custom finite state machines.
  • On‑Chip Memory — Total on‑chip RAM: 28,262 bits for embedded and distributed storage used by FIFOs, small buffers, and state storage.
  • High I/O Count — Up to 271 I/O pins to support dense peripheral, bus, and multi‑lane interface requirements.
  • Non‑volatile, Instant‑on Architecture — MachXO family features include single‑chip non‑volatile configuration and instant power‑up, enabling immediate operation without external configuration memory.
  • Reconfiguration and Power Modes — Family capabilities include in‑field reconfiguration and a sleep mode to reduce static current for low‑power standby.
  • Clocking — Up to two analog PLLs available for clock multiply/divide and phase adjustments (MachXO family capability).
  • Supply and Mounting — Operates from 1.71 V to 3.465 V and is provided in a surface‑mount 324‑ball package (package case: 324‑LBGA; supplier device package: 324‑FTBGA, 19×19 mm).
  • Industrial Temperature Range — Rated for −40 °C to 100 °C operation for systems deployed in demanding environments.
  • RoHS Compliant — Lead‑free, RoHS‑compliant device packaging.

Typical Applications

  • Glue Logic and System Interfacing — Implement bus bridging, level translation, and protocol adaptation between subsystems using abundant I/Os and programmable logic.
  • Power‑Up and Reset Control — Manage power sequencing, supervisory functions, and deterministic startup with instant‑on capability and non‑volatile configuration.
  • Control and Timing Logic — Embed custom control state machines, timing controllers, and peripheral interfaces using the device’s logic elements and PLLs.
  • Field Upgrades and In‑Field Reconfiguration — Support in‑field logic updates while the system operates through MachXO family reconfiguration features.

Unique Advantages

  • Single‑Chip Non‑Volatile Solution: Instant‑on behavior eliminates external configuration memory and simplifies system startup and security.
  • High Pin‑Count Flexibility: 271 I/Os enable consolidation of multiple glue‑logic devices into one FPGA, reducing BOM and board area.
  • Industrial Reliability: −40 °C to 100 °C rating and surface‑mount 324‑ball package provide robust operation in industrial environments.
  • Compact Embedded Memory: 28,262 bits of on‑chip RAM support small buffers, FIFOs, and state storage without external SRAM.
  • Design Ecosystem: MachXO family devices are supported by Lattice design tools for synthesis, place‑and‑route, and in‑system programming workflows.

Why Choose LCMXO2280C-3FTN324I?

The LCMXO2280C-3FTN324I delivers a balanced mix of reconfigurable logic, on‑chip memory, and a very high I/O count in a single non‑volatile FPGA suitable for industrial control, interfacing, and system management tasks. Its instant‑on capability and in‑field reconfiguration options help shorten development cycles and enable secure, maintainable systems.

This device is well suited to engineers and product teams looking to reduce board complexity and part count while retaining flexibility to update logic post‑deployment. The combination of supply voltage flexibility, industrial temperature range, and RoHS‑compliant packaging provides a practical platform for long‑life embedded designs.

Request a quote or submit an inquiry to start evaluation and obtain pricing and availability for the LCMXO2280C-3FTN324I.

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