LCMXO2-7000ZE-1BG332I

The LCMXO2-7000ZE-1BG332I is a MachXO2 family Field Programmable Gate Array (FPGA) offered in a 332‑ball BGA package. It integrates 6,864 logic elements with extensive on‑chip embedded RAM and user flash to address control, glue‑logic and interface tasks in industrial systems.

Designed for low‑power, reconfigurable system functions, the device targets applications that require flexible I/O, embedded memory, and in-field reconfiguration while operating across an extended industrial temperature range and a 1.14 V to 1.26 V core supply window.

Key Features

• Logic Capacity — 6,864 logic elements (cells) suitable for mid-density glue logic, control and interface functions.
• Embedded Memory — Approximately 240 kbits of embedded block RAM (total RAM bits: 245,760) plus up to 256 kbits of on‑chip user flash memory (UFM) for non‑volatile storage and configuration.
• I/O and Interface Flexibility — 278 I/Os with programmable sysIO buffer support for multiple standards; on‑chip differential termination and programmable pull modes simplify multi‑standard designs.
• Pre‑Engineered Source‑Synchronous I/O — DDR registers in I/O cells, dedicated gearing logic and dedicated DDR/DDR2/LPDDR memory support including DQS for memory interfaces and high‑speed I/O.
• Clocking and PLLs — Multiple primary clocks and up to two analog PLLs with fractional‑n synthesis to support a wide input frequency range for flexible clock generation.
• Non‑Volatile, Reconfigurable — On‑chip user flash supports background programming, instant‑on behavior and TransFR in‑field reconfiguration for updating logic while the system operates.
• Low Power — Family-level low‑power design with advanced process and standby power as low as 22 μW (datasheet family figure) for energy‑sensitive applications.
• Packaging and Mounting — Surface mount 332‑FBGA package; supplier device package listed as 332‑CABGA (17 × 17 mm) for compact board integration.
• Industrial Operating Range — Rated for industrial use with an operating temperature range of −40°C to 100°C and RoHS compliance.

Typical Applications

• Industrial Control — Implement motor control logic, sensor aggregation and deterministic glue‑logic while meeting industrial temperature and power requirements.
• Memory and Display Interfaces — Use built‑in DDR/DDR2/LPDDR support, DQS handling and display gearing for interfacing with external memories and display pipelines.
• System Glue and Peripheral Bridging — Replace discrete logic and microcontroller peripheral glue with flexible FPGA logic and programmable I/Os to reduce BOM and simplify boards.
• Field Upgradeable Systems — On‑chip user flash and TransFR reconfiguration enable in‑field logic updates and secure boot/dual‑boot configurations.

Unique Advantages

• Highly Integrated Solution: Combines 6,864 logic elements with approximately 240 kbits of embedded RAM and up to 256 kbits of user flash to consolidate functions on a single device.
• Extensive I/O Flexibility: 278 I/Os and programmable sysIO buffers support a broad set of interface standards and differential signaling for versatile board designs.
• Field Reconfiguration: On‑chip non‑volatile memory and TransFR allow safe, in‑system logic updates without removing the device from the system.
• Low Standby Power: Family‑level low power characteristics (standby figures available in datasheet) help reduce system idle consumption.
• Industrial Ready: Industrial temperature rating (−40°C to 100°C) and RoHS compliance support deployment in harsh ambient environments.
• Compact Package: 332‑ball BGA (supplier: 332‑CABGA, 17 × 17 mm) provides high I/O density in a compact footprint for space‑constrained designs.

Why Choose LCMXO2-7000ZE-1BG332I?

The LCMXO2-7000ZE-1BG332I positions itself as a versatile, mid‑density FPGA option for designers needing a balance of logic capacity, embedded memory and flexible I/O in an industrial temperature‑rated package. Its on‑chip non‑volatile user flash, reconfiguration capabilities and dedicated I/O features make it well suited for control, interface and upgradeable system tasks where reducing board complexity and maintaining configurability are priorities.

Engineers and procurement teams looking for a compact, low‑power FPGA with broad interface support and the ability to perform in industrial environments will find the LCMXO2-7000ZE-1BG332I a practical choice backed by documented family features and specifications.

Request a quote or submit an inquiry to evaluate the LCMXO2-7000ZE-1BG332I for your next design. Our team can provide pricing, availability and support information to help you move from prototyping to production.