LCMXO2-7000ZE-2BG256C

The LCMXO2-7000ZE-2BG256C is a MachXO2 field programmable gate array (FPGA) designed for flexible system-level control and interface integration. It combines a dense logic fabric of 6,864 logic elements with extensive I/O capability (206 I/Os) and embedded memory to address glue logic, protocol bridging, and in-field reconfiguration needs in commercial applications.

Built on the MachXO2 architecture, this device emphasizes reconfigurability, low-power operation, and on-chip nonvolatile storage, making it suitable for designs that require instant-on behavior, background programming, and a wide range of programmable I/O standards.

Key Features

• Logic Density  6,864 logic elements provide capacity for complex glue logic, state machines, and control functions.
• Embedded and Distributed Memory  Total RAM bits: 245,760 (approximately 240 kbits of embedded block RAM). The MachXO2 family also supports up to 54 kbits of distributed RAM for small data buffers and FIFOs.
• On-Chip User Flash (UFM)  Up to 256 kbits of non-volatile user flash memory with 100,000 write cycles, usable for configuration storage, soft-processor PROM, or data logging.
• Programmable I/O and High I/O Count  206 I/Os with programmable sysIO buffers supporting a broad range of standards and differential signaling options; features include on-chip differential termination and hot-socketing support.
• High-Speed I/O and DDR Support  Pre-engineered source-synchronous I/O with DDR registers in I/O cells, gearing for display I/Os, and support for generic DDR and dedicated DDR/DDR2/LPDDR memory interfaces.
• Flexible Clocking  Up to two analog PLLs with fractional-N frequency synthesis and multiple primary clocks to support varied timing domains.
• Low Power and Instant-On  MachXO2 family features low-power architecture and instant-on capability with fast power-up; single power-supply operation within a supplied voltage range of 1.14 V to 1.26 V.
• Reconfiguration and System Functions  In-field TransFR reconfiguration for logic updates while the system operates, plus on-chip oscillator, SPI and I²C controllers, timers/counters, and a unique TraceID for system tracking.
• Package and Commercial Grade  256-LFBGA (256-CABGA, 14 × 14 mm) package with a commercial operating temperature range of 0 °C to 85 °C. RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic  Use the device to implement protocol conversion, level translation, and system glue across disparate subsystems thanks to its programmable sysIO buffers and broad I/O standard support.
• Memory and Display Interfaces  Leverage DDR-friendly I/O cells and dedicated gearing logic for display interfaces or memory buffering where source-synchronous transfers and DDR timing are required.
• Configuration and System Control  On-chip user flash (UFM), timers, I²C/SPI controllers, and instant-on operation make the device well-suited for platform management, boot control, and system supervision tasks.
• Field-Updatable Logic  TransFR reconfiguration enables in-field logic updates and feature rollouts without taking the entire system offline, useful for long-lived commercial products.

Unique Advantages

• Highly Configurable I/O:  206 I/Os with programmable buffers and differential options reduce the need for external transceivers and simplify board-level design.
• Non-Volatile, Reconfigurable Storage:  Up to 256 kbits of on-chip user flash enables secure, single-chip configuration and background programming for safe updates.
• Instant-On and Low-Power Operation:  MachXO2 architecture supports fast power-up and low standby power modes, helping meet power-sensitive commercial application needs.
• Integrated Timing and PLLs:  Multiple primary clocks and up to two analog PLLs with fractional synthesis provide flexible clock management for complex timing domains.
• High Logic Capacity in Compact Package:  6,864 logic elements in a 256-LFBGA package provide substantial integration while conserving PCB footprint.
• Commercial Temperature and RoHS Compliance:  Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose LCMXO2-7000ZE-2BG256C?

The LCMXO2-7000ZE-2BG256C combines robust logic capacity, extensive I/O, and nonvolatile on-chip storage in a compact, commercial-grade package. Its mix of embedded block RAM, distributed RAM capability, and flexible I/O standards make it a practical choice for designs requiring reliable interface management, in-field updates, and platform control without added external components.

This device is suited to engineers and teams developing commercial embedded systems who need scalable logic, immediate boot behavior, and on-board configuration storage—backed by MachXO2 family features such as TransFR reconfiguration, programmable PLLs, and a comprehensive set of system-level peripherals.

Request a quote or submit a design inquiry to get pricing and availability for the LCMXO2-7000ZE-2BG256C.