LCMXO2-7000ZE-1BG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA |
|---|---|
| Quantity | 283 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO2-7000ZE-1BG256I – MachXO2 FPGA, 6,864 Logic Elements, 206 I/Os, 256-LFBGA
The LCMXO2-7000ZE-1BG256I is a MachXO2 family field programmable gate array (FPGA) IC delivering a flexible low-power logic fabric with 6,864 logic elements and 206 general-purpose I/Os. Designed for industrial-grade applications, it combines on-chip embedded memory, programmable I/O flexibility and non-volatile configuration to enable instant-on, reconfigurable system functions.
This device targets system control, interface bridging, and high-density I/O applications where low standby power, on-chip flash and robust packaging are important design considerations.
Key Features
- Logic Core 6,864 logic elements provide a flexible LUT4-based architecture for implementing glue logic, state machines and control functions.
- Embedded and Distributed Memory Total on-chip RAM of 245,760 bits (approximately 240 kbits) plus support for distributed RAM and dedicated FIFO control logic for buffering and data staging.
- On-Chip User Flash Memory Non-volatile user Flash is available (family-level support up to 256 kbits) for configuration and single-chip, infinitely reconfigurable designs with background programming options.
- High-Performance I/O 206 I/Os with programmable sysIO buffer support a wide range of standards and include features such as programmable differential termination and DDR register support in I/O cells.
- Clocking and PLLs Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs for fractional-n frequency synthesis and wide input frequency support.
- Low Power Operation Built on an advanced 65 nm low-power process with standby power as low as 22 μW and multiple power-saving modes.
- System and Peripherals Hardened on-chip functions include SPI, I²C and timer/counter blocks, an on-chip oscillator and IEEE 1149.1 boundary-scan support for system-level integration and debug.
- Package and Environmental Offered in a 256-ball LFBGA package (supplier device package listed as 256-CABGA, 14×14 mm), surface-mount mounting; RoHS compliant and industrial temperature range of −40 °C to 100 °C.
Typical Applications
- Industrial Control Implement machine control logic, communication bridging and sensor interfacing where industrial temperature range and robust packaging are required.
- Display and Video I/O Use pre-engineered source-synchronous I/O with gearing and DDR support for display interfaces and panel timing control.
- Memory Interface and Buffering Employ dedicated DDR/DDR2/LPDDR support and embedded FIFO control logic for memory buffering and data path staging.
- Glue Logic and System Integration Replace multiple discrete devices with a single programmable device for protocol translation, bus bridging and custom peripheral control.
Unique Advantages
- Highly integrated solution: Consolidates logic, embedded RAM and non-volatile user Flash on a single chip to reduce BOM and board complexity.
- Low standby power: Advanced low-power process and standby modes minimize power consumption for always-on or battery-assisted systems.
- Flexible I/O and memory support: Large I/O count and on-chip RAM/FIFO make the device suitable for high-density interface and buffering tasks.
- Instant-on, reconfigurable operation: Non-volatile configuration enables fast power-up and in-field logic updates without external configuration flash as part of the MachXO2 family features.
- Industrial-grade reliability: Industrial temperature rating and RoHS compliance support deployment in harsh-environment systems.
Why Choose LCMXO2-7000ZE-1BG256I?
The LCMXO2-7000ZE-1BG256I positions itself as a compact, non-volatile FPGA option for designs that require significant logic capacity (6,864 logic elements), a large I/O count (206 pins) and substantial on-chip RAM for buffering and state storage. Its combination of low standby power, flexible clocking and hardened peripheral blocks makes it well suited for industrial and system-integration tasks where board-level consolidation and fast power-up are priorities.
Choosing this MachXO2 device helps streamline designs that need reprogrammable logic with non-volatile storage, flexible I/O standards and rugged thermal range, while retaining options for in-field updates and system-level traceability features described in the MachXO2 family documentation.
Request a quote or contact sales to discuss pricing, availability and how LCMXO2-7000ZE-1BG256I can meet your project requirements.

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