LCMXO2-7000ZE-2BG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA |
|---|---|
| Quantity | 22 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000ZE-2BG256I – MachXO2 FPGA, 6,864 Logic Elements, 206 I/Os
The LCMXO2-7000ZE-2BG256I is a MachXO2 field programmable gate array designed for industrial-grade embedded applications. It combines a flexible LUT-based logic architecture with extensive I/O and on-chip memory, enabling system glue logic, interface bridging, and user-control functions where low power, instant-on configuration and reconfigurability are important.
Key Features
- Core Logic 6,864 logic elements (LUT4-based architecture) for implementing glue logic, protocol bridging, and customizable control functions.
- On-chip Memory Total RAM: 245,760 bits (approximately 240 kbits) of embedded RAM for FIFOs and buffering; family supports up to 256 kbits of on-chip user flash memory for non-volatile configuration and storage.
- I/O Density & Flexibility 206 I/Os with programmable sysIO buffer support for multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL, SSTL, and HSTL. I/Os support hot-socketing and on-chip differential termination.
- Clocking & SERDES Up to eight primary clocks, up to two edge clocks for high-speed I/O, and up to two analog PLLs with fractional-N frequency synthesis for flexible clock management.
- Low Power & Instant-On Built on an advanced low-power process with standby modes and microsecond-class instant-on configuration to minimize power in standby and enable fast boot.
- Non-volatile Reconfiguration On-chip user Flash and TransFR™ reconfiguration for in-field logic updates and background programming; supports JTAG, SPI and I²C configuration interfaces.
- Package & Industrial Grade 256-LFBGA package (supplier device package: 256-CABGA 14 × 14 mm), surface-mount mounting type, and industrial operating temperature range from −40°C to 100°C.
- Supply & Compliance Single supply operation with a voltage range of 1.14 V to 1.26 V; RoHS compliant.
Typical Applications
- Interface Bridging and Glue Logic Use the dense I/O and flexible logic to implement protocol translators, bus adapters and system glue between microcontrollers, sensors, and peripheral devices.
- Display and Memory Interfaces Pre‑engineered source-synchronous I/O, DDR gearing and dedicated memory interface support make the device suitable for display controllers and external memory timing control.
- Embedded Control and Timing On-chip timers, counters, PLLs and a programmable oscillator enable precise timing, local control tasks and clock generation without external components.
- Field-Updatable Logic TransFR reconfiguration and on-chip flash allow in-field updates to logic and firmware while the system remains operational.
Unique Advantages
- High Integration: 6,864 logic elements and 206 I/Os consolidate multiple discrete functions into a single device, reducing BOM and board complexity.
- Flexible I/O Standards: Programmable sysIO and on-chip differential termination support a broad range of signaling standards, simplifying multi-interface designs.
- Non-volatile and Reconfigurable: On-chip user flash and TransFR enable secure, instant-on operation and in-field firmware/logic updates.
- Designed for Low Power: Advanced low-power process and standby options lower idle power consumption for always-on and battery-assisted systems.
- Industrial Reliability: Surface-mount 256-pin package and an operating temperature range of −40°C to 100°C support deployment in industrial environments.
- Compact Packaging: 256-LFBGA (supplier 256-CABGA 14 × 14 mm) provides a high-pin-count solution in a compact footprint for dense board layouts.
Why Choose LCMXO2-7000ZE-2BG256I?
The LCMXO2-7000ZE-2BG256I positions itself as a versatile, industrial-grade FPGA for system designers who need a balance of logic capacity, extensive I/O flexibility and non-volatile reconfiguration. Its combination of 6,864 logic elements, approximately 245,760 bits of embedded RAM, up to 256 kbits of on-chip flash, and programmable multi-standard I/Os makes it well suited to roles such as interface bridging, display/memory timing, and field-updatable control logic.
With low-power standby modes, instant-on behavior and industrial temperature support, this MachXO2 device delivers long-term value for embedded designs that require reliable operation, reconfigurability and a reduced BOM footprint.
Request a quote or submit an RFQ today to learn about availability and pricing for the LCMXO2-7000ZE-2BG256I. Our team can provide part availability and procurement assistance tailored to your project needs.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016