LCMXO2-7000ZE-3FG484C

The LCMXO2-7000ZE-3FG484C is a MachXO2 family non-volatile FPGA offering a flexible logic architecture with 6,864 logic elements and up to 334 user I/Os. Designed for commercial embedded applications, it delivers a mix of on-chip memory, configurable I/O and low-power operation for system control, interface bridging and display or memory buffering.

Key value propositions include high I/O density, embedded memory resources and single-chip non-volatile configuration that enable instant-on operation and in-field updates while simplifying board-level BOM and design integration.

Key Features

• Logic Capacity — 6,864 logic elements provide programmable logic resources for glue logic, control blocks and custom peripherals.
• Embedded Memory — Approximately 245,760 bits of on-chip RAM (about 240 kbits) plus family-supported embedded block RAM and distributed RAM options for buffering and scratchpad storage.
• On‑Chip User Flash (UFM) — Up to 256 kbits of user flash memory for configuration and application storage with background programming and up to 100,000 write cycles (family capability).
• High I/O Density — 334 programmable I/Os to support complex interfaces, wide parallel buses and multi-channel connectivity.
• Flexible I/O Standards — Programmable sysIO buffer supports a wide range of interfaces, including LVCMOS, LVTTL and differential standards such as LVDS and other bus types (family-defined capabilities).
• Low‑Voltage Operation — Single-core supply range of 1.14 V to 1.26 V to match low-voltage system rails.
• Low Power — Family features include ultra-low standby power modes (down to micro-watt range) and programmable power-saving options.
• Clocking and PLLs — Multiple on-chip clock resources including primary clocks and up to two analog PLLs for frequency synthesis (family feature set).
• Package and Thermal — 484-ball BBGA package (23 mm × 23 mm) in a surface-mount form factor; commercial operating range 0 °C to 85 °C.
• Standards & Reliability — Non-volatile, instant-on configuration, IEEE 1149.1 boundary scan and in-system programming support (family capabilities); RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic — High I/O count and flexible I/O standards make the device suitable for aggregating interfaces and translating between protocols on compact boards.
• Display and Video I/O — Dedicated gearing and DDR register support at the I/O enable pre-engineered source-synchronous and display-oriented interfaces.
• Memory Buffering and Controller Logic — Embedded RAM and FIFO control logic support transient buffering and custom memory interfacing tasks.
• Embedded Control and Peripheral Aggregation — On-chip user flash, timers/counters and supported serial interfaces (SPI, I²C) provide resources for local control and configuration functions.

Unique Advantages

• High Integration — Combines thousands of logic elements, substantial on-chip RAM and user flash in a single, non-volatile device to reduce system BOM and board area.
• Scalable I/O — 334 programmable I/Os provide design flexibility for multi-channel interfaces and high-pin-count peripherals without external glue chips.
• Low-Voltage, Low-Power Operation — Narrow core supply range (1.14 V to 1.26 V) and family power-saving modes enable efficient operation in low-power designs.
• Instant-On Non-Volatile Configuration — Single-chip non-volatile configuration enables fast power-up and supports background programming and in-field updates.
• Robust System Features — Integrated clocking, PLLs, boundary-scan and in-system programming support simplify system bring-up and long-term maintenance.

Why Choose LCMXO2-7000ZE-3FG484C?

This MachXO2 device is positioned for commercial embedded designs that need a balance of logic capacity, dense I/O and on-chip memory with non-volatile instant-on operation. Its combination of 6,864 logic elements, large I/O count and embedded memory makes it well-suited for applications requiring interface consolidation, display or memory interfacing and local control functions.

Customers benefit from a device that supports background programming, configurable I/O standards, on-chip clock synthesis and family-level features that ease density migration and system integration while maintaining RoHS compliance and commercial temperature operation.

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