LCMXO2280C-3FT256C

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA

Quantity 864 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O211Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs285Number of Logic Elements/Cells2280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28262

Overview of LCMXO2280C-3FT256C – MachXO Field Programmable Gate Array (FPGA) – 2280 logic elements, 211 I/Os, 256‑FTBGA

The LCMXO2280C-3FT256C is a non-volatile MachXO family FPGA delivering 2,280 logic elements and 21,126? — correction: 2,280 logic elements with 28,262 bits of on-chip RAM and up to 211 I/Os in a 256-ball ftBGA (17×17) package. It provides single‑chip instant-on configuration, in-system reconfiguration, and flexible I/O for glue logic, bus bridging, control logic, and other embedded system tasks.

This surface-mount, commercial‑grade device operates from 1.71 V to 3.465 V and across a 0 °C to 85 °C range, and is RoHS compliant—making it suitable for a broad set of low- to mid-complexity embedded designs requiring non‑volatile, instantly available programmable logic.

Key Features

  • Core Density 2,280 logic elements (LUT4s) for implementation of glue logic, control functions, and protocol bridging without external FPGA resources.
  • On‑Chip Memory 28,262 bits of embedded RAM for small FIFOs, state storage, and buffer needs directly on the device.
  • I/O Count & Package 211 available I/Os delivered in a 256-ball ftBGA (17×17) supplier package; high pin count enables complex interfacing in a compact footprint.
  • Flexible I/O Standards Programmable sysIO buffers support multiple signaling options listed in the MachXO family documentation, enabling mixed-voltage interfaces and diverse board-level connections.
  • Non‑volatile, Instant‑On Single‑chip non‑volatile architecture powers up in microseconds with no external configuration memory required and supports secure, background programming.
  • Reconfiguration & Sleep Supports in-field reconfiguration and a Sleep Mode that can reduce static current by up to 100× for power-sensitive applications.
  • Clocking Family-level support for up to two analog PLLs per device for clock multiplication, division, and phase adjustments (as available on MachXO devices).
  • Standards & System Support Includes IEEE 1149.1 boundary scan and IEEE 1532 compliant in-system programming; devices also provide an onboard oscillator.
  • Supply & Operating Range Operates from 1.71 V to 3.465 V and across a commercial temperature range of 0 °C to 85 °C.
  • Regulatory RoHS compliant lead‑free packaging.

Typical Applications

  • Board glue logic Implement bus glue, level translation, and control sequencing using the device’s 2,280 logic elements and 211 I/Os to reduce discrete logic count.
  • Interface bridging Bridge different bus standards and manage protocol conversion leveraging flexible sysIO buffering and plentiful I/O pins.
  • Power‑up and system control Use the non‑volatile instant‑on capability for fast system initialization, power sequencing, and reliable control functions without external configuration memory.
  • Field upgrades and customization Apply in-field updates and background programming to deploy logic changes while the system remains in use.

Unique Advantages

  • Single‑chip non‑volatile solution: Eliminates the need for external configuration memory while enabling instant-on operation and bitstream security.
  • High I/O to logic ratio: 211 I/Os paired with 2,280 logic elements supports complex interfacing without moving to larger, more expensive devices.
  • Flexible power and I/O support: Broad supply range (1.71 V–3.465 V) and programmable I/O buffer support from the MachXO family ease integration with mixed-voltage systems.
  • Low-power modes: Sleep Mode capability reduces static current dramatically, helping designs meet tighter power budgets during standby.
  • System-level features: Built-in boundary scan, onboard oscillator, and in-system programming simplify board bring-up and manufacturing test flows.

Why Choose LCMXO2280C-3FT256C?

The LCMXO2280C-3FT256C positions itself as a compact, non‑volatile FPGA option for designers who need instant-on programmable logic with a high I/O count and embedded memory in a 256‑ball ftBGA package. Its combination of 2,280 logic elements, 28,262 bits of on‑chip RAM, and support for in-field reconfiguration makes it well suited for control, interfacing, and system-management roles where single‑chip integration and rapid startup matter.

For teams targeting cost‑sensitive, commercial-grade products, this MachXO device offers a balance of integration, configurability, and system features—backed by documented MachXO family capabilities such as programmable I/O standards, PLL support, and standardized in-system programming.

If you need pricing, availability, or a formal quote for LCMXO2280C-3FT256C, request a quote or submit your procurement details and our team will respond with next steps and lead-time information.

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