LCMXO2280C-3FTN324C

The LCMXO2280C-3FTN324C is a MachXO family non-volatile FPGA optimized for glue logic, bus bridging, power-up control and general control logic. It combines look-up table based logic with embedded block memory and programmable I/O to deliver a single-chip, instant-on programmable solution for commercial applications.

With 2,280 logic elements, up to 271 I/Os and on-chip memory, the device targets system-level integration where fast start-up, reconfigurability and dense I/O are important design priorities.

Key Features

• Core Logic – 2,280 logic elements (LUT4-based architecture) for implementing glue logic, control paths and combinational/sequential functions.
• On-chip Memory – 28,262 total bits of on-chip RAM providing embedded memory resources for buffering and state storage; device family documentation indicates up to three embedded block RAM (EBR) blocks for the 2280 device.
• I/O Density – Up to 271 programmable I/Os in the 324-ball package, enabling wide system connectivity and interface consolidation.
• Non-volatile, Instant-On – Single-chip non-volatile configuration lets the device power up quickly without external configuration memory and supports in-field reconfiguration.
• Programmable I/O Standards – Flexible sysIO buffer options in the MachXO family support a broad set of interfaces (including multiple LVCMOS levels, LVTTL, PCI, LVDS and related standards) for versatile board-level interfacing.
• Clocking – Up to two analog PLLs per device for clock multiply/divide and phase shifting.
• Power Management – Sleep mode can dramatically reduce static current draw (up to 100× reduction reported in family documentation), helping lower system standby power.
• Package & Mounting – Surface-mount 324-ball LBGA / 324-FTBGA (19×19 mm) package for compact board integration.
• Supply & Temperature – Operates across a 1.71 V to 3.465 V supply range and is specified for commercial-grade operation from 0 °C to 85 °C.
• RoHS Compliant – Lead-free, RoHS-compliant packaging.

Typical Applications

• Glue Logic & Bus Bridging – Implements address decoding, protocol bridging and control signal translation between system buses and peripherals.
• Power-Up and Reset Control – Manages sequencing, reset distribution and deterministic start-up behavior using non-volatile instant-on configuration.
• Interface Consolidation – Centralizes multiple I/O interfaces and level-shifting in a single device to reduce component count and PCB complexity.
• Embedded Control Logic – Implements microcontroller adjunct functions, bit-level controllers and timed state machines for consumer and industrial equipment.

Unique Advantages

• Instant-On, Single-Chip Configuration: Non-volatile configuration eliminates the need for external configuration memory and enables rapid power-up.
• High I/O Count in a Compact Package: 271 I/Os in a 324-ball package allow dense interface routing without larger board footprints.
• In-Field Reconfiguration: Family-level support for background and in-system reprogramming enables field updates and design migration without full system downtime.
• Flexible Power and I/O Options: Broad supply voltage range and programmable I/O standards support multiple logic levels and interface types on the same device.
• Low-Power Standby: Sleep mode capability allows significant static current reduction for power-sensitive applications.

Why Choose LCMXO2280C-3FTN324C?

The LCMXO2280C-3FTN324C positions itself as a versatile, non-volatile FPGA for commercial designs that require dense I/O, fast start-up and on-chip memory resources. Its combination of 2,280 logic elements, substantial on-chip RAM and up to two PLLs delivers a balance of logic capacity and system-level features for glue logic, interface consolidation and control applications.

Designed for engineers seeking reduced BOM and simpler board design, this MachXO device offers reconfigurability, compact 324-ball packaging and documented low-power modes—backed by family-level design tools and programming support—to help shorten development cycles and enable future updates in the field.

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