LCMXO2-7000ZE-1FG484I

The LCMXO2-7000ZE-1FG484I is a MachXO2 family Field Programmable Gate Array (FPGA) IC offering 6,864 logic elements and up to 334 general-purpose I/Os in a 484-ball BGA package. Designed for industrial applications, the device combines a flexible logic architecture with embedded memory and on-chip non-volatile configuration to support a wide range of control, interface and system-integration tasks.

Key value propositions include a compact 484-BBGA footprint, industrial temperature rating, and low-voltage single-supply operation, enabling robust integration into space-constrained and temperature-demanding designs.

Key Features

• Logic Capacity — 6,864 logic elements for implementing glue logic, protocol conversion, and custom control functions within a single device.
• I/O Density — 334 available I/Os to support high pin-count interfacing and complex board-level connectivity requirements.
• Embedded Memory — Approximately 240 kbits of on-chip RAM (245,760 bits) for FIFO, buffering and small data storage needs.
• Non-volatile Configuration — MachXO2 family features include on-chip user flash memory options for instant-on operation and in-field reconfiguration.
• Power and Supply — Single-core voltage supply range of 1.14 V to 1.26 V, supporting low-voltage system architectures.
• Package & Mounting — 484-ball BGA package (supplier device package: 484-FBGA, 23×23 mm) with surface-mount mounting for compact board layouts.
• Operating Range — Industrial-grade operation from −40 °C to 100 °C for reliable performance in challenging environments.
• Standards & Compliance — RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• Interface Bridging and Protocol Conversion — High I/O count and flexible logic resources enable implementation of bus translators, bridge logic and protocol adaptation between subsystems.
• Control and Glue Logic — Compact logic capacity and on-chip memory support board-level control, timing and sequencing for embedded systems.
• Memory and Display Interfaces — Embedded RAM and high I/O density make the device suitable for buffering and source-synchronous interfaces used in display and memory subsystems.

Unique Advantages

• High I/O Count in a Compact Package: 334 I/Os in a 484-ball BGA enable dense connectivity without resorting to larger packages.
• Ready for Industrial Environments: Rated for −40 °C to 100 °C operation, suitable for designs requiring extended temperature performance.
• Integrated On-Chip Memory: Approximately 240 kbits of embedded RAM reduces external memory needs for many buffering and control functions.
• Low-Voltage Core: 1.14 V to 1.26 V supply supports integration into modern low-voltage designs and helps minimize power consumption.
• Non-volatile Configuration: On-chip flash-based configuration provides instant-on capability and field reconfigurability for flexible product updates.
• RoHS Compliant: Meets lead-free and hazardous substance restrictions for regulatory compliance in many markets.

Why Choose LCMXO2-7000ZE-1FG484I?

The LCMXO2-7000ZE-1FG484I positions itself as a highly adaptable FPGA for industrial embedded designs that require a balance of logic capacity, high I/O density, and on-chip memory in a compact BGA package. Its single low-voltage core, non-volatile configuration and industrial temperature rating make it suitable for control, interface and system integration roles where board space and reliability are priorities.

Engineers seeking a scalable, reconfigurable device with strong system-level features and environmental compliance will find this MachXO2 device appropriate for designs that demand durable operation and flexible in-field updates.

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