LCMXO2-7000ZE-2FTG256I

The LCMXO2-7000ZE-2FTG256I is a MachXO2 family FPGA optimized for low-power, non-volatile system logic in industrial designs. It provides 6,864 logic elements, 206 I/Os and approximately 0.246 Mbits of on-chip RAM in a 256-ball LBGA package, delivering a compact, reconfigurable building block for control, interface and system-management functions.

Designed for industrial temperature operation and single-supply deployment, the device targets applications that require instant-on non-volatile logic, flexible I/O and in-field reconfiguration while operating over a wide temperature and supply range.

Key Features

• Core Logic 6,864 logic elements provide programmable LUT-based resources suitable for glue logic, state machines and mid-density custom logic functions.
• On-chip Memory Approximately 245,760 bits (≈0.246 Mbits) of embedded RAM for FIFOs, small buffers and local storage.
• I/O Capability 206 general-purpose I/Os with programmable differential and single-ended buffer options and support for DDR registers in I/O cells and dedicated gearing logic for high-speed interfaces.
• Non-volatile Configuration MachXO2 family provides on-chip user flash and supports instant-on operation and in-field reconfiguration (TransFR™) for background programming and updates.
• Power and Supply Operates from a core supply range of 1.14 V to 1.26 V, with low-power modes including microamp-level standby options described for the MachXO2 family.
• Clocking and Timing Family-level features include multiple primary clocks and up to two analog PLLs for fractional-n frequency synthesis to support a range of timing and interface needs.
• System Functions Family includes hardened peripherals such as SPI, I2C and timer/counter functions, plus IEEE 1149.1 boundary scan for system-level test and programming.
• Package and Temperature 256-ball LBGA (256-FTBGA, 17×17) surface-mount package rated for industrial operation from −40 °C to 100 °C.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control Programmable system logic, interface bridging and control functions in industrial modules that require operation from −40 °C to 100 °C.
• Embedded Systems Instant-on non-volatile logic and on-chip user flash for boot sequencing, device identification and in-field firmware/configuration updates.
• Display and Memory Interfaces I/O gearing, DDR registers and dedicated interface logic support display timing and high-speed memory interface handling.
• Peripheral and Sensor Interfaces Use on-chip SPI, I2C and general-purpose I/Os for sensor aggregation, protocol translation and peripheral control.

Unique Advantages

• Non-volatile, instant-on operation: On-chip user flash and family TransFR™ capabilities enable rapid startup and background reconfiguration without external configuration ROMs.
• Flexible, high-density I/O: 206 programmable I/Os with differential and DDR support simplify integration of varied interface standards and high-speed signals.
• Compact industrial package: 256-ball LBGA in a 17×17 form factor provides a small footprint solution rated for industrial temperature ranges.
• Integrated system peripherals: Hardened SPI, I2C and timer/counter blocks reduce external component count for common control and management tasks.
• Low-power capability: Family-level low-power modes and micro-watt standby options support energy-conscious designs and always-on system functions.
• Field-updatable logic: Support for in-field logic updates allows iterative feature upgrades and fixes without hardware replacement.

Why Choose LCMXO2-7000ZE-2FTG256I?

This MachXO2 device combines mid-density logic (6,864 logic elements), substantial I/O (206 pins) and on-chip RAM (≈0.246 Mbits) in a compact 256-LBGA package rated for industrial temperatures, making it well suited for industrial control, embedded system management, interface bridging and display/memory interface tasks. Its non-volatile configuration and family-level features such as on-chip flash, hardened peripherals and field reconfiguration deliver a practical, integrated solution for designs that require reliable, reprogrammable logic with low standby power.

Engineers and procurement teams looking for a scalable, reconfigurable building block will find this device appropriate for reducing board-level complexity while retaining flexibility for updates and system-level integration.

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