LCMXO2-7000ZE-1FTG256I

The LCMXO2-7000ZE-1FTG256I is a MachXO2 field programmable gate array (FPGA) offering a flexible logic architecture with 6,864 logic elements and 206 I/Os in a 256-ball ftBGA package. Designed for embedded control, interface and I/O-centric applications, the device combines on-chip non-volatile user flash, embedded SRAM and programmable I/O flexibility to simplify system design.

With low-power silicon and family-level features such as instant-on configuration, programmable clocking and on-chip system peripherals, this device targets applications that require compact integration, reconfigurability and industrial temperature operation.

Key Features

• Core Logic – 6,864 logic elements (LUT4-based architecture) providing programmable fabric for glue logic, control paths and custom functions.
• Memory – Approximately 245,760 total RAM bits (≈240 kbits) of embedded block and distributed RAM for FIFOs, buffering and small data storage.
• On-Chip Non‑Volatile Memory – User Flash Memory (UFM) within the family supports in-field updates and background programming for single-chip, non-volatile configuration.
• I/O Capacity & Flexibility – 206 I/O pins with programmable sysIO buffer options and on‑chip differential termination for a wide range of signaling standards and hot-socketing support.
• Clocking & PLLs – Multiple primary clocks and up to two analog PLLs (fractional-n frequency synthesis) for flexible on-chip clock generation and high-speed I/O timing.
• Low Power – Family-level ultra low power architecture with standby modes and very low standby power (series data indicates standby power as low as 22 μW).
• Embedded System Functions – Hardened SPI and I2C controllers, timer/counter, on-chip oscillator and IEEE 1149.1 boundary-scan for system-level integration and testability.
• Package & Temperature – 256‑LBGA (supplier package: 256‑FTBGA, 17×17 mm) surface-mount package; industrial operating temperature range −40°C to 100°C; single-supply operation with VCC range 1.14 V to 1.26 V.
• Reconfiguration & Security – Instant-on architecture, TransFR in-field reconfiguration and support for JTAG, SPI and I2C programming interfaces for secure, flexible updates.

Typical Applications

• Interface Bridging and Protocol Conversion – Use the programmable fabric and 206 I/Os to implement custom translators or bridge logic between legacy and modern interfaces.
• System Control and Management – Embed control logic, timers and on-chip peripherals for board-level control, boot sequencing and supervisory functions.
• Display and High-Speed I/O – Pre-engineered source synchronous I/O, DDR support and gearing for display interfaces enable timing-critical I/O tasks.
• Non-Volatile Logic Functions – On-chip user flash enables single-chip, instant-on implementations for finite state machines, soft-processor PROM or configuration storage.

Unique Advantages

• Highly Integrated Solution: Combines logic fabric, embedded RAM and on-chip user flash to reduce BOM and simplify board-level design.
• Broad I/O Flexibility: 206 programmable I/Os with differential termination and multiple supported signaling options provide adaptability across interfaces.
• Low-Power Operation: Designed for ultra low standby power and multiple power-saving modes to support energy-efficient systems.
• Instant-On, Reconfigurable: Non-volatile configuration and TransFR capability enable in-field updates and quick system startup.
• Industrial Reliability: Specified operating range from −40°C to 100°C and surface-mount 256-LBGA packaging for industrial applications.
• On-Board System Peripherals: Integrated SPI, I2C, timers and oscillator reduce the need for external components and speed system integration.

Why Choose LCMXO2-7000ZE-1FTG256I?

The LCMXO2-7000ZE-1FTG256I positions itself as a compact, low-power, and highly configurable FPGA option within the MachXO2 family. Its combination of 6,864 logic elements, substantial embedded RAM, on-chip user flash and flexible I/O makes it suitable for designs that require reconfigurable logic, instant-on behavior and robust I/O handling in an industrial temperature range.

Designers building control, interface or I/O-intensive systems will find the device’s integrated peripherals, programmable clocking and reconfiguration capabilities useful for reducing external components and accelerating time-to-market while providing a scalable platform for future updates.

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