LCMXO2280C-3FT256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 28262 2280 256-LBGA |
|---|---|
| Quantity | 864 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 285 | Number of Logic Elements/Cells | 2280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28262 |
Overview of LCMXO2280C-3FT256C – MachXO Field Programmable Gate Array (FPGA) – 2280 logic elements, 211 I/Os, 256‑FTBGA
The LCMXO2280C-3FT256C is a non-volatile MachXO family FPGA delivering 2,280 logic elements and 21,126? — correction: 2,280 logic elements with 28,262 bits of on-chip RAM and up to 211 I/Os in a 256-ball ftBGA (17×17) package. It provides single‑chip instant-on configuration, in-system reconfiguration, and flexible I/O for glue logic, bus bridging, control logic, and other embedded system tasks.
This surface-mount, commercial‑grade device operates from 1.71 V to 3.465 V and across a 0 °C to 85 °C range, and is RoHS compliant—making it suitable for a broad set of low- to mid-complexity embedded designs requiring non‑volatile, instantly available programmable logic.
Key Features
- Core Density 2,280 logic elements (LUT4s) for implementation of glue logic, control functions, and protocol bridging without external FPGA resources.
- On‑Chip Memory 28,262 bits of embedded RAM for small FIFOs, state storage, and buffer needs directly on the device.
- I/O Count & Package 211 available I/Os delivered in a 256-ball ftBGA (17×17) supplier package; high pin count enables complex interfacing in a compact footprint.
- Flexible I/O Standards Programmable sysIO buffers support multiple signaling options listed in the MachXO family documentation, enabling mixed-voltage interfaces and diverse board-level connections.
- Non‑volatile, Instant‑On Single‑chip non‑volatile architecture powers up in microseconds with no external configuration memory required and supports secure, background programming.
- Reconfiguration & Sleep Supports in-field reconfiguration and a Sleep Mode that can reduce static current by up to 100× for power-sensitive applications.
- Clocking Family-level support for up to two analog PLLs per device for clock multiplication, division, and phase adjustments (as available on MachXO devices).
- Standards & System Support Includes IEEE 1149.1 boundary scan and IEEE 1532 compliant in-system programming; devices also provide an onboard oscillator.
- Supply & Operating Range Operates from 1.71 V to 3.465 V and across a commercial temperature range of 0 °C to 85 °C.
- Regulatory RoHS compliant lead‑free packaging.
Typical Applications
- Board glue logic Implement bus glue, level translation, and control sequencing using the device’s 2,280 logic elements and 211 I/Os to reduce discrete logic count.
- Interface bridging Bridge different bus standards and manage protocol conversion leveraging flexible sysIO buffering and plentiful I/O pins.
- Power‑up and system control Use the non‑volatile instant‑on capability for fast system initialization, power sequencing, and reliable control functions without external configuration memory.
- Field upgrades and customization Apply in-field updates and background programming to deploy logic changes while the system remains in use.
Unique Advantages
- Single‑chip non‑volatile solution: Eliminates the need for external configuration memory while enabling instant-on operation and bitstream security.
- High I/O to logic ratio: 211 I/Os paired with 2,280 logic elements supports complex interfacing without moving to larger, more expensive devices.
- Flexible power and I/O support: Broad supply range (1.71 V–3.465 V) and programmable I/O buffer support from the MachXO family ease integration with mixed-voltage systems.
- Low-power modes: Sleep Mode capability reduces static current dramatically, helping designs meet tighter power budgets during standby.
- System-level features: Built-in boundary scan, onboard oscillator, and in-system programming simplify board bring-up and manufacturing test flows.
Why Choose LCMXO2280C-3FT256C?
The LCMXO2280C-3FT256C positions itself as a compact, non‑volatile FPGA option for designers who need instant-on programmable logic with a high I/O count and embedded memory in a 256‑ball ftBGA package. Its combination of 2,280 logic elements, 28,262 bits of on‑chip RAM, and support for in-field reconfiguration makes it well suited for control, interfacing, and system-management roles where single‑chip integration and rapid startup matter.
For teams targeting cost‑sensitive, commercial-grade products, this MachXO device offers a balance of integration, configurability, and system features—backed by documented MachXO family capabilities such as programmable I/O standards, PLL support, and standardized in-system programming.
If you need pricing, availability, or a formal quote for LCMXO2280C-3FT256C, request a quote or submit your procurement details and our team will respond with next steps and lead-time information.