LCMXO2-7000ZE-2FG484C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 334 245760 6864 484-BBGA |
|---|---|
| Quantity | 397 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 334 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000ZE-2FG484C – Field Programmable Gate Array (FPGA) IC, 334 I/Os, 6,864 Logic Elements, 484-BBGA
The LCMXO2-7000ZE-2FG484C is a MachXO2 family FPGA optimized for I/O-rich, low-power system functions. It provides a flexible logic architecture with 6,864 logic elements and high on-chip memory integration for glue logic, interface control, and in-field reconfiguration.
Designed for commercial applications, this surface-mount device delivers a high I/O count (334 pins), approximately 240 kbits of embedded RAM, and non-volatile user flash — all in a compact 484-BBGA (23 mm × 23 mm) package.
Key Features
- Core Logic — 6,864 logic elements provide substantial programmable resources for control, protocol bridging, and custom logic implementation.
- Embedded Memory — Approximately 240 kbits (245,760 bits) of on-chip RAM plus distributed RAM options for buffering, FIFOs, and small data stores.
- On-Chip User Flash — Non-volatile user Flash memory (series-level support up to 256 kbits) for configuration storage and field updates.
- High I/O Count — 334 I/O pins in a 484-BBGA footprint support wide external connectivity and dense interface routing.
- Flexible I/O Standards — Programmable sysIO buffers support multiple standards across a wide voltage range for varied interface requirements.
- Power and Voltage — Low-power architecture with series-level standby figures and a supply voltage range of 1.14 V to 1.26 V for the core.
- Clocking and PLLs — Multiple primary clocks and up to two analog PLLs (series-level) for flexible clocking and frequency synthesis.
- Reconfiguration and Security — Non-volatile, infinitely reconfigurable architecture with instant-on behavior and in-field reconfiguration capability.
- System Integration — Hardened peripherals at the silicon level including SPI, I2C, timer/counter and on-chip oscillator to reduce external components.
- Package & Mounting — 484-BBGA (supplier package 484-FBGA 23×23) surface-mount package suitable for compact board designs; RoHS compliant.
- Operating Range — Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
Typical Applications
- Display and Video I/O — Built-in gearing and DDR-friendly I/O structures support display interface timing and high-speed parallel transfers.
- Memory Interface Glue — Dedicated DDR logic and source-synchronous I/O features enable implementation of external memory control and buffering.
- Interface Bridging and Protocol Conversion — High I/O count and flexible I/O standards make the device suitable for bridging between disparate peripherals and buses.
- System Control and Peripheral Management — Embedded timers, SPI and I2C controllers simplify integration of supervisory and management functions on a single chip.
Unique Advantages
- High integration in a compact package: 6,864 logic elements and 334 I/Os in a 484-BBGA reduce board-level component count and simplify routing for dense designs.
- On-chip non-volatile configuration: User Flash memory enables single-chip, secure configuration storage and background programming for field updates.
- Flexible I/O and protocol support: Programmable sysIO buffers and DDR-capable I/O cells accommodate a wide range of signaling standards and source-synchronous interfaces.
- Low-power architecture: Series-level low standby power and power-saving options help minimize system energy consumption in always-on or idle states.
- System-level functions integrated: Hardened SPI, I2C, timers and on-chip oscillator reduce the need for external support chips and speed time-to-market.
- Commercial-grade reliability: Specified operating range (0 °C to 85 °C) and RoHS compliance support mainstream commercial product deployments.
Why Choose LCMXO2-7000ZE-2FG484C?
This MachXO2 FPGA delivers a balanced combination of programmable logic, high I/O density, and embedded non-volatile memory in a compact surface-mount package. It is well suited to designs that require robust interface handling, in-field update capability, and integrated system functions while maintaining a commercial temperature profile.
Choose LCMXO2-7000ZE-2FG484C when your design needs a single-chip, reconfigurable solution that reduces external components, supports a wide set of I/O standards, and provides on-chip memory and control peripherals for streamlined system integration.
Request a quote or submit an inquiry for LCMXO2-7000ZE-2FG484C to discuss pricing and availability for your design needs.