LCMXO2-7000ZE-1TG144C

The LCMXO2-7000ZE-1TG144C is a MachXO2 family field programmable gate array (FPGA) offered in a 144‑pin LQFP package for surface mount applications. It combines a flexible LUT-based logic architecture with on-chip non-volatile configuration and a rich, programmable I/O set suited for control, interface and glue‑logic roles in commercial electronic designs.

This device delivers 6,864 logic elements, approximately 240 kbits of embedded RAM, and 114 I/Os while operating from a single-core supply of 1.14 V to 1.26 V and a commercial temperature range of 0 °C to 85 °C, providing a compact, low-power programmable building block for system designers.

Key Features

• Core Logic — 6,864 logic elements for flexible LUT-based implementation of control, glue logic and user-defined state machines.
• Embedded Memory — Approximately 245,760 bits (≈240 kbits) of on-chip RAM for FIFOs, buffers and small data storage requirements.
• On-Chip Non-Volatile Storage — User Flash Memory (family feature) supporting in-field updates and background programming for secure, single-chip configuration and instant-on operation.
• I/O Capacity & Flexibility — 114 programmable I/Os with support for a wide range of signaling options (family-level I/O modes in MachXO2 series) to handle parallel, serial and source-synchronous interfaces.
• Low-Power Process — Built on an advanced low-power process with ultra-low standby power options (family data indicates standby modes down to micro-watt levels).
• Clocking & Timing — Multiple primary clocks and on-chip PLL resources (family-level) to support flexible clocking and high-speed I/O timing requirements.
• Package & Mounting — 144‑LQFP (supplier package: 144‑TQFP, 20×20 mm) in a surface-mount form factor, RoHS compliant and suitable for standard PCB assembly flows.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation to match commercial application environments.

Typical Applications

• System Control & Glue Logic — Implement board-level control, protocol bridging and custom state machines to consolidate discrete logic and reduce BOM.
• I/O Expansion & Interface Bridging — Act as a programmable interface hub for diverse signals, leveraging the 114 I/Os and configurable buffer options documented for the MachXO2 family.
• Memory & Display Support — Provide pre-engineered source-synchronous I/O and DDR-related I/O features (family-level) for memory or display timing and buffering tasks.
• Peripheral & Subsystem Control — Integrate SPI, I2C and timer/counter functions (family-level hardened blocks) to offload subsystem management from host processors.

Unique Advantages

• High logic density in a compact package: 6,864 logic elements in a 144‑LQFP footprint enable complex designs without large-package costs.
• Integrated non-volatile configuration: On-chip user flash memory supports instant-on behavior and field updates, simplifying system boot and secure configuration.
• Broad I/O capability: 114 programmable I/Os accommodate multiple interfaces and mixed-signal front-ends, reducing external translator ICs.
• Low supply voltage operation: Single-core supply range of 1.14 V to 1.26 V supports designs targeting lower-power core rails.
• Commercial-grade availability: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial product lines.
• Family-level system features: MachXO2 family includes integrated peripherals (SPI, I2C, timers), PLLs and standby modes to simplify system design and power management.

Why Choose LCMXO2-7000ZE-1TG144C?

The LCMXO2-7000ZE-1TG144C offers a balanced combination of programmable logic capacity, embedded memory and broad I/O in a compact surface-mount 144‑LQFP package. It is positioned for commercial designs that require flexible, non-volatile FPGA functionality with low-power operation and integrated system features from the MachXO2 family.

This device suits engineers building board-level controllers, interface bridges and subsystem managers who need on-chip flash, multiple clocks/PLLs and a high I/O count without moving to larger, more costly packages. Its family-provided features and RoHS compliance provide a scalable option for evolving product requirements and long-term design maintenance.

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