LCMXO2-7000ZE-3FTG256C

IC FPGA 206 I/O 256FTBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LBGA

Quantity 717 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000ZE-3FTG256C – MachXO2 Field Programmable Gate Array, 6864 logic elements, 206 I/Os, 256-LBGA

The LCMXO2-7000ZE-3FTG256C is a MachXO2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It delivers a dense, low-power, non-volatile FPGA fabric with 6,864 logic elements and flexible I/O for system control, interface bridging and memory/display interface tasks.

Built for designs that require a compact, surface-mount package and a broad set of on‑chip system functions, this device combines embedded memory, on-chip user flash, PLL clocking and configurable I/O in a 256-ball LBGA package.

Key Features

  • Core Logic — 6,864 logic elements providing flexible LUT4-based logic resources suitable for complex glue logic and control functions.
  • Embedded Memory — Approximately 240 kbits of embedded RAM (245,760 total RAM bits) plus on-chip user flash memory capability in the MachXO2 family for non-volatile configuration and data storage.
  • I/O Capacity and Flexibility — 206 general-purpose I/Os with programmable sysIO buffer options and on‑chip differential termination to support a wide range of interface standards.
  • Low Power Operation — Family-level low-power architecture with standby power as low as 22 μW and power-saving modes to minimize system energy use.
  • Clocking and Timing — Up to two analog PLLs per device and multiple primary clocks for flexible, high-performance clocking and source-synchronous I/O support.
  • On-Chip System Functions — Non-volatile user flash, SPI/I2C/JTAG configuration access, on-chip oscillator and hardened peripherals (SPI, I2C, timer/counter) for system-level integration.
  • Packaging and Mounting — Surface-mount 256-LBGA package (supplier designation 256-FTBGA, 17×17) for high-density board layouts.
  • Electrical and Environmental — Single-supply operation in the range 1.14 V to 1.26 V and commercial operating temperature range 0 °C to 85 °C. RoHS compliant.

Typical Applications

  • Interface Bridge and Glue Logic — Use the device’s dense logic and extensive I/O to consolidate interface translation, bus bridging and control logic into a single component.
  • Memory and Display Interfaces — Family support for DDR/DDR2/LPDDR memory interfaces and display gearing makes it suitable for buffering, DQS timing support and source-synchronous I/O tasks.
  • Low-Power System Controllers — Low standby power and on-chip non-volatile configuration enable always-on or power-sensitive subsystem control functions.
  • Peripheral and Sensor Aggregation — Hardened I2C/SPI support and flexible I/O allow aggregation and preprocessing of sensor and peripheral data before handing off to a host processor.

Unique Advantages

  • Highly Integrated I/O and Logic: 206 I/Os paired with 6,864 logic elements reduce external glue components and simplify board-level design.
  • On-Chip Non‑Volatile Memory: Built-in user flash memory enables single-chip, secure configuration and background programming without external flash.
  • Low-Power Standby: Family-level standby power as low as 22 μW supports battery-assisted or always-on applications where energy use is critical.
  • Flexible Clocking and PLLs: Up to two analog PLLs and multiple primary clocks support complex timing requirements and high-speed I/O interfaces.
  • Compact, Surface-Mount Packaging: 256-LBGA (256-FTBGA, 17×17) provides a high-density footprint for space-constrained designs.
  • Commercial Temperature Grade: Rated for 0 °C to 85 °C operation for standard commercial applications and environments.

Why Choose LCMXO2-7000ZE-3FTG256C?

The LCMXO2-7000ZE-3FTG256C positions itself as a compact, energy-efficient FPGA option within the MachXO2 family, offering 6,864 logic elements, extensive I/O and embedded memory resources in a 256-ball LBGA package. Its combination of on‑chip non‑volatile flash, low standby power and flexible clocking makes it suitable for designs that need integrated system functions without external configuration logic.

This device is intended for engineers and designers building interface-rich, low-power control subsystems, memory and display front-ends, or sensor aggregation modules that benefit from a single-chip, reconfigurable solution backed by MachXO2 family capabilities.

Request a quote or submit an inquiry to learn about availability, pricing, and lead times for the LCMXO2-7000ZE-3FTG256C.

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