LCMXO2280C-3FTN256I

The LCMXO2280C-3FTN256I is a MachXO family field programmable gate array (FPGA) from Lattice Semiconductor. It combines non-volatile configuration with FPGA-style LUT-based logic to address glue logic, bus bridging/interfacing, power-up control and general control logic in industrial applications.

This device provides 2,280 logic elements, a high I/O count and on-chip RAM, and supports a wide supply range and extended operating temperatures—enabling compact, single-chip implementations where fast startup, reconfigurability and robust I/O flexibility are important.

Key Features

• Core Logic — 2,280 logic elements (lookup-table based architecture) for implementing glue logic, control functions and protocol bridging.
• On-chip Memory — Total RAM: 28,262 bits available on-chip for distributed and embedded storage.
• I/O Density — 211 programmable I/O pins to support multiple interfaces and high pin-count system functions.
• Non-volatile, Instant-on Configuration — MachXO family devices provide single-chip, non-volatile configuration with instant-on startup and no external configuration memory required.
• Reconfiguration and Power Modes — Family features include background programming, in-field reconfiguration (TransFR™) and a sleep mode that substantially reduces static current.
• Flexible I/O Buffering — Family-supported sysIO™ buffers enable a wide range of I/O standards (LVCMOS, LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL, RSDS) for interfacing with diverse system components.
• Clocking — MachXO family devices can include analog PLLs; the family supports up to two PLLs for clock multiply/divide and phase shifting.
• Package & Mounting — 256‑LBGA (256‑FTBGA, 17×17 mm supplier package) in a surface-mount form factor for compact board layouts.
• Power & Supply Range — Operates across a broad supply range from 1.71 V to 3.465 V to accommodate multiple system voltage domains.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Compliance — RoHS compliant packaging.

Typical Applications

• Glue Logic — Replace discrete logic with a single-chip, reprogrammable solution for board-level control and signal conditioning.
• Bus Bridging and Interfacing — Implement protocol adaptation and bus buffering using the device’s high I/O count and flexible I/O standards.
• Power-Up and System Control — Manage power sequencing and system supervision with instant-on configuration and controllable power modes.
• Control Logic — Integrate state machines, peripheral control and custom logic for industrial control modules or instrumentation.
• Field Reconfigurable Systems — Use in-field logic updates (TransFR) and background programming to evolve system functionality without taking the system offline.

Unique Advantages

• Single‑chip, Non‑volatile Configuration: Eliminates the need for external configuration memory while enabling microsecond startup behavior.
• High I/O to Logic Ratio: 211 I/Os paired with 2,280 logic elements supports dense interfacing tasks while keeping board count low.
• Flexible Voltage Support: Wide supply range (1.71–3.465 V) simplifies integration into systems with multiple voltage rails.
• Industrial Temperature Range: –40 °C to 100 °C rating supports deployment in industrial environments.
• Reconfiguration and Low-Power Modes: Background programming, TransFR reconfiguration and sleep mode enable field updates and reduced static current when needed.
• Broad I/O Standards and Clocking: Programmable I/O buffers and up to two PLLs (family feature) provide interface flexibility and clocking control for complex designs.

Why Choose LCMXO2280C-3FTN256I?

The LCMXO2280C-3FTN256I positions itself as a compact, industrial-grade MachXO FPGA option for designers who need non-volatile instant-on behavior, flexible I/O and sufficient on-chip logic and memory for glue logic, bridging, control and supervision tasks. Its combination of 2,280 logic elements, 211 I/Os, on-chip RAM and robust temperature and supply ranges makes it suitable for industrial applications where reconfigurability and fast startup matter.

Backed by MachXO family features—such as in-field reconfiguration, background programming and support in Lattice design tools—this device is aimed at teams wanting a scalable, single-chip solution that reduces BOM complexity and supports iterative feature updates in the field.

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