LCMXO2-7000ZE-1TG144I

The LCMXO2-7000ZE-1TG144I is a MachXO2 field programmable gate array (FPGA) packaged in a 144-LQFP surface-mount case. It delivers 6,864 logic elements, approximately 240 kbits of embedded RAM, and 114 I/Os in an industrial-grade device designed for flexible system integration.

Built for applications requiring low standby power, versatile I/O and on-chip non-volatile configuration, this device targets system control, interface bridging and glue-logic roles where integration, low power and temperature robustness matter.

Key Features

• Logic Capacity — 6,864 logic elements provide a mid-range programmable fabric suitable for glue logic, control functions and moderate-density custom logic implementations.
• On-chip Embedded Memory — Total RAM of 245,760 bits (approximately 240 kbits) of sysMEM embedded block RAM plus distributed RAM options for FIFO and buffering needs.
• User Flash Memory (UFM) — On-chip user flash memory available up to 256 kbits for non-volatile configuration storage and in-field updates.
• I/O Flexibility — 114 I/Os with programmable sysIO buffer support for a wide range of interfaces including LVCMOS, LVTTL, LVDS and differential I/O standards described in the MachXO2 family data.
• Low Power — Advanced low-power process with standby modes and ultra-low standby-power options as documented for the MachXO2 family.
• Clocking and PLLs — Multiple primary clocks and up to two analog PLLs per device in the MachXO2 family allow flexible clocking and fractional‑N frequency synthesis for timing-critical applications.
• System-Level Integration — Hardened on-chip functions including SPI, I2C and timer/counter, plus an on-chip oscillator and support for background programming of non-volatile memory.
• Package and Mounting — 144-LQFP (20 × 20 mm) surface-mount package; supplier device package noted as 144-TQFP (20×20).
• Operating Range — Industrial temperature grade with an operating range of −40 °C to 100 °C and a supply voltage range of 1.14 V to 1.26 V.
• Environmental Compliance — RoHS compliant.

Typical Applications

• System Glue Logic — Implement interface translation, protocol bridging and custom control logic while reducing BOM and board complexity.
• Interface and Memory Support — Pre‑engineered source-synchronous I/O and DDR/DDRx support in the MachXO2 family make the device suitable for display gearing and memory interface control.
• Embedded System Management — Use on-chip SPI, I2C, timers and UFM for configuration management, system monitoring and secure instant-on behavior.
• Industrial Control — Industrial temperature grade and flexible I/O support sensor interfacing, motor control logic and fieldbus bridging in demanding environments.

Unique Advantages

• Highly Integrated Mid‑Density FPGA: 6,864 logic elements and significant embedded RAM provide a compact platform for moderate complexity designs without external logic.
• On‑Chip Non‑Volatile Memory: Up to 256 kbits of user flash memory enables single-chip, reconfigurable solutions with support for background programming and dual-boot options.
• Flexible I/O and Clocking: Broad programmable I/O standards and multiple clocks/PLLs support diverse interface requirements and timing architectures.
• Low Power Standby: Advanced low-power process and standby modes reduce system idle power consumption, useful for energy-conscious designs.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet environmental demands in industrial applications.
• Reduced System Complexity: Hardened peripherals (SPI, I2C, timers) and on-chip oscillator lower external component count and simplify BOM.

Why Choose LCMXO2-7000ZE-1TG144I?

The LCMXO2-7000ZE-1TG144I positions itself as a versatile, industrial-grade FPGA option for designs that require mid-level logic density, substantial embedded memory and flexible I/O in a compact 144-LQFP package. Its on-chip user flash, system-level peripherals and low-power modes make it well suited for system control, interface bridging and embedded management tasks.

For teams seeking a single-chip, reconfigurable building block that balances integration, power efficiency and temperature robustness, this MachXO2 device offers a practical platform with the memory, I/O count and logic capacity to support scalable designs and long-term maintainability.

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