LCMXO2-7000ZE-2BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA

Quantity 22 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO2-7000ZE-2BG256I – MachXO2 FPGA, 6,864 Logic Elements, 206 I/Os

The LCMXO2-7000ZE-2BG256I is a MachXO2 field programmable gate array designed for industrial-grade embedded applications. It combines a flexible LUT-based logic architecture with extensive I/O and on-chip memory, enabling system glue logic, interface bridging, and user-control functions where low power, instant-on configuration and reconfigurability are important.

Key Features

  • Core Logic  6,864 logic elements (LUT4-based architecture) for implementing glue logic, protocol bridging, and customizable control functions.
  • On-chip Memory  Total RAM: 245,760 bits (approximately 240 kbits) of embedded RAM for FIFOs and buffering; family supports up to 256 kbits of on-chip user flash memory for non-volatile configuration and storage.
  • I/O Density & Flexibility  206 I/Os with programmable sysIO buffer support for multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL, SSTL, and HSTL. I/Os support hot-socketing and on-chip differential termination.
  • Clocking & SERDES  Up to eight primary clocks, up to two edge clocks for high-speed I/O, and up to two analog PLLs with fractional-N frequency synthesis for flexible clock management.
  • Low Power & Instant-On  Built on an advanced low-power process with standby modes and microsecond-class instant-on configuration to minimize power in standby and enable fast boot.
  • Non-volatile Reconfiguration  On-chip user Flash and TransFR™ reconfiguration for in-field logic updates and background programming; supports JTAG, SPI and I²C configuration interfaces.
  • Package & Industrial Grade  256-LFBGA package (supplier device package: 256-CABGA 14 × 14 mm), surface-mount mounting type, and industrial operating temperature range from −40°C to 100°C.
  • Supply & Compliance  Single supply operation with a voltage range of 1.14 V to 1.26 V; RoHS compliant.

Typical Applications

  • Interface Bridging and Glue Logic  Use the dense I/O and flexible logic to implement protocol translators, bus adapters and system glue between microcontrollers, sensors, and peripheral devices.
  • Display and Memory Interfaces  Pre‑engineered source-synchronous I/O, DDR gearing and dedicated memory interface support make the device suitable for display controllers and external memory timing control.
  • Embedded Control and Timing  On-chip timers, counters, PLLs and a programmable oscillator enable precise timing, local control tasks and clock generation without external components.
  • Field-Updatable Logic  TransFR reconfiguration and on-chip flash allow in-field updates to logic and firmware while the system remains operational.

Unique Advantages

  • High Integration:  6,864 logic elements and 206 I/Os consolidate multiple discrete functions into a single device, reducing BOM and board complexity.
  • Flexible I/O Standards:  Programmable sysIO and on-chip differential termination support a broad range of signaling standards, simplifying multi-interface designs.
  • Non-volatile and Reconfigurable:  On-chip user flash and TransFR enable secure, instant-on operation and in-field firmware/logic updates.
  • Designed for Low Power:  Advanced low-power process and standby options lower idle power consumption for always-on and battery-assisted systems.
  • Industrial Reliability:  Surface-mount 256-pin package and an operating temperature range of −40°C to 100°C support deployment in industrial environments.
  • Compact Packaging:  256-LFBGA (supplier 256-CABGA 14 × 14 mm) provides a high-pin-count solution in a compact footprint for dense board layouts.

Why Choose LCMXO2-7000ZE-2BG256I?

The LCMXO2-7000ZE-2BG256I positions itself as a versatile, industrial-grade FPGA for system designers who need a balance of logic capacity, extensive I/O flexibility and non-volatile reconfiguration. Its combination of 6,864 logic elements, approximately 245,760 bits of embedded RAM, up to 256 kbits of on-chip flash, and programmable multi-standard I/Os makes it well suited to roles such as interface bridging, display/memory timing, and field-updatable control logic.

With low-power standby modes, instant-on behavior and industrial temperature support, this MachXO2 device delivers long-term value for embedded designs that require reliable operation, reconfigurability and a reduced BOM footprint.

Request a quote or submit an RFQ today to learn about availability and pricing for the LCMXO2-7000ZE-2BG256I. Our team can provide part availability and procurement assistance tailored to your project needs.

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