LCMXO2280C-3BN256C

The LCMXO2280C-3BN256C is a MachXO family field programmable gate array (FPGA) in a 256-ball LFBGA package designed for glue logic, bus interfacing and control applications. It combines non-volatile instant-on architecture with a high I/O-to-logic density, delivering 2,280 logic elements, 211 I/Os and on-chip reconfigurable memory for compact, flexible system designs.

Key Features

• Logic Capacity — 2,280 logic elements provide flexible LUT-based logic for glue logic, protocol bridging and control functions.
• I/O and Package — 211 programmable I/Os in a 256-LFBGA (256-CABGA 14×14) surface-mount package for dense board integration and high pin count designs.
• On-Chip Memory — Total on-chip RAM of 28,262 bits of embedded and distributed memory to support FIFOs, small buffers and local data storage.
• Non-volatile, Instant-on Architecture — Single-chip non-volatile configuration enables instant-on behavior and eliminates the need for external configuration memory.
• Reconfiguration and In-field Updates — Series-level TransFR reconfiguration and background programming support in-field logic updates while the system is operating.
• I/O Standards and Flexibility — Programmable I/O buffer supports a wide range of interface standards including multiple LVCMOS levels and differential interfaces (as supported by the MachXO family).
• Clocking — Family-level support for up to two analog PLLs for clock multiply/divide and phase shifting.
• Power and Sleep — Supports sleep mode enabling significant static current reduction for low-power standby operation.
• Voltage and Temperature — Operates from 1.71 V to 3.465 V and rated for commercial temperature range 0 °C to 85 °C.
• Compliance — RoHS-compliant package.

Typical Applications

• System Glue Logic — Replace multiple discrete logic parts with a single reprogrammable device for board-level logic consolidation and simplified BOM.
• Bus Bridging and Interfacing — Implement protocol translation and bus bridging using abundant I/Os and flexible I/O standards.
• Power-Up and Control Sequencing — Use non-volatile instant-on capability for deterministic power-up control and system initialization.
• Field-Updatable Control Logic — Enable in-field feature updates and bug fixes through background programming and reconfiguration features.

Unique Advantages

• Instant-on, single-chip solution: Non-volatile configuration removes the need for external configuration memory and delivers microsecond power-up behavior for faster system availability.
• High pin-to-logic density: 211 I/Os paired with 2,280 logic elements enable complex interfacing while keeping device count low.
• On-board reconfiguration: Background programming and TransFR reconfiguration support allow in-field updates with minimal system interruption.
• Flexible I/O and clocking: Programmable I/O standards and up to two PLLs (family capability) facilitate integration with diverse interfaces and clocking requirements.
• Compact, surface-mount packaging: 256-LFBGA (14×14 mm) package supports high-density PCB layouts and simplified assembly.
• Power management features: Sleep mode enables significant static current reduction for lower standby power consumption.

Why Choose LCMXO2280C-3BN256C?

The LCMXO2280C-3BN256C positions itself as a compact, reprogrammable logic device that balances logic capacity, a high I/O count and non-volatile instant-on behavior. It is well suited for engineers seeking to consolidate glue logic, implement bus interfacing, or add field-updateable control functions while minimizing external components.

With support for a wide range of I/O standards, on-chip RAM and family-level clocking and reconfiguration capabilities, this MachXO device delivers a practical combination of integration, configurability and low-power features for commercial temperature applications.

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