LCMXO2-7000ZE-2BG332C

The LCMXO2-7000ZE-2BG332C is a MachXO2 family field programmable gate array (FPGA) IC designed for commercial applications that need low-power, non-volatile, reconfigurable logic. Built on the MachXO2 architecture, this device integrates 6,864 logic elements, extensive I/O and embedded memory to support interface bridging, system glue logic, and on-chip control functions.

With an emphasis on ultra-low power operation, embedded flash configuration, and flexible high-performance I/O options, this 332-ball caBGA package provides a compact platform for designs requiring instant-on reconfigurability and a broad range of serial and parallel interfaces.

Key Features

• Logic Capacity — 6,864 logic elements suitable for mid-density glue logic, protocol bridging and control plane functions.
• Embedded Memory — Approximately 240 kbits of embedded block RAM and up to 54 kbits distributed RAM to support FIFOs, buffering and small on-chip data stores.
• On-Chip User Flash — User-configurable non-volatile flash memory (up to 256 kbits per family datasheet) for instant-on configuration and in-field updates.
• I/O Density & Flexibility — 278 user I/Os with programmable sysIO buffers supporting a wide range of interfaces and on-chip differential termination options.
• Pre-Engineered Source-Synchronous I/O — DDR registers in I/O cells, dedicated gearing logic, and support for generic DDR, DDRX2, DDRX4 and dedicated DDR/DDR2/LPDDR with DQS support.
• Clocking & PLLs — Eight primary clocks and up to two analog PLLs (fractional‑N supported) for flexible clock generation and timing management.
• Low Power — Advanced 65 nm low-power process with standby power as low as 22 μW (family datasheet), plus power-saving modes and programmable I/O swing.
• Reconfiguration & Security — TransFR in-field reconfiguration, instant-on behavior, background programming, multiple configuration interfaces (JTAG, SPI, I2C) and optional dual-boot with external SPI memory.
• Package & Supply — 332-FBGA (332-CABGA, 17 × 17 mm) surface-mount package; single supply range of 1.14 V to 1.26 V for core operation.
• Commercial Grade — Rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic — Use the high I/O count and flexible sysIO buffers to implement protocol conversion, bus bridging and system interconnect tasks.
• Memory and Display Interfaces — Pre-engineered DDR/DDR2/LPDDR support with DQS and dedicated gearing logic for memory PHY control and high-speed display I/O paths.
• Embedded Control and Configuration — On-chip flash memory and instant-on capability make the device suitable for control plane functions, boot-time configuration and in-field firmware updates.
• Low-Power Always-On Functions — Ultra-low standby power and power-saving modes enable always-on supervisory and monitoring functions in commercial products.

Unique Advantages

• High Logic Density in a Compact Package: 6,864 logic elements in a 17 × 17 mm 332-ball caBGA reduce board area while supporting complex glue logic and control functions.
• Extensive I/O Flexibility: 278 programmable I/Os with broad interface support let designers consolidate multiple interface chips into a single FPGA.
• Non-Volatile, Reconfigurable Design: On-chip user flash provides secure, instant-on configuration with support for background programming and TransFR in-field updates.
• Built for Low-Power Systems: Advanced 65 nm low-power process and micro-watt standby characteristics help minimize power budgets for always-on or energy-sensitive designs.
• Integrated Clocking and Memory Support: Multiple clocks, PLLs and substantial embedded RAM simplify timing architectures and on-chip buffering for high-speed data paths.
• Commercial Temperature and Compliance: RoHS-compliant commercial-grade device with a 0 °C to 85 °C operating range for general-purpose electronics.

Why Choose LCMXO2-7000ZE-2BG332C?

The LCMXO2-7000ZE-2BG332C positions itself as a mid-density, low-power MachXO2 FPGA that combines substantial logic capacity, extensive I/O and embedded non-volatile memory in a compact 332-FBGA package. It is well suited to designers who need reconfigurable glue logic, memory and display interface support, and low standby power for commercial applications.

With programmable I/O, on-chip flash configuration, pre-engineered source-synchronous I/O and integrated clocking resources, the device provides a scalable platform for reducing BOM complexity, speeding development and enabling field updates over the product lifecycle.

Request a quote or contact sales to discuss pricing, lead times and how the LCMXO2-7000ZE-2BG332C can fit into your next design.