LCMXO2280C-3B256C

The LCMXO2280C-3B256C is a MachXO family FPGA optimized for glue logic, bus interfacing, control and power-up sequencing tasks. It pairs non-volatile, instant-on architecture with FPGA-style resources to deliver flexible, reconfigurable logic in a single surface-mount device.

With 2,280 logic elements, approximately 28.3 Kbits of on-chip RAM and 211 I/Os, this device is intended for commercial-grade embedded designs that require high I/O-to-logic density, background reprogramming and multi-voltage I/O support.

Key Features

• Core Logic: 2,280 logic elements for implementing control and glue logic functions with the flexibility of LUT-based FPGA architecture.
• Embedded Memory: Approximately 28.3 Kbits of on-chip RAM to support distributed and block memory needs within the design.
• I/O Capacity & Flexibility: 211 I/O pins with programmable sysIO buffer support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS signaling.
• Non-Volatile, Instant-On Operation: Single-chip non-volatile architecture requiring no external configuration memory; device powers up quickly and supports secure in-field reconfiguration.
• Reconfiguration & Power Management: TransFR™ reconfiguration for in-field logic updates, background programming of non-volatile memory and a sleep mode that enables substantial static current reduction.
• Clocking: Up to two analog PLLs for clock multiplication, division and phase shifting (family capability).
• Voltage & Mounting: Operates from 1.71 V to 3.465 V and is supplied in a 256-ball LFBGA (caBGA) surface-mount package (14×14 mm).
• Commercial Temperature Grade & Compliance: Rated for 0 °C to 85 °C operating temperature and RoHS compliant.
• System-Level Support: IEEE 1149.1 boundary-scan, JTAG programmability and IEEE 1532 in-system programming support (family-level features).

Typical Applications

• Glue Logic and Board-Level Control: Implement complex interconnects and timing control between ICs where instant-on and single-chip non-volatile configuration reduce system complexity.
• Bus Bridging and Interfacing: High I/O count and flexible I/O standards make this device suitable for converting and bridging between different bus voltages and signaling types.
• Power-Up Sequencing and System Control: Non-volatile configuration and rapid start-up behavior enable reliable power-up control and sequencing in embedded systems.
• Field Upgradeable Logic: In-field TransFR reconfiguration supports system updates without taking the entire system offline.

Unique Advantages

• Single-Chip Non-Volatile Design: Eliminates the need for external configuration memory, simplifying BOM and improving security by removing external bitstreams.
• High I/O-to-Logic Density: 211 I/Os paired with 2,280 logic elements allow complex interfacing and glue logic on a compact package.
• Flexible I/O Standards: Programmable sysIO buffers support a wide range of signaling standards, reducing the need for external level translators.
• In-Field Reconfiguration: Background programming and TransFR capabilities enable non-disruptive updates and iterative firmware/logic development in deployed systems.
• Power Reduction Modes: Sleep mode provides significant static current reduction for power-sensitive applications.
• Design Tool Support: Family-level support in ispLEVER design tools facilitates synthesis, placement and timing closure for embedded and glue-logic designs.

Why Choose LCMXO2280C-3B256C?

The LCMXO2280C-3B256C brings together non-volatile instant-on behavior and FPGA-style logic resources in a single, commercial-grade surface-mount package. Its mix of 2,280 logic elements, substantial on-chip memory and 211 flexible I/Os makes it well suited for board-level control, bus interfacing and in-field upgradable logic in embedded systems requiring rapid start-up and secure configuration.

Supported by MachXO family capabilities—such as in-system programming, PLL-based clock management and design-tool integration—this device provides a scalable option for designers looking to reduce BOM, simplify system architecture and maintain updateability throughout product life.

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