LCMXO2-7000ZE-2FG484C

IC FPGA 334 I/O 484FBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 334 245760 6864 484-BBGA

Quantity 397 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O334Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000ZE-2FG484C – Field Programmable Gate Array (FPGA) IC, 334 I/Os, 6,864 Logic Elements, 484-BBGA

The LCMXO2-7000ZE-2FG484C is a MachXO2 family FPGA optimized for I/O-rich, low-power system functions. It provides a flexible logic architecture with 6,864 logic elements and high on-chip memory integration for glue logic, interface control, and in-field reconfiguration.

Designed for commercial applications, this surface-mount device delivers a high I/O count (334 pins), approximately 240 kbits of embedded RAM, and non-volatile user flash — all in a compact 484-BBGA (23 mm × 23 mm) package.

Key Features

  • Core Logic — 6,864 logic elements provide substantial programmable resources for control, protocol bridging, and custom logic implementation.
  • Embedded Memory — Approximately 240 kbits (245,760 bits) of on-chip RAM plus distributed RAM options for buffering, FIFOs, and small data stores.
  • On-Chip User Flash — Non-volatile user Flash memory (series-level support up to 256 kbits) for configuration storage and field updates.
  • High I/O Count — 334 I/O pins in a 484-BBGA footprint support wide external connectivity and dense interface routing.
  • Flexible I/O Standards — Programmable sysIO buffers support multiple standards across a wide voltage range for varied interface requirements.
  • Power and Voltage — Low-power architecture with series-level standby figures and a supply voltage range of 1.14 V to 1.26 V for the core.
  • Clocking and PLLs — Multiple primary clocks and up to two analog PLLs (series-level) for flexible clocking and frequency synthesis.
  • Reconfiguration and Security — Non-volatile, infinitely reconfigurable architecture with instant-on behavior and in-field reconfiguration capability.
  • System Integration — Hardened peripherals at the silicon level including SPI, I2C, timer/counter and on-chip oscillator to reduce external components.
  • Package & Mounting — 484-BBGA (supplier package 484-FBGA 23×23) surface-mount package suitable for compact board designs; RoHS compliant.
  • Operating Range — Commercial-grade device with an operating temperature range of 0 °C to 85 °C.

Typical Applications

  • Display and Video I/O — Built-in gearing and DDR-friendly I/O structures support display interface timing and high-speed parallel transfers.
  • Memory Interface Glue — Dedicated DDR logic and source-synchronous I/O features enable implementation of external memory control and buffering.
  • Interface Bridging and Protocol Conversion — High I/O count and flexible I/O standards make the device suitable for bridging between disparate peripherals and buses.
  • System Control and Peripheral Management — Embedded timers, SPI and I2C controllers simplify integration of supervisory and management functions on a single chip.

Unique Advantages

  • High integration in a compact package: 6,864 logic elements and 334 I/Os in a 484-BBGA reduce board-level component count and simplify routing for dense designs.
  • On-chip non-volatile configuration: User Flash memory enables single-chip, secure configuration storage and background programming for field updates.
  • Flexible I/O and protocol support: Programmable sysIO buffers and DDR-capable I/O cells accommodate a wide range of signaling standards and source-synchronous interfaces.
  • Low-power architecture: Series-level low standby power and power-saving options help minimize system energy consumption in always-on or idle states.
  • System-level functions integrated: Hardened SPI, I2C, timers and on-chip oscillator reduce the need for external support chips and speed time-to-market.
  • Commercial-grade reliability: Specified operating range (0 °C to 85 °C) and RoHS compliance support mainstream commercial product deployments.

Why Choose LCMXO2-7000ZE-2FG484C?

This MachXO2 FPGA delivers a balanced combination of programmable logic, high I/O density, and embedded non-volatile memory in a compact surface-mount package. It is well suited to designs that require robust interface handling, in-field update capability, and integrated system functions while maintaining a commercial temperature profile.

Choose LCMXO2-7000ZE-2FG484C when your design needs a single-chip, reconfigurable solution that reduces external components, supports a wide set of I/O standards, and provides on-chip memory and control peripherals for streamlined system integration.

Request a quote or submit an inquiry for LCMXO2-7000ZE-2FG484C to discuss pricing and availability for your design needs.

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