LCMXO2-7000ZE-3BG256C

The Lattice MachXO2 LCMXO2-7000ZE-3BG256C is a non-volatile Field Programmable Gate Array (FPGA) device offering a flexible logic architecture suited for control, interface and configuration tasks. It integrates 6,864 logic elements, high I/O density (206 pins), and on-chip non-volatile flash to deliver configurable logic, memory and I/O features in a compact 256-LFBGA package.

This device is targeted at commercial electronic designs where instant-on non-volatile programmability, low-power standby behavior and a broad set of I/O options are required for system glue logic, interface bridging and in-field reconfiguration.

Key Features

• Logic Capacity — 6,864 logic elements to implement glue logic, state machines and control functions within a single device.
• Embedded Memory — 245,760 bits of on-chip RAM (approximately 240 kbits) for system buffering and small data storage; includes embedded block and distributed RAM resources.
• On‑Chip User Flash — Non‑volatile, reprogrammable user flash memory (UFM up to 256 kbits per family specification) for configuration storage and in-field updates.
• High I/O Density — 206 user I/Os in a 256-pin LFBGA footprint supports extensive interface integration and multiple peripheral connections.
• Flexible I/O Standards — Programmable sysIO buffer supports a wide range of I/O modes and includes differential and single‑ended options plus on‑chip termination and pull modes.
• Power and Clocking — Low-power architecture with standby modes and analog PLLs (up to two) and multiple primary clock resources for flexible timing and frequency synthesis.
• Non-volatile, Instant-On — Single-chip non-volatile configuration with instant-on capability and support for background programming and dual-boot options.
• Configuration and System Support — In-system programming via JTAG, SPI and I2C; support for TransFR in-field reconfiguration to update logic while the system operates.
• Package and Mounting — 256-LFBGA surface-mount package (supplier device package: 256-CABGA, 14 × 14 mm) for compact PCB integration.
• Operating Range and Compliance — Commercial grade operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic — Use the device’s high I/O count and flexible sysIO buffers to consolidate multiple protocol interfaces and handle board-level signal conditioning.
• Display and Video I/O — Leverage dedicated DDR gearing and display I/O support for timing, serialization and control functions in display subsystems.
• Memory Interface Support — Employ the device’s DDR/DDR2/LPDDR-oriented I/O gear and DDR registers for memory controller glue and timing management.
• Configuration and System Supervision — Use on-chip flash and TransFR reconfiguration for secure boot, in-field updates and supervisory functions without external non-volatile memory.

Unique Advantages

• Integrated Non‑Volatile Configuration: On-chip user flash enables instant-on operation and removes the need for an external configuration ROM.
• High Integration in a Small Footprint: 6,864 logic elements and 206 I/Os in a 256-pin LFBGA reduce board count and simplify system design.
• Low-Power Standby Options: Advanced low-power modes and standby behavior help minimize system power when active logic is not required.
• Flexible, Programmable I/Os: Wide I/O standard support and on-chip termination let you adapt the same device across multiple interface requirements.
• Field Update Capability: TransFR reconfiguration and multiple programming interfaces (JTAG, SPI, I2C) enable in-field logic updates and flexible deployment models.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and supplied in a RoHS-compliant package suitable for mainstream electronic products.

Why Choose LCMXO2-7000ZE-3BG256C?

The LCMXO2-7000ZE-3BG256C balances moderate logic capacity and high I/O density with non-volatile, instant-on configuration and programmable I/O flexibility. Its integrated memory, on-chip flash and reconfiguration capabilities make it well-suited for designs that require compact, low-power control and interface logic without relying on external configuration devices.

This device is a practical choice for engineers designing commercial electronic systems that need reliable, reprogrammable logic, abundant I/Os and system-level features like PLLs, timers and multiple programming interfaces to accelerate development and simplify BOM complexity.

If you would like pricing, availability or a formal quotation for LCMXO2-7000ZE-3BG256C, please submit a request for quote or contact the supplier channel to obtain detailed procurement information.