LCMXO2280C-3FT256I

The LCMXO2280C-3FT256I is a MachXO family Field Programmable Gate Array (FPGA) optimized for glue logic, bus interfacing and control tasks. It combines a non-volatile configuration architecture with a dense array of programmable logic and I/O for instant-on, single-chip system integration.

With 2,280 logic elements, 211 I/Os and 28,262 bits of on-chip RAM, this industrial-grade, surface-mount device targets applications that require reliable control, high I/O density and flexible in-field reconfiguration across a wide supply and temperature range.

Key Features

• Core Logic  2,280 logic elements (LUT4-based) providing flexible implementation of control and glue logic functions.
• On-chip Memory  Total on-chip RAM of 28,262 bits for embedded and distributed storage needs; family devices support dedicated embedded block RAM (sysMEM™).
• I/O Density  211 I/O pins to support wide peripheral and bus interfacing requirements in a single device.
• Non-volatile, Instant-on Configuration  Single-chip non-volatile architecture enables instant-on operation without external configuration memory and supports background programming and reconfiguration.
• In-field Reconfiguration  TransFR™ reconfiguration and JTAG-programmable non-volatile/SRAM programming enable updates while the system is operating and through standard programming interfaces.
• Clocks and Timing  Supports up to two analog PLLs for clock multiply/divide and phase adjustments at the system level.
• Flexible Power  Operates across a broad supply range of 1.71 V to 3.465 V to accommodate multiple I/O standards and system rails.
• Low-power Modes  Sleep mode provides substantial static current reduction for power-sensitive applications.
• Package & Mounting  256-ball package case (256-LBGA) / supplier device package 256-FTBGA (17×17), surface-mount for compact board-level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Glue Logic & System Control  Replace discrete glue logic with reconfigurable logic to simplify BOMs and shorten development cycles for control and sequencing functions.
• Bus Bridging and Interfacing  High I/O count and flexible I/O buffers support protocol bridging and bus interfacing between diverse system domains.
• Power-up and Reset Management  Instant-on non-volatile configuration and programmable control logic suit power sequencing and system initialization tasks.
• Field-updatable Control Logic  TransFR™ reconfiguration enables in-field updates to control algorithms and logic while the system remains operational.

Unique Advantages

• Single-chip, Instant-on Solution: Eliminates external configuration memory and enables microsecond power-up to active logic, reducing system complexity.
• High I/O-to-Logic Density: 211 I/Os combined with 2,280 logic elements let you implement dense interfacing and control functions on one device.
• Flexible Power Rail Support: Wide supply range (1.71 V–3.465 V) allows integration with multiple logic families and system voltages without additional regulators.
• Industrial Reliability: Industrial temperature rating (−40 °C to 100 °C) and surface-mount packaging enable use in robust, temperature-challenging environments.
• In-field Update Capability: Background programming, JTAG access and TransFR™ reconfiguration allow safe field updates and iterative feature deployment.
• On-chip Memory for Control Tasks: 28,262 bits of embedded/distributed RAM support FIFOs, small buffers and control-state storage without external memory.

Why Choose LCMXO2280C-3FT256I?

The LCMXO2280C-3FT256I positions itself as a practical, industrial-grade FPGA for designers who need instant-on, non-volatile configuration combined with substantial I/O and logic resources. Its mix of 2,280 logic elements, 211 I/Os, on-chip RAM and in-field reconfiguration features make it well-suited to replace discrete logic, implement bus bridging, and handle system control responsibilities within compact, surface-mount designs.

Choosing this device delivers reduced BOM complexity, flexible update paths for long product lifecycles and a reliable thermal and voltage operating window that supports industrial deployments. The MachXO family ecosystem and programming options simplify integration and ongoing maintenance for embedded and control-oriented applications.

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